Interfacial reaction during fabricating of full Cu3Sn joints in microelectronic packaging

Two copper substrates electroplated with Sn, both consisted of Cu/Sn?+?Sn/Cu structures, but they were bonded over different times in order to investigate the interfacial reaction. The growth morphologies of Cu₆Sn₅ and Cu₃Sn were analysed, respectively. The growth mechanisms for Cu₆Sn₅ and Cu₃Sn were investigated. The results show that the growth of Cu₆Sn₅ is primarily controlled by grain boundary-diffusion. However, the growth Cu₃Sn is controlled by the reaction of Cu-Cu₆Sn₅ at the beginning of the reaction, and then controlled by volume-diffusion as the thickness of the Cu₃Sn layer increases.     

The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy

The present study investigates the influence of Cu and Al on microstructure and wear behavior of a eutectic Sn-9Zn solder alloy. The Sn-9Zn–X alloy was produced by adding various amounts of Cu and Al through investment casting method. The produced Sn-9Zn–X alloys were characterized by a scanning electron microscope, X-ray diffraction, and hardness measurements. In wear tests at 1 ms^?1 sliding speed, 10 N load and 5 different sliding distances (400–2000 m) were used. The results show that as the amount of Cu and Al increased within Sn-9Zn alloy, the hardness of the alloy increased as well. Depending on the increase in hardness of the alloys produced by investment casting, it was observed that weight loss decreased during wear tests. Furthermore, the same proportion of added Al alloys’ hardness and weight loss were observed to be higher than the added Cu alloys. Furthermore, the Cu-added alloy exhibited higher hardness and lower weight loss than the Al-added alloy did.     

圆片级低温富锡金锡键合

Sn-rich Au–Sn solder bonding has been systematically investigated for low cost and low temperature wafer-level packaging of high-end MEMS devices.The AuSn2 phase with the highest Vickers-hardness among the four stable intermetallic compounds of the Au–Sn system makes a major contribution to the high bonding shear strength.The maximum shear strength of 64 MPa and a leak rate lower than 4.9×10-7 atm·cc/s have been obtained for Au46Sn54 solder bonded at 310 ℃.This wafer-level low cost bonding technique with high bonding strength can be applied to MEMS devices requiring low temperature packaging.     

Static structure and dynamic properties in liquid Sn96.2 Ag3.8 lead free solder: Structure factor,diffusion coefficients and viscosity

Starting from the pseudopotential formalism, we developed a new pseudopotential able to describe accurately both heavy metals like tin and noble metals like copper and silver which are the basic elements of the new lead free solders. The pseudopotential describes the interaction between electrons and ions. To describe the atomic structure it is necessary to use an effective pair potential describing the interaction between ions taking into account the electron screening cloud. This pair potential is deduced from our new pseudopotential. It enters into a simulation program using molecular dynamics. First we calculate the atomic structure factor that has been compared to that measured experimentally by neutron or X ray scattering. In the case of a binary alloy, we determined three partial structure factors describing the system. These can be calculated but in general cannot be obtained experimentally. To do a comparison we must combine adequately the calculated partial structure factors and compare it to the experimental total structure factor. By molecular dynamics we can follow the individual movement of particles to obtain the different diffusion coefficients which, as partial structure factors, are very difficult to measure accurately. We followed the collective movement of all particles and got the shear viscosity by Green–Kubo formalism. We compared our results to the existing experimental viscosity which is a little easier to measure. However, in the bibliography, we observe high discrepancies between the different authors. It is thus important to be able to calculate accurately these properties as functions of temperature and composition.     

Ultrasonic-assisted wetting and soldering of AlN ceramic by using a nonactive solder (Sn9Zn) in air

AlN ceramic was successfully wetted and then joined with nonactive Sn9Zn eutectic solder assisted by ultrasonication in air. The effect of ultrasonic time on the formation of joint was studied. Results indicated that the defect-free joint can be obtained at an ultrasonic time of 5 s. Two regions, namely, AlN/Sn (s,_s) and AlN/Zn (s,_s), were found in the bonding interface. Zn and O accumulated in the AlN/Sn (s,_s) interface. An amorphous and nanocrystalline layer of ZnO formed in the hard-wet AlN surface. And Zn (s,_s) directly bonded with AlN. The low temperature and fast bonding of the AlN was attributed to the high pressure and temperature caused by cavitation effect. The shear strength of the joint increased from 10.6 MPa to 30.7 MPa when the ultrasonic treatment time increased from 5 s to 150 s. With the prolongation of ultrasonic time, more AlN ceramic particles entered the solder and acted as the reinforcing phase.     

Microstructure evolution and interfacial bonding mechanisms of ultrasonically soldered sapphire/Al dissimilar joints using Sn-based solders

Sapphire and 5A06 Al were ultrasonically soldered with Sn9Zn, SAC305 alloy solders and NiCu alloy foam added Sn-based composite solders, respectively. The microstructure and mechanical properties of joints were investigated and the interfacial bonding mechanism was analyzed. Cracks were observed at the sapphire/Sn matrix interface in joints soldered with alloy solders, which were disappeared in the joints soldered with composite solders. In the joint using NiCu–Sn9Zn composite solder, the solder seam was uneven and Al₃Ni intermetallic compound (IMC) layer was formed on the surface of NiCu alloy skeletons. While in the joint using NiCu-SAC305 composite solder, fine particles of (Ni,Zn)₃Sn₄ were largely formed and homogeneously distributed in the solder seam. An amorphous Al₂O₃ transition layer was formed at the sapphire/Sn matrix interface, and Zn enrichment was found at the Sn matrix/amorphous Al₂O₃ interface. The action mechanism of Zn was analyzed by first-principles calculation. The joints soldered with NiCu-SAC305 composite solder exhibited the highest shear strength of 74.42 MPa, the shearing failure mainly happened in the soldering seam.     

Brazing of beryllium with aluminium brazing alloys

It is shown that the activation of the surface of beryllium components with titanium results in efficient wetting with aluminium brazing alloys. The experimental results show that the application of aluminium brazing alloys, alloyed with titanium, produces high-quality butt and lap brazed joints with the tensile strength of up to 150 MPa.     

钛酸钡添加量对埋容用环氧-钛酸钡-玻璃布板材性能的影响

采用热固化层压方法制备了环氧-钛酸钡-玻璃布(EBG)板材,并分析钛酸钡(BTO)添加量对埋容用EBG板材各项性能的影响。结果表明:随着BTO填料添加量的增大,EBG板材的实际密度先接近后偏离理论密度,孔隙率先减小后增大,耐浸焊时间、剥离强度先增大后减小,5%热分解温度和介电常数增大;当BTO的质量分数为80%左右时,埋容用EBG板材具有较好的综合性能;EBG板材为一种混联模型。     

„Ideale“ Lötverbindung und „optimale“ Lötverbindung

If due to the market analysis a company makes the decision for the production of a new product by application of soldering and special the soldering with temporarily liquid solder, this one is then made specifically after that the company specific construction and production preparation. Either the decision for soldering is technically and/or economically well‐founded or she is even unavoidable by so‐called mixed material connections in the assemblies. This hybrid design finds application increasing today. In the contribution on hand the analysis and assessment of the soldering theory and practice is carried out under the point of view of the possible production of “ideal soldered connections” and “optimal soldered connections”.