基于正交设计的WLCSP柔性无铅焊点随机激励应力应变分析

对晶圆级芯片尺寸封装(wafer level chip scale package, WLCSP)柔性无铅焊点进行了随机振动应力应变有限元分析. 以1号柔性层厚度、2号柔性层厚度、上焊盘直径和下焊盘直径四个结构参数作为关键因素,采用正交表设计了16种不同结构参数组合的柔性焊点,获取了16组应力数据并进行了方差分析. 结果表明:焊点内最大应力应变随1号柔性层厚度和2号柔性层厚度的增加而减小;在置信度99%时,下焊盘直径和上焊盘直径对应力具有高度显著影响,在置信度95%时1号柔性层厚度和2号柔性层厚度对应力具有显著影响;各因素对应力影响排序为:下焊盘直径影响最大,其次是上焊盘直径,再次是1号柔性层厚度,最后是2号柔性层厚度.     

Brazing of absorbers of planar solar heating collectors produced from materials of the Cu–CuZn system

The technology of brazing the absorber of planar solar heating collectors, consisting of a ray-receiving panel, produced from copper sheets with a composite selective coating and a tubular part, produced from L63 brass, is examined. The design of the absorber developed by the authors is described. The requirements on brazing technology to preserve the selective multilayer coating during heating of the Sun ray collector panel are determined. The experimental results are used for selecting the brazing alloys, fluxes and temperature–time parameters used in the development of the industrial technology of brazing the Sun ray collector panel of the absorber.     

RE及Ni对Zn20Sn高温无铅钎料显微组织及性能的影响

在Zn20Sn高温无铅钎料合金中添加0.1%RE及0.2%~0.8%Ni(质量分数,下同),研究了RE及Ni对钎料合金显微组织及性能的影响。结果表明,在Zn20Sn中同时添加0.1%RE及0.2%~0.8%Ni后,钎料合金的固相线变化不大,而液相线温度降低;RE及Ni对钎料合金的润湿性能及显微硬度有明显的影响,当RE为0.1%、Ni为0.4%时,钎料合金的润湿性能最好、显微硬度最高;随着RE及Ni的添加,在钎料合金中形成了含Ni金属间化合物,且随着Ni含量的提高,金属间化合物的形状、钎料合金的组织结构发生显著变化。     

合金元素Ga对Sn-9Zn无铅钎料性能的影响

研究了合金元素Ga的添加量对Sn-9Zn无铅钎料熔化特性、润湿性能及其焊点力学性能的影响.结果表明,添加合金元素Ga以后,合金的熔点显著降低,熔化温度区间有所增大,润湿性能得到明显改善;合金元素Ga的添加量(质量分数)在0.5%时,钎料的晶粒组织最为细小均匀,钎料焊点的力学性能最佳;当合金元素Ga的添加量大于1%时,钎料的润湿性能趋于稳定,钎料组织中晶界处出现黑色富Ga相,钎料焊点的力学性能大幅度降低.因此,Sn-9Zn无铅钎料中合金元素Ga的最佳添加量为0.5%.     

硼氢化钠-氢还原重量法测定难溶解钌-硼焊料中的钌

建立了硼氢化钠-氢还原重量法测定难溶解钌-硼焊料中高量钌的方法,研究了测定钌的条件,比较了试样的玻璃封管酸溶解法与碱熔融法和钌的硼氢化钠-氢还原重量法与蒸馏-硫脲显色分光光度法.结果表明:玻璃封管酸溶解法较碱熔融法费时且操作繁琐,但钌的测定体系单纯;硼氢化钠-氢还原重量法较蒸馏-硫脲显色分光光法费时,但因钌的测定浓度较高,故相对误差较小.测定50～100 mg钌,相对误差-0.24%～+0.25%.方法准确度高,选择性好,实用性强,已用于钌-硼焊料中质量分数＞90%钌的测定,结果满意.     

少缺陷样本的PCB焊点智能检测方法

随着印刷电路板组装技术向高密度化和"零缺陷"方向发展,市场对自动光学检测系统的要求也向高准确率、智能化发展.而传统自动光学检测系统的检测算法不仅需要进行复杂的设置,而且需要大量不同类型的样本进行训练以提高系统的泛化性能,但在电路板组装过程中,有缺陷的样本难以获得.针对此类问题,提出了一种适应少缺陷样本的智能检测方法.首先对焊点图像的一系列特征进行了提取;然后介绍了一种基于统计方法的自动阈值设置方法;最后建立了用于进行焊点分类的BP神经网络.结果表明,方法具有较高的准确率.     

Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders

SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner's law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pastes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.     

Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应

采用直径范围为200—600μm的Sn3.0Ag0.5Cu无铅钎料球在Cu焊盘上制作热风重熔焊点,将重熔焊点在150℃下进行老化,并对重熔和老化焊点进行剪切测试.结果表明:重熔和老化后焊点的剪切强度都随体积的增大而减小,表现出显著的体积效应.SEM断面观察显示:较小体积焊点剪切断裂发生在钎料块体内部,表现出较好韧性;较大体积焊点则发生在近焊盘的界面处,呈现脆性断裂特征.焊盘界面处和钎料内部微观组织SEM观察表明:小体积焊点内部Ag_3Sn化合物以小颗粒状弥散分布,起到强化作用;而大体积焊点内部Ag_3Sn化合物为树枝网状分布,表现出硬脆性.金属间化合物(如Ag_3Sn和Cu_6Sn_5)的形貌和分布对焊点的断裂行为有显著的影响,是焊点剪切断裂行为体积效应的内在原因.     

Influence of bismuth on microstructure,thermal properties,mechanical performance,and interfacial behavior of SAC305-xBi/Cu solder joints

This research sought to improve the properties of SAC305 solder joints by the addition of 1 and 2 wt.% Bi. The effects of bismuth doping on the microstructure, thermal properties, and mechanical performance of the SAC305-xBi/Cu solder joints were investigated. Bi-doping modified the microstructure of the solder joints by refining the primary β-Sn and eutectic phases. Bi-doping below 2 wt.% dissolved in the β-Sn matrix and formed a solid solution, whereas Bi additions equal to or greater than 2 wt.% formed Bi precipitates in the β-Sn matrix. Solid solution strengthening and precipitation strengthening mechanisms in the β-Sn matrix increased the ultimate tensile strength and microhardness of the alloy from 35.7 MPa and 12.6 HV to 55.3 MPa and 20.8 HV, respectively, but elongation decreased from 24.6% to 16.1%. The fracture surface of a solder joint containing 2 wt.% Bi was typical of a brittle failure rather than a ductile failure. The interfacial layer of all solder joints comprised two parallel IMC layers: a layer of Cu₆Sn₅ and a layer of Cu₃Sn. The interfacial layer was thinner and the shear strength was greater in SAC305-xBi/Cu joints than in SAC305/Cu solder joints. Therefore, small addition of Bi refined microstructure, reduced melting temperature and improved the mechanical performance of SAC305/Cu solder joints.     

微波功率管壳用焊料浇铸模的设计与制造

介绍一种微波功率管壳用焊料的模具的设计、制造工艺、表面处理和测量方法。