硅基MEMS技术

结合MEMS技术的发展历史,概括了当今硅基MEMS加工技术的发展方向。指出表面牺牲层技术和体硅加工技术是硅基MEMS加工技术的两条发展主线;表面牺牲层技术向多层、集成化方向发展;体硅工艺主要表现为键合与深刻蚀技术的组合,追求大质量块和低应力以及三维加工。SOI技术是新一代的体硅工艺方向;标准化加工是MEMS研究的重要手段。     

超声振动铣削运动学及其对切削力的影响

为了改善微细铣削的加工条件,研究了利用超声振动辅助微细铣削对切削力的影响.基于对刀具轨迹的运动学分析,讨论了利用超声振动辅助微细铣削时实现刀具-工件分离的必要参数条件,以2A12为实验工件材料,通过超声振子带动工件沿进给方向进行超声振动,并采用多组参数进行了铣槽实验.实验结果分析表明,采用合理的切削及振动参数配比,进给方向超声振动辅助微细铣削可改变刀具-工件的相对运动方式,实现分离型断续铣削,可获得近似脉冲状切削力并有效减小切削力的均值,选择合理的振幅可明显减小进给方向切削分力峰值.     

A novel tuning fork gyroscope with high Q-factors working at atmospheric pressure

In this paper, we report the design and fabrication of a novel micromachined electro-magnetically driven tuning fork type gyroscope with bar structure proof masses working at atmospheric pressure. The applied angular rate is sensed by detecting the differential change of capacitance between the bar structure electrodes and the fixed electrodes on the glass substrate. Instead of common squeeze-film damping, slide-film damping in the gap between proof masses and glass substrate plays a dominant role, which enables it to achieve high Q-factors and thus eliminate vacuum packaging. The measured Q-factors for driving and sensing modes are 965 and 716, respectively. The sensor obtained a sensitivity of 6 mV/°/s and a non-linearity of less than 0.5%.The work is sponsored by the Major State Basic Research and Development Program Integrated Micro-Optical-Electro-Mechanical System (G1999033101).     

基于准分子激光加工技术的内嵌光纤型微流控器件的制备

为了方便、快速、低成本地检测样品,提出一种内嵌光纤型微流控芯片的制备方法.利用248 nm的KrF准分子激光在聚甲基丙烯酸甲酯(PMMA)基片上进行微加工,构建芯片结构,并嵌入腐蚀过的直径35μm的单模光纤,从而形成内嵌光纤型芯片.探讨了准分子激光加工参数以及嵌入光纤的方法.结果表明,用准分子激光加工芯片,可控性好、简便可靠、加工过程可实现无人化.内嵌光纤实现了光纤的相互对准以及光纤对流道中央的对准,可以灵敏地获取样品的光学信号.     

Investigation of RF sputtered PSG films for MEMS and semiconductor devices

In this work, we report the preparation of phospho-silicate-glass (PSG) films using RF magnetron sputtering process and its application as a sacrificial layer in surface micromachining technology. For this purpose, a 76 mm diameter target of phosphorus-doped silicon dioxide was prepared by conventional solid-state reaction route using P₂O₅ and SiO₂ powders. The PSG films were deposited in a RF (13.56 MHz) magnetron sputtering system at 200-300 W RF power, 10-20 mTorr pressure and 45 mm target-to-substrate spacing without external substrate heating. To confirm the presence of phosphorus in the deposited films, hot-probe test and sheet resistance measurements were performed on silicon wafers following deposition of PSG film and a drive-in step. As a final confirmatory test, a p-n diode was fabricated in a p-type Si wafer using the deposited film as a source of phosphorus diffusion. The phosphorus concentration in the target and the deposited film were analyzed using energy dispersive X-rays (EDAX) tool. The etch rate of the PSG film in buffered HF was measured to be about 30 times higher as compared to that of thermally grown SiO₂ films. The application of RF sputtered PSG film as sacrificial layer in surface micromachining technology has been explored. To demonstrate the compatibility with MEMS process, micro-cantilevers and micro-bridges of silicon nitride were fabricated using RF sputtered PSG as a sacrificial layer in surface micromachining. It is envisaged that the lower deposition temperature in RF sputtering (<150 °C) compared to CVD process for PSG film preparation is advantageous, particularly for making MEMS on temperature sensitive substrates.     

单片集成的高性能压阻式三轴高g加速度计的设计、制造和测试

设计、制造并测试了一种单片集成的压阻式高性能三轴高g加速度计,量程可达105g.x和y轴单元均采用一种带微梁的三梁-质量块结构,z轴单元采用三梁-双岛结构.与传统的单悬臂梁结构或者悬臂梁-质量块结构相比,这两种结构均同时具有高灵敏度和高谐振频率的优点.采用ANSYS软件进行了结构分析和优化设计.中间结构层主要制作工艺包括压阻集成工艺和双面Deep ICP刻蚀,并与玻璃衬底阳极键合和上层盖板BCB键合形成可以塑封的三层结构,从而提高加速度计的可靠性.封装以后的加速度计采用落杆方法进行测试,三轴灵敏度分别为2.28,2.36和2.52 μV/g,谐振频率分别为309,302和156 kHz.利用东菱冲击试验台,采用比较校准法测得y轴和z轴加速度计的非线性度分别为1.4%和1.8%.     

基于垂直扭转梳齿驱动结构的硅微机械扭转微镜的设计加工与表征

为了改善扭转微镜的机电耦合特性和光学特性,提出了一种新的基于SOI硅片的垂直扭转梳齿静电驱动结构．通过有限元与边界元方法,对不同厚度扭转梁的机电耦合特性进行了数值模拟,得到了相应的阈值电压和吸合电压,并提出了几种新的折叠梁结构,以进一步改善器件的机电耦合特性;通过力学分析,从理论上推导了垂直扭转梳齿静电驱动方式微镜的最大扭转角度、阈值电压、扭转刚度以及固有频率,获得了结构参数对器件机电耦合特性的影响机制;最后,利用比例散射理论讨论了表面粗糙度、入射光束波长和入射角度等参数对微镜表面光学反射性能的影响,并利用原子力显微镜测量了微镜的表面粗糙度,理论模拟与实验研究表明,基于SOI硅片和垂直扭转梳齿结构的硅微机械扭转微镜可显著降低器件的驱动电压,提高器件的机电耦合特性和微镜表面的光学反射特性．     

飞秒激光多脉冲烧蚀研究进展

由于飞秒脉冲在烧蚀固体材料时的独特机制，在材料激光微加工方面有其突出的优点，表现出极大的应用潜力。本文主要就国内外多脉冲飞秒烧蚀研究的进展作一简介，包括多脉冲烧蚀的特点，现有的烧蚀机制分析及其应用前景等。     

扑翼微飞行器紫外激光加工技术

为了实现微米尺度扑翼微飞行器的加工,运用了加工材料范围广的紫外激光切割技术,以及碳纤维预浸料的真空袋高温高压固化工艺,通过合理安排工艺流程,实现了一种适于微米尺度复杂机械结构、可采用材料广泛且可以小批量快速加工的加工技术.并将其应用于扑翼微飞行器的加工,得到了一个翼展3 cm,最小尺寸为80 μm的飞行器样机.     

某型航空发动机燃油喷嘴旋流室的微细电解加工研究

针对某型航空发动机燃油喷嘴结构尺寸微小、材料硬度较高、切削加工困难等问题,介绍了微细电解加工的原理和实验装置,制备了微细棒状工具电极和三角形钩状成形电极,利用分层电解铣削进行粗加工快速去除工件多余材料,再利用环形扫描电解铣削进行旋流室全锥面的精加工,实现了发动机喷嘴微小尺寸旋流室的微细电解加工成形,达到加工精度和表面质量要求。研究表明,微细电解铣削加工是加工金属材料微小结构的有效可行的方法。