MBE growth and properties of ZnO on sapphire and SiC substrates

Molecular beam epitaxy (MBE) of ZnO on both sapphire and SiC substrates has been demonstrated. ZnO was used as a buffer layer for the epitaxial growth of GaN. ZnO is a würtzite crystal with a close lattice match (<2% mismatch) to GaN, an energy gap of 3.3 eV at room temperature, a low predicted conduction band offset to both GaN and SiC, and high electron conductivity. ZnO is relatively soft compared to the nitride semiconductors and is expected to act as a compliant buffer layer. Inductively coupled radio frequency plasma sources were used to generate active beams of nitrogen and oxygen for MBE growth. Characterization of the oxygen plasma by optical emission spectroscopy clearly indicated significant dissociation of O₂ into atomic oxygen. Reflected high energy electron diffraction (RHEED) of the ZnO growth surface showed a two-dimensional growth. ZnO layers had n-type carrier concentration of 9 × 10¹⁸ cm⁻³ with an electron mobility of 260 cm²/V-s. Initial I-V measurements displayed ohmic behavior across the SiC/ZnO and the ZnO/GaN heterointerfaces. RHEED of GaN growth by MBE on the ZnO buffer layers also exhibited a two-dimensional growth. We have demonstrated the viability of using ZnO as a buffer layer for the MBE growth of GaN.     

退火处理对0.5PZN-0.5PZT陶瓷弛豫性的影响

采用常规陶瓷工艺制备了Pb(Zn_(1/3)Nb_(2/3))_(0.5)(Zr_(0.5)Ti_(0.5))_(0.5)O_3 (0.5PZN-0.5PZT)铁电陶瓷,并在氧气氛下进行退火.运用XRD、直流电导率和介电温度谱测试氧气氛退火前后陶瓷相结构与电性能的变化,并对弛豫性与微结构的关系进行探讨.结果表明,氧气氛退火可有效补偿体系中的氧空位,降低四方相含量,材料的弛豫性显著增强.     

Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects

Copper (titanium) [Cu(Ti)] films with low titanium (Ti) concentration were found to form thin Ti-rich barrier layers at the film/substrate interfaces after annealing, which is referred to as self-formation of the barrier layers. This Cu(Ti) alloy was one of the best candidates for interconnect materials used in next-generation ultra-large-scale integrated (ULSI) devices that require both very thin barrier layers and low-resistance interconnects. In the present paper, in order to investigate the influences of annealing ambient on resistivity and microstructure of the Cu alloys, the Cu(7.3at.%Ti) films were prepared on the SiO₂ substrates and annealed at 500°C in ultra-high vacuum (UHV) or argon (Ar) with a small amount of impurity oxygen. After annealing the film at 500°C in UHV, the resistivity was not reduced below 16 μΩ-cm. Intermetallic compounds of Cu₄Ti were observed to form in the films and believed to cause the high resistivity. However, after subsequently annealing in Ar, these compounds were found to decompose to form surface TiO _x and interfacial barrier layers, and the resistivity was reduced to 3.0 μΩ-cm. The present experiment suggested that oxygen reactive to titanium during annealing played an important role for both self-formation of the interfacial barrier layers and reduction of the interconnect resistivity.     

p型微氮直拉硅中氧施主的电学特性

研究了p型含氮以及不含氮直拉(CZ)硅中热施主(TD)以及氮氧(N-O)复合体的电学性质.硅片在350～850℃范围进行不同时间的退火后,利用四探针和通过室温傅里叶红外光谱(FTIR)分别测量其载流子浓度和间隙氧浓度的变化.实验结果表明:p型含氮直拉硅(NCZ)中热施主的电学特性基本与n型NCZ硅相同,但N-O复合体的消除温度明显低于n型NCZ硅,这是由于p型NCZ硅中硼促进了N-O复合体的消除.     

掺锗CZSi原生晶体中氧的微沉淀

利用锗硅单晶(锗浓度约为1019cm-3)切制成的籽晶和一般无位错硅单晶生长的缩细颈工艺以及从晶体头部至尾部平稳降低拉速的工艺,生长了直径为60、50和40mm,掺锗量为0.1%和0.5%(锗硅重量比)的锗硅单晶.利用化学腐蚀-金相显微镜法、扫描电子显微镜(SEM)能谱分析和X射线双晶衍射等方法观测了掺锗硅的原生晶体中缺陷及氧的沉淀的状况.发现用CZ法生长的锗硅原生晶体与常规工艺生长的CZSi晶体不同,体内存在着较高密度的氧微沉淀.在晶体尾部,由于锗的分凝使熔体中锗高度富集,出现了"组分过冷"现象,在晶粒间界应力较大处有锗的析出并出现了枝状结晶生长.晶体中高密度氧的微沉淀经过1250℃热处理1h后会溶解消失.     

Novel Diffusion‐Barrier Materials Against Oxygen for High‐Density Dynamic Random Access Memory Capacitors

A new design concept for diffusion barriers in high‐density memory capacitors is suggested, and both RuTiN (RTN) and RuTiO (RTO) films are proposed as sacrificial oxygen diffusion barriers. The newly developed RTN and RTO barriers show a much lower sheet resistance than various other barriers, including binary and ternary nitrides (reported by others), up to 800 °C, without a large increase in the resistance. For both the Pt/RTN/TiSi_x/n⁺⁺poly‐plug/n⁺ channel layer/Si and the Pt/RTO/RTN/TiSi_x/n⁺⁺poly‐plug/n⁺ channel layer/Si contact structures, contact resistance—the most important electrical parameter for the diffusion barrier in the bottom electrode structure of capacitors—was found to be as low as 5 kohm, even after annealing up to 750 °C. When the RTN film was inserted as a glue layer between the bottom Pt electrode layer and the TiN barrier film in the chemical vapor deposited (Ba,Sr)TiO₃ (CVD–BST) simple stack‐type structure, the RTN glue layer was observed to be thermally stable to temperatures 150 °C higher than that to which the TiN glue layer is stable. Moreover, the capacitance of the physical vapor deposited (PVD)–BST simple stack‐type structure adopted TiN glue layer initially degraded after annealing at 500 °C, and, thereafter, completely failed. In the case of the RTN and RTO/RTN glue layers, however, the capacitance continuously increased up to 550 °C. Thus, the new RTN and RTO films, which act as diffusion barriers to oxygen, are very promising materials for achieving high‐density capacitors.     

放电激励产生单重态氧的实验研究

对射频放电产生单重态氧进行了实验研究,在不同掺杂物种、不同电极间距、不同稀释配比的情况下,研究了单重态氧相对产率的变化规律,分析了单位氧流量注入能量对单重态氧产率和电效率的影响。实验表明,NO和Hg蒸气的加入,使放电产生单重态氧的相对产率都有显著的提高。随着电极间距的缩小,可以实现高气压工作,放电总压可以达到22.6 kPa,氧气分压超过了4.0 kPa,产率方面也有大幅度提高。单位氧流量注入能量在150~400 J/mmol时,单重态氧产率比较高;电效率较高的区域对应的单位氧流量注入能量在150 J/mmol左右。     

Electrical Conduction and Disorder in the Pyrochlore System (Gd1−xCax)2Sn2O7

Electrical conductivity measurements were made on the pyrochlore compounds (Gd₁–_xCa_x)₂Sn₂O₇ (x =0, 0.0036, 0.0057, 0.03) as a function of temperature, oxygen partial pressure and Ca doping concentration. An effective Frenkel constant and oxygen vacancy mobility were derived. Intrinsic anion disorder was found to be lower than the expected value based on the relative radii of the cations in the A and B sites (A₂B₂O₇). Low oxygen vacancy mobilities as well as low anion disorder resulted in considerably lower ionic conductivities in Gd_sSn₂O₇ relative to the previously studied Gd₂(Ti₁–_xZr_x)₂O₇ system. The temperature and composition dependence of the p-type electronic conductivity were evaluated and the oxidation enthalpy was derived.     

Transport Properties of the Mixed-Conducting SrFe1.2Co0.3Ox

Single phase SrFe_1.2Co_0.3O_x sample with layered crystal structure was prepared using a solid state reaction method. Electrical conductivity and apparent oxygen diffusion coefficients of the SrFe_1.2Co_0.3O_x sample were measured as functions of temperature in atmospheres of various oxygen partial pressures . Total and ionic conductivities were determined by using the conventional four-probe and electron blocking four-probe methods, respectively. The apparent oxygen diffusion coefficient was derived from the time-dependent conductivity relaxation data of the reequilibrium process after abruptly changing the in the surrounding atmosphere. Several atmospheres of different were established by the use of premixed gas cylinders. The conductivity of SrFe_1.2Co_0.3O_x increases with increasing temperature and . At 900°C in air, the total conductivity and ionic conductivity are 10 and 8S · cm^-2, respectively. The ionic transference number ( 0.8 in air) does not have strong temperature dependence. The activation energy increases with decreasing . In air, the activation energy has a low value of 0.37 eV. The apparent oxygen diffusion coefficient was at 950°C over a wide range of .     

Nafion 浸渍的 PEMFC 氧电极性能研究

研究了气体扩散层对聚合物电解质膜燃料电池（ＰＥＭＦＣ）膜电极性能的影响,并比较了Ｎａｆｉｏｎ浸渍和ＰＴＦＥ粘接两种电极制备工艺,分析了采用Ｎａｆｉｏｎ溶液浸渍氧电极后性能提高的原因。实验发现：气体扩散层影响膜电极性能,采用低电阻值的碳纸有利于膜电极性能的提高;采用Ｎａｆｉｏｎ溶液浸渍ＰＴＦＥ粘接的电极显著提高了电极性能,这归因于氧还原反应三维反应区的扩展。