湿敏半导体材料电导率计算方法的研究

结合修正了的耗尽层理论和多孔湿敏半导体的特点，本文提出了一个简单的物理模型作为ｎ型湿敏半导体特征的一级近似。描述了多孔湿敏半导体的导电机理，并给出了湿度与宏观电导率的关系。     

A feasibility study of a direct-mapping parallel processing method to solve linear equations in load-flow calculation

With the growing size and complexity of power systems, system analysis—such as transients calculation—takes much time. Hence, fast calculation methods are required. Although parallel processing is a hopeful method, there have been difficulties in the parallel solution of linear equations which appear in power-flow calculations by the Newton-Raphson method. This paper aims at the fast calculation of the power-flow problem by means of parallel processing. In order to improve the suitability to the parallel solution of the differential equation in transients calculation, we assume the use of a direct-mapping parallel processing machine to map directly the network of a power system onto a network of processors. Under this assumption, we propose a new parallel-processing-oriented method in which the linear equation is solved by linear iterations between nodes with Aitken acceleration. We simulate the method on three model power systems and compare this Parallel Iterative Method (PIN) with a Parallel Direct Method (PDM) which uses the banded matrix according to the number of operations required. As a result, we can expect that PIM may solve linear equations faster than PDM with m processors, although the PIM might be inferior to the PDM with m × m processors, where m denotes the half-band width of the banded matrix.     

Growth of Fe on Si (100) at room temperature and formation of iron silicide

Low-energy electron diffraction (LEED), Auger electron spectroscopy and X-ray photoelectron spectroscopy (XPS) investigations of both the growth of an iron film on silicon (100) at room temperature and the subsequent formation of iron silicide are the subjects of this paper. An in-situ cleaned silicon (100) wafer without carbon or oxygen contamination exhibiting the known 2 × 1 reconstruction in the LEED pattern served as the substrate. Iron was deposited on this reconstructed surface at 300 K. The comparison of theoretical calculations based on three growth mechanisms with XPS data obtained with take-off angles of 0° and 50° clearly demonstrates a layer-by-layer growth of the iron film on silicon (100). At 300 K no formation of iron silicide was observed, although an interaction between iron and silicon could be detected at the interface. The formation of iron silicide was observed at annealing temperatures of 630–730 K. Quantitative XPS analysis yields the presence of FeSi₂, when the thickness is large enough. Neither the iron film on silicon nor the silicide shows any LEED pattern.     

苎麻阳离子改性的研究（三）：改性苎麻的染色机理

采用上染速率，等温吸附模型，Ｚｅｔａ电位、染料与纤维的结合力等方法从理论上研究了改性苎麻的染色机理，苎麻改性后，纤维表面的Ｚｅｔａ电位由原来的－４２ｍＶ提高到－１８ｍＶ，正电性显著增加，提高了阴离子染料对改性苎麻的亲和力，上染率高，节约染料。     

管内机器人研究中的几项新技术

介绍了我们研制的管内机器人中应用的具有创新性的三项技术：１．轮式全主动新型行走机构；２．内壁环带视觉装置；３．新型离心喷涂器。     

徐淮地区煤矿井筒破裂机理研究

从徐淮地区井筒破裂的特点出发，分析引起井壁破裂的根本原因，据此提出井筒的破裂机理，为选择防治井筒破裂的方法提供依据     

夏季面漆起泡的预防

面漆漆膜在夏季潮湿天气下成膜后3—5天，漆膜表面易形成米粒状的漆泡，针对漆泡的现象，寻找其形成的机理，根据起泡的机理采取预防面漆起泡的措施。     

压裂斜井时射孔处雁形裂缝产生及干扰分析

在已射孔的斜井压裂过程中，射孔孔眼处会出现一系列的几乎相互平行的雁形裂缝。这些裂缝的延伸、连接受到地层应力及裂缝本身的影响，情况较为复杂，但它们的延伸和连接对压裂的成功与否至关重要。笔者对裂缝模型进行简化，将复变函数理论与位错理论相结合，并且考虑了裂缝表面有流体压力作用且裂缝之间存在相互干扰的情况下，建立了无限大介质中裂尖应力强度因子的数学模型，利用该模型可对雁型裂缝之间的相互干扰进行力学分析。应用数值方法对所建立的数学模型求解，得到裂尖的应力强度因子及转角，来预测裂缝连接情况。该结果可用来指导压裂井的射孔施工。     

压裂泵往复密封性能及机理研究

根据流体动压润滑理论，对压裂泵柱塞密封摩擦副的润滑机理进行了理论分析。在排出和吸入行程，柱塞密封摩擦副均能满足流体动压润滑的条件，即在柱塞与密封界面上能形成并保持一定厚度的油膜润滑密封，从而达到减小摩擦提高寿命的目的；建立了摩擦界面油膜厚度和泄漏量的计算公式。利用有限元法理论，对密封圈的压力沿轴向的分布规律、泄漏量与压力变化关系进行了模拟计算。对往复密封圈沿轴向压力分布、泄漏量随压力变化进行了测试；试验结果表明，建立的计算模型具有较高的计算精度，揭示了压裂泵的密封机理。     

一维弹道修正模块设计与仿真

简要介绍了一种用于维弹道修正引信的执行机构。通过数学模型，结合MDT三机械设计软件和Working Model动力学仿真软件，对机构的受力情况和工作过程进行了数字仿真和系统分析，并通过对飞行弹道的模拟，得出了一维时间控制射程修正规律。