钇铁石榴石薄膜材料的光吸收谱及Bi,Al掺入对谱的影响研究

采用单离子晶场跃迁模型，拟合出钇铁石榴石（ＹＩＧ）薄膜材料的光吸收谱，与实验谱吻合得较好。从实验和理论上分析了（ＢＩＡＩ）ＹＩＧ 薄膜材料的光吸收谱，结果表明，Ａｌ３＋离子的作用如同稀释剂一样，减小了光吸收，Ｂｉ３＋离子由于其强的自旋轨道耦合作用，增大了跃迁振子强度和跃迁线宽，从而增大了光吸收损耗，在此基础上所作的（ＢｉＡｌ）ＹＩＧ的理论谱与实验谱符合得较好。     

PZT铁电薄膜的制备及电学性能研究

使用硝酸锆作锆源的溶胶－凝胶方法制备ＰＺＴ铁电薄膜。他们的电学性能被测试包括电滞回线，电流Ｉ（ｔ）特性，漏电流，矫顽场疲劳和老化。测到的ＰＺＴ薄膜剩余极化８．２μＣ／ｃｍ~２，矫顽场６８ｋＶ／ｃｍ．簿膜的寿命可超过１０~（１１）周期。     

Application of Laminated Edible Films to Potato Chip Packaging

The effects of various stearic-palmitic acid blend concentrations in films, storage temperatures and storage times on potato chip quality were evaluated using Response Surface Methodology. Storage temperature and time affected the quality of potato chips. The maximum storage times for acceptable potato chip quality were: 30 to 43 days, 23 to 25 days, and 11 to 12 days for storage temperatures of 15, 25 and 35°C, respectively. Results were independent of stearic-palmitic acid blend concentrations.     

薄膜微型电源

介绍了新型的薄膜微型电源的工作原理、结构及制造工艺。     

High-pressure dc sputtering of High-Tc BPSCCO thin films withTc(0) above 100 K

High-T _c Bi(Pb)-Sr-Ca-Cu-O thin films have been made on single-crystal MgO substrates using high-pressure dc sputtering technique. X-ray studies confirm the crystallinity and highly oriented structure withc-axis perpendicular to the substrate. By optimizing the annealing schedule the formation of the high-T _c phase is stabilized. The best film exhibited superconducting transition temperature with zero-resistance temperature,T _c(0), as high as 101 K. Temperature dependence ofJ _c indicates the presence of Josephson-type weak links.     

国内流延树脂薄膜的生产

综述了国内生产流延树脂薄膜的现状,着重介绍了流延膜的生产工艺、引进生产设备的情况、流延膜的种类及用途。     

超声波对化学镀Ni－Cr－P非晶态薄膜的金刚石性能的影响

研究了超声波对化学镀Ｎｉ－Ｃｒ－Ｐ非晶态薄膜的金刚石性能的影响。结果表明，超声波可使金刚石表面非晶态薄膜更加均匀和致密，从而提高了抗压强度，氧化温度和晶化后的强度。随超声波频率的增加，金刚石性能有增加的趋势。     

氧化铝丝的研制

氧化铅丝生产过程中最关键的工艺是连续阳极氧化。氧化膜击穿电压决定于氧化膜厚度。控制膜厚度的三要素为:电解液(成份、浓度及温度),槽电压和铝丝走速。     

非晶硅基薄膜的等离子体刻蚀光发射谱检测

本文研究了采用锁定放大相干检测技术的等离子体光发射谱检测系统。用该系统检测了仅用CF4作为刻蚀气体刻蚀非晶硅基薄膜的等离子体光发射谱。分析了检测结果和刻蚀机理。     

精轧油膜轴承密封失效机理的初步分析

对油膜轴承密封出现的进水、漏油现象作了大量的调查、测量和统计分析，找出了产生质量事故的根本原因，提出了解决措施。