双室充氮包装机的技术改进

分析了原机型的性能特点和不足之处,介绍了改进方案。     

光学材料的激光微加工研究进展与应用前景

综述了国内外在光学材料激光微加工方面的研究成果和应用状况，并展望了其发展前景。     

MEMS封装技术研究进展

介绍了MEMS封装技术的特点、材料以及新技术,包括单片全集成MEMS封装、多芯片组件(MCM)封装、倒装芯片封装、准密封封装和模块式MEMS封装等。文中还介绍了MEMS产品封装实例。     

声诱饵仿真试验系统

介绍了声诱饵仿真试验系统的组成、工作原理、对接装置结构等,建立了对接装置声耦合状态下的数学模型,对近场声压分布进行了仿真计算,得出了匹配材料厚度、发射和接收换能器的选取原则。     

Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.     

Malted weaning food made from maize,soybean, groundnut and cooking banana

Infant malnutrition and mortality are common in Africa, although Africa is endowed with agricultural produce that could be harnessed through processing to produce adequate infant food. This project was set up to explore the possibility of using local raw materials to develop a nutritious, low‐dietary‐bulk, cheap infant food. The materials used included cereal (maize), pulses (soybean and groundnut) and tuberiferous plants (cooking banana). The grains were first germinated and dried or kilned before milling and formulation. The malted products were compared with fermented ones in terms of nutritional, dietary bulk and acceptability criteria. Malting increased the nutrient content, reduced the dietary bulk and enhanced the taste of the infant food. In terms of protein content, least gelation concentration and overall acceptability, malted samples had values in the range of 138–151 mg g^?1, 150–175 g l^?1 and 7.2–8.82 respectively, while the control (fermented) sample had values of 54 mg g^?1, 100 g l^?1 and 6.29 respectively. Roasting of malted cereals above 55 °C reduced the bulk reduction ability but enhanced the taste of the products. A combination of malted maize and soybean, roasted groundnut and cooking banana in the ratio of 50:15:15:20 gave a very recommendable weaning food for infants between the ages of 6 months and 2 years. © 2002 Society of Chemical Industry     

正确选用热力管网保温材料的几个问题

介绍了做好热力管网保温应具备的有关知识和数据，以及宝钢蒸汽主干管网在采用四种保温材料下的经济保温层厚度和相对的节能效益，认为目前适于宝钢公司热源温度在６００℃以下较好的保温材料有新型矿渣棉制品和泡沫石棉板。     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.     

基于工作站和EUCLID－IS的计算机组装结构CAD系统研究

随着集成电路技术的发展及计算机性能的不断提高，计算机组装结构设计在计算机，总体设计中的地位越来越重要，它直接影响到计算机性能的提高。本文针对一个基于工作站和ＥＵＣＬＩＤ－ＩＳ软件的电子计算机组结构ＣＡＤ系统，从软、硬件平台，系统功能及实现等方面进行了讨论，旨在为电子计算机组装结构设计提供一种强有力的、方便的设计工具，有利于增强国产计算机的市场竞争能力。     

基于工作站和EUCLID-IS的计算机组装结构CAD系统研究

随着集成电路技术的发展及计算机性能的不断提高，计算机组装结构设计在计算机，总体设计中的地位越来越重要，它直接影响到计算机性能的提高。本文针对一个基于工作站和ＥＵＣＬＩＤ－ＩＳ软件的电子计算机组结构ＣＡＤ系统，从软、硬件平台，系统功能及实现等方面进行了讨论，旨在为电子计算机组装结构设计提供一种强有力的、方便的设计工具，有利于增强国产计算机的市场竞争能力。