厚铜PCB用高填充性半固化片的研制

一般地,106半固化片的树脂含量（简称RC）只能达到75％左右。因厚铜（铜厚达到105μm及以上）印制电路板的线路间需要更多的树脂来填充,故普通工艺制造的半固化片就很难满足厚铜印制线路板的填胶性。因此,本文研究了提高半固化片RC的新工艺方法,从而改善半固化片对厚铜印制线路板的填胶性能。     

预浸渍液pH值对阳山水蜜桃汁色泽的影响

采用不同pH值预浸渍液对打浆前的水蜜桃进行预处理,以水蜜桃亮度(ΔL)、红度(Δa)、黄度(Δb)、总色差值(ΔE)、色泽饱和度(ΔC)等为色泽指标,考察预浸渍对水蜜桃汁色泽的影响。结果表明:pH 4.8时,水蜜桃汁ΔL值由参照样品的-3.16升高到-1.23,Δa值由1.21下降到-0.83,Δb值由-1.4升高到0.05,ΔE值由3.67下降到1.49,而ΔC值基本保持稳定。证明经pH值4.8的预浸渍液处理水蜜桃30min,可以有效遏制水蜜桃汁的褐变。     

零吸胶工艺复合材料层板成型质量与预浸料特性关联分析

针对3种国外产碳纤维/环氧预浸料,测试表征了预浸料的工艺特性,并采用热压罐零吸胶工艺制备了复合材料层板,考察了工艺条件对层板厚度和内部缺陷的影响,分析了成型质量与预浸料特性之间的关联性,进一步研究了层板弯曲性能、层间剪切性能对成型质量变化的敏感性。实验结果表明,由于零吸胶工艺树脂流动受到很大限制,预浸料树脂含量不均容易造成所成型层板厚度不均、表面不平整,另外,预浸料树脂流动性小的体系在层间容易出现明显富树脂现象;零吸胶工艺夹杂空气主要在真空作用下通过铺层内的通道排出,因此预浸料气体渗透率和成型封装方式对孔隙缺陷有重要影响;实验范围内,工艺条件的改变没有显著影响所成型层板的短梁剪切性能和弯曲性能。研究结果对于预浸料选择和国产高性能预浸料的开发具有重要参考价值。     

PEEK基体热塑性树脂基复合材料的研究

介绍了热塑性树脂基复合材料用ＰＥＥＫ树脂的性能，静电粉末法制备热塑性树脂预浸料的设备和工艺，用该工艺制备的预浸料规格和性能以及ＡＳ４Ｃ单向织物／ＰＥＥＫ复合材料的力学性能，韧性，耐环境性能，同时还介绍了将这种材料用于宇航工业而进行的基础研究工作。     

半固化片的基础知识

本文主要介绍半固化片的分类、相关特性与指标、保存条件及生产流程,希望能给PCB生产者带来帮助。     

Research on the Shear Behaviour of Plain Weave Prepreg at Lateral Compaction Stage

Abstract:  An investigation of the shear behaviour of plain weave prepreg at lateral compaction stage was undertaken by the picture-frame test. A unit cell of weave prepreg was modelled and three moments were assumed in the unit cell: (i) the moment of shear force that picture frame applies on the unit cell; (ii) the friction moment at crossover of yarns; and (iii) the compaction moment between the yarns. Through moment balance, a relationship between the load and the shear rate was deduced. A plain sheet shearing film resin model was established to obtain the friction moment at crossover. To get the compaction moment, a constitutive equation of a single prepreged yarn was deduced and a transverse viscosity coefficient equation was given. Moreover, through an equivalent cross-sectional area model, the lateral contact thickness between the yarns was obtained. The comparison between the experimental and theoretical results shows that the presented model can describe the shear behaviour of weave prepreg at lateral compaction stage well.     

热隔膜工艺温度与成型速率对C形复合材料成型质量的影响

利用自制的热隔膜成型设备制备C形结构碳纤维/环氧预浸料预成型体,通过对预成型体的厚度、缺陷进行表征,考察了工艺温度、成型速率对C形预成型体成型质量和预浸料层间摩擦阻力的影响,分析了预浸料摩擦滑移特性与热隔膜工艺成型质量的关联性。结果表明:通过提高工艺温度、降低抽真空速率可以降低预浸料层间摩擦阻力,得到成型质量较好的C形预成型体。热隔膜成型工艺条件对预浸料层间摩擦滑移特性有重要影响,摩擦阻力可以作为优化热隔膜成型工艺参数的重要依据。     

Effect of NBR on epoxy/glass prepregs properties

Solid acrylonitrile‐butadiene rubber (NBR) was used in epoxy resin for toughening and also for increasing the tack of epoxy/glass prepregs. The NBR used in this study was a rubber with 33% acrylonitrile content. The changes in thermal and mechanical properties such as glass transition temperature (T_g), curing characteristics and lap‐shear strength have been studied. For this purpose, three types of prepregs with two levels of NBR content of 3 and 5%, were prepared. Prepregs were made by solvent type impregnation apparatus. In this method, resin impregnates satin textile glass fiber under the controlled and constant condition of line speed and oven temperature. Prepregs were B‐staged for about 3%. The cure characterization, T_g and flow behavior were evaluated using differential scanning calorimetry and rheological analysis. Results showed that increasing the rubber content caused the following effects: (a) delay in gel time of prepregs, (b) increase in activation energy of prepregs, and (c) decrease in total heat of curing reaction. It is interesting that NBR increased the tack of epoxy/glass prepreg but, had no effect on its resin flow behavior. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

阻燃抗静电预浸料及其性能

以反应型阻燃热固性低压酚醛树脂为基体,玻璃纤维乱丝为增强材料,乙炔炭黑为导电功能填料,进行了复合材料预浸料的阻燃及抗静电性能研究.结果表明,模压试样具有优异的阻燃抗静电性能、良好的力学性能和耐热性能.     

碳纤维/尼龙6预浸料的制备及盒体的热冲压成型工艺

首先利用自主设计的熔融浸渍机头制备了60 mm幅宽的连续碳纤维增强尼龙6（CF/PA6）热塑单向带,并利用快速热冲压成型技术制备了CF/PA6复合材料矩形盒体。结果显示,在CF/PA6预浸料制备过程中,纤维展纱包覆角与纤维展宽呈线性关系;预紧力增加展纱宽度的同时,牵引力会呈指数急剧上升,因此应避免大的预紧力;CF/PA6预浸料的浸渍质量随牵引速度的增加而降低;预热有利于改善高浸渍速度下的浸渍质量。在热冲压成型过程中,CF/PA6复合材料的最佳预热温度为260~280℃,模具温度为130~160℃,并应经过预压实。