Trade-off analysis on cost and manufacturing technology of an electronic product: Case study

A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.     

OSEK/VDX——汽车电子系统的开放式平台

介绍了当前在国际汽车工业界日益占据主导地位的汽车电子系统开放式平台--OSEK/VDX体系.详细地论述了这种体系的由来、运行机制和最新的发展动向,以及它对汽车电子技术发展的深远影响.     

铝基印制电路板制造工艺研究

此文对一种进口铝基印制电路板的制造工艺流程进行了介绍,对所采用的制造工艺技术进行了较为详细的论述。     

对未来我国覆铜板业技术发展的战略与任务的探讨

对未来十年我国覆铜板业技术发展的战略与技术开发重点任务进行了探讨。     

基于EWB的D/A数模转换器的仿真研究

阐述了D／A转换器的仿真原理，给出了T形电阻网络D／A转换器仿真模型的构造方法，并采用EWB进行了系统仿真，仿真结果表明该方法是合理、可行的。     

一种简易的手工网印序号工艺法

通过一种简易的手工丝印序号工艺法,可以连续完成逐张PCB的序号印制且质量稳定。     

介绍《电工电子实践课程丛书》--东南大学电工电子系列实践课程教改成果之一

本文介绍由东南大学组织编写，东南大学出版社出版的《电工电子实践课程丛书》的编写背景，每本教材内容的简要内容，特色与使用情况。