多晶硅薄膜晶体管自加热效应温度分布的有限元模拟

采用有限元方法模拟了n型MILC低温多晶硅薄膜晶体管在直流自加热应力下器件的温度分布．通过对器件沟道温度分布的稳态及瞬态模拟,研究了器件功率密度、衬底材料类型和器件宽长等关键因素的影响．确认了改善器件自加热退化的有效途径,同时有助于揭示多晶硅薄膜晶体管自加热退化的内在机制．     

一种考虑自热效应的AlGaN/GaN HEMT大信号模型

当AlGaN/GaN HEMT输出高功率密度时,器件沟道温度的升高将引起电流的下降(自热效应).提出了一种针对AlGaN/GaN HEMT改进的大信号等效电路模型,考虑了HEMT自热效应,建立了一种改进的大信号I-V特性模型,仿真结果与测试结果符合较好,提高了大信号模型的精度.     

双台阶式埋氧SGOI自加热效应的数值研究

To reduce the self-heating effect of strained Si grown on relaxed SiGe-on-insulator(SGOI) n-type metal-oxide-semiconductor field-effect transistors(nMOSFETs),this paper proposes a novel device called double step buried oxide(BOX) SGOI,investigates its electrical and thermal characteristics,and analyzes the effect of self-heating on its electrical parameters.During the simulation of the device,a low field mobility model for strained Si MOSFETs is established and reduced thermal conductivity resulting from...     

基于等效电容法对SOI器件自加热效应研究

针对目前常规SOI器件高温特性存在的问题,提出了采用等效电容法分析器件自加热效应的新观点,对抑制自加热效应原理进行了新的解析,根据埋层材料的介电常数不同,按等效电容法进行埋层厚度折算。在此基础上,提出了SOI器件的埋层新结构,并从介电常数的角度较好地验证了提出观点的正确性。最后得到,高介电常数等效埋层厚度的减小利于热泄散,高热导率的埋层材料提高了导热能力,在双重因素作用下有效抑制了自加热效应。     

薄膜全耗尽SOI CMOS电路高温特性模拟和结构优化

在300～600K温度范围内,利用ISE TCAD模拟软件对全耗尽SOI电路的温度特性进行了模拟分析,得到了较全面的SOI CMOS倒相器静态特性和瞬态特性,并提出了一种改进的AlN-DSOI结构.结果显示,SOI CMOS电路的阈值电压对温度较为敏感,随着温度的升高,输出特性衰退明显.瞬态模拟也表明电路的速度和功耗受外界环境温度的影响较大.改进后的AlN-DSOI结构在有效缓解SOI结构热效应和浮体效应的基础上,显著提高了电路的速度和驱动能力.     

新型图形化 SOI LDMOS结构的性能分析

提出一种图形化SOILDMOSFET结构,埋氧层在器件沟道下方是断开的,只存在于源区和漏区.数值模拟结果表明,相对于无体连接的SOI器件,此结构的关态和开态击穿电压可分别提高57%和70%,跨导平滑,开态I-V曲线没有翘曲现象,器件温度低100K左右,同时此结构还具有低的泄漏电流和输出电容.沟道下方开硅窗口可明显抑制SOI器件的浮体效应和自加热效应.此结构具有提高SOI功率器件性能和稳定性的开发潜力.     

高功率窄脉冲垂直腔面发射激光器n-DBR反射率的优化

从理论上研究了n型分布布拉格反射镜(n-DBR)的反射率对器件阈值电流、输出功率以及转换效率的影响,得出了最佳反射率。在此基础上研制了垂直腔面反射激光器(VCSEL)单管和阵列器件,采用波形分析法对VCSEL器件的功率进行了测试。在脉冲宽度60ns,重复频率100Hz条件下,500μm口径单管器件在注入电流为110A时,峰值输出功率达102W,功率密度为52kW/cm2,4×4、5×5阵列器件在100A时,功率分别达到98W和103W。对比了单管器件在连续、准连续和脉冲工作条件下的输出特性和光谱特性,连续和准连续条件下激射波长的红移速率分别为0.92nm/A和0.3nm/A,6A时的内部温升分别为85℃和18℃,而脉冲条件下激射波长的红移速率仅为0.0167nm/A,6A时的温升为1.5℃,远小于连续和准连续的情况,这也是器件在脉冲条件下能得到很高输出功率的主要原因。     

低碳型自热式牛奶包装盒的研制

目的:利用氧化钙和水发生化学反应产生热量来研制可自动快速加热牛奶的新型包装盒。方法:通过单因素实验比较不同氧化钙和水的比例、不同材质包装和不同启热方式对加热牛奶效率的影响。结果:氧化钙和水分别为40g和60g时、外包装盒为纸质材料、消费者自行注水的加热效率最好,且牛奶初始温度为10℃时,可在4min内使牛奶温度达到43℃,保温7min。结论:本研究提供了一种可自动快速加热牛奶的纸质包装盒,其结构简单、操作简单,而且体积小、质量轻。     

Characterization of Electrical Properties of AlGaN/GaN Interface Using Coupled Schr?dinger and Poisson’s Equations

The electrical characterization of AlGaN/GaN interface is reported. The dependence of two-dimensional electron gas (2-DEG) density at the interface on the Al mole fraction and thickness of AlGaN layer as well as on the thickness of GaN cap layer is presented. This information can be used to design and fabricate AlGaN/GaN based MODFET (modulation doped field effect transistor) for optimum DC and RF characteristics.     

Dynamic surface temperature measurements in SiC epitaxial power diodes performed under single-pulse self-heating conditions

Semiconductor devices development, design and optimization require the use of computer simulation tools able to predict the entire device safe operating area (SOA), something that it is not always possible due to limitations in some of the physical models in predicting certain properties of device operation under extreme conditions (i.e. high carrier injection levels and high temperature). In order to improve our understanding of device operation under these extreme conditions experimental data of the dynamic IV characteristics and temperature time evolution and space distribution are required. The experimental data obtained are then used in the development of improved physical models and simulation tools.

In this work, dynamic surface temperature measurements as a function of current pulse peak density and length were performed on SiC-PiN epitaxial power diodes. The measurements were carried out using an infrared (IR) microscope developed in our lab capable of measuring space and time surface temperature distributions in semiconductor devices operating under self-heating conditions [Solid State Electron 2001;45(12):2057]. The minimum detected spot size is 15 μm, while the signal raising time is detector limited to about 1 μs. The lowest detectable temperature increment is at least 10 °C over room temperature.

Using this instrument, dynamic thermal phenomena in 4.5 kV SiC-PiN epitaxial power diodes [Mater Sci Forum 2001;353–356:727] subjected to 1 ms long 100–6000 A/cm² and 0.1–5 ms long 3000 A/cm² current pulses have been studied. The possibility of obtaining dynamic surface temperature information from SiC electronic devices operating under self-heating conditions with time constants in the order of ms is demonstrated.