Effect of chloride ions on immersion plating of copper onto porous silicon from a methanol solution

The effect of chloride ions (Cl⁻) during the immersion plating of copper onto porous silicon (PS) from a methanol (MeOH) solution has been studied. The presence of Cl⁻ in the Cu²⁺ solution was found to slow down the rate of copper deposition, as confirmed by inductively coupled argon plasma emission spectroscopy and X-ray photoelectron spectroscopy measurements. The threshold concentration of Cl⁻ at which the deposition of copper is very severely diminished was found to be 0.1 M. The inhibition effect is discussed on the basis of the rest potential values of PS and polarization curve measurements. They revealed that the rest potential of PS upon dipping in these solutions appears to direct the metal deposition. Current density-potential curves show that at Cl⁻ concentrations higher than 0.1 M, the reduction of Cu ions proceeds in two steps; the reduction of Cu(II) to Cu(I) followed by the reduction of Cu(I) to Cu(0). This suggests that Cu(I) species in MeOH solution can be stable over a certain potential range and this stability of Cu(I) is responsible for the inhibition of metal deposition. Fourier transform infrared spectroscopy and scanning electron microscopy (SEM) were also performed to investigate the structural changes and characterizations of PS samples after the plating process.     

Dependence of Silicon Carbide Product Morphology on the Degree of Mechanical Activation

Mechanical activation before carbothermic reduction can substantially enhance the formation of SiC from SiO₂and carbon mixtures. However, the morphology (e.g., particles or whiskers) of SiC formed from mechanically activated SiO₂and carbon mixtures is dependent of the degree of mechanical activation and the condition of the subsequent carbothermic reduction. These phenomena are investigated and rationalized based on the increased reactivity of the reactants and SiC formation mechanisms.     

A novel integration approach for combining the components to minimize a micro-fuel cell

This work employs porous silicon as a gas diffusion layer (GDL) in a micro-fuel cell. Pt catalyst is deposited on the surface of, and inside, the porous silicon by the physical vapor deposition (PVD) method, to improve the porous silicon conductivity. Porous silicon with Pt catalyst replaces traditional GDL, and the Pt metal that remains on the rib is used to form a micro-thermal sensor in a single lithographic process.     

TFT有源矩阵α－Si∶H薄膜PECVD淀积工艺研究

分析了α－Ｓｉ∶Ｈ薄膜的质量和厚度对α－Ｓｉ∶ＨＴＦＴ关键性指标的影响，深入、详细地讨论了其ＰＥＣＶＤ淀积工艺，并在实验的基础上确定了最佳淀积工艺参数，从而获得了高性能的７５ｍｍ３７２×２７６像素α－Ｓｉ∶ＨＴＦＴ有源矩阵     

Holmium-doped Porous Silicon Prepared by a New Electrochemical Approach and Its Photoluminescence

Ｐｏｒｏｕｓｓｉｌｉｃｏｎ（ＰＳ）ｗａｓｆｏｕｎｄｔｏｅｍｉｔｖｉｓｉｂｌｅｌｕｍｉｎｅｓｃｅｎｃｅａｔｒｏｏｍｔｅｍｐｅｒａｔｕｒｅｂｙＣａｎｈａｍｉｎ１９９０［１］．Ｔｈｉｓｐｈｅｎｏｍｅｎｏｎｉｍｐｌｉｅｄａｐｏｔｅｎｔｉａｌａｐｐｌｉｃａｔｉ...     

微量Si在W—7Ni—3Fe重合金中的行为

研究了掺到原料Ｗ粉中微量Ｓｉ（４００ｐｐｍ）在Ｗ－７Ｎｉ－３Ｆｅ重合金中的分布及在液相烧结过程中的行为。结果表明，Ｓｉ主要以固溶形式分布在Ｗ晶粒中。Ｘ射线光电子能谱（ＸＰＳ）分析发现，在掺杂Ｓｉ的Ｗ－Ｗ及Ｗ－基体相界面富集ＳｉＯ２和Ｎａ２ＳｉＯ３在未掺杂试样的断口表面发现了较弱的ＷＯ２的ＸＰＳ谱，而在掺杂合金中未发现ＷＯ２。     

Transistors made in laser recrystallized polysilicon on insulator films

lpcvd polycrystalline silicon films were deposited on thermally oxidized silicon as well as onlpcvd silicon nitride deposited on silicon. Acw argon ion laser was used to recrystallize the polysilicon film into large grains (grain size from 5μm to 40μm). Boron was then implanted and standard N-channel silicon gate process and N-channel metal gate process were carried out to realisemosfets on this material. Channel mobilities upto 450 cm²/V-sec for electrons have been measured. This thin filmmosfet has a four-terminal structure with a top and a bottom gate and the influence of one gate on the drain current due to the other gate has been investigated. Comparison of theI _D v-V _D curves of the devices with physical models was found in good agreement.     

Influence of silicon on the oxidation of titanium between 550 and 700°C

The oxidation behavior of Ti-Si alloys (0.25, 0.5, and 1 Wt. % Si) was investigated between 550 and 700°C; in oxygen by continuous thermogravimetry for a maximum duration of about 500 hr and, in air by daily weighing for durations from a few hundred to several thousand hours. The kinetics results revealed that the presence of silicon leads to a decrease in oxidation rate which is more evident when the temperature is raised and the silicon content is increased. Morphological and structural examinations revealed that silicon modifies the internal architecture of oxide layers when compared with unalloyed titanium; in particular, reduced porosity in the layers is observed. Analysis showed that silicon is uniformly distributed in the oxide layer. However, while part of the silicon is in solid solution in the rutile, some is also precipitated as small crystals ( <1 m at 850°C) of SiO₂, of cristobalite structure. The adherence of oxide layers to the metal substrate was measured after cooling of samples; the addition of silicon has been observed to modify, in a manner dependent on its content, the adherence of oxide layers.     

工业硅生产贸易的目前形势和发展对策

对工业硅生产贸易的目前形势作了较详细分析，并对今后的发展提出了建立行业协会、完善和提高6．3M级工业硅炉，有条件地建设大容量工业硅炉，重视和扩大炭素电极和还原剂煤的应用，提高产品质量扩大产品种，大力开拓市场搞好多方面联合等看法和建议。     

氮气氛下直拉硅中氮含量的红外光谱测定

提出了利用直拉硅中与氮有关的特征红外吸收峰９６３、９９６、１０８１－１及１０２７ｃｍ－１确定直拉硅中氮含量的计算公式，并进行了多种样品实测。该法克服了只用９６３ｃｍ－１峰测定直拉硅中氮使结果偏低的弊病，方法相对偏差为５％～２０％