Improving Short-Circuit Current Capacity, Resistance, and Breaking Load of OPGW Constructions by Modifying Aluminium Alloy With AlB2

This article presents a method that can be applied to molten AA-6101 alloy to improve electrical properties of the aluminium part of the optical ground wire (OPGW) used in overhead transmission lines to protect phase conductors from lightning strike and to transmit signals and data. AA-6101 alloy in casting of the log as 6 m length and 178 mm diameter for extrusion has been inoculated by AlB₂ to decrease detrimental effects of Cr, Ti, V, and Zr on the conductivity of the material. After inoculation, improved billets were extruded as 9.5 mm diameter feedstock. Required wires drawn from the feedstock according to the construction types of OPGW to be tested were exposed to aging at 175°C, 6 h (T-8). Upon completion of the back-twist and performing-type stranding process, resistance, and short-circuit current capacity and breaking load of the OPGW 88/44 constructions with other metal combinations have been examined and tested to show improvement. Results are summarized in tables and graphically.     

浇筑式沥青混凝土心墙型式改进的建议

本文根据浇筑式沥青混凝土主、副心墙材料的性能，分折了沥青混凝土心墙施工或运行中破坏的原因，建议用编织一无纺复合布取代预制块，以避免主、副心墙材料变形性能相差悬残对心墙运行的不利影响，从而发挥浇筑式沥青混凝土心墙的优越性。     

PECVD法低温沉积多晶硅薄膜的研究

在玻璃衬底上采用常规的PKCVD法在低温(≤400℃)条件下制得大颗较(直径＞100nm)、择优取向(220)明显的多晶硅薄膜。选用的反应气体为SiF4和H2混合气体。加入少量的SiH4后，沉积速率提高了近10倍。分析认为，在低温时促使多晶硅结构形成的反应基元应是SiFmHn(m n≤3)，而不可能是SiHn(n≤3)基团。     

High resistivity measurement of SiC wafers using different techniques

To establish fast, nondestructive, and inexpensive methods for resistivity measurements of SiC wafers, different resistivity-measurement techniques were tested for characterization of semi-insulating SiC wafers, namely, the four-point probe method with removable graphite contacts, the van der Pauw method with annealed metal and diffused contacts, the current-voltage (I-V) technique, and the contactless resistivity-measurement method. Comparison of different techniques is presented. The resistivity values of the semi-insulating SiC wafer measured using different techniques agree fairly well. As a result, application of removable graphite contacts is proposed for fast and nondestructive resistivity measurement of SiC wafers using the four-point probe method. High-temperature van der Pauw and room-temperature Hall characterization for the tested semi-insulating SiC wafer was also obtained and reported in this work.     

基于SOI的双极场效应晶体管

在分析了双极型晶体管和场效应晶体管各自的特点和不足后，介绍了一种既具有双极型晶体管较大电流容量和功率输出，又具有场效应晶体管高输入阻抗的电子器件——双极MOS场效应晶体管(BJMOSFET)，同时指出体硅BJMOSFET的阳极扩散区与衬底之间存在较大的漏电流，可产生较大的寄生效应。提出了一种新型固体电子器件——基于SOI的BJMOSFET，分析了其工作原理j与体硅BJMOSFET比较，由于SOI技术完整的介质隔离避免了体硅器件中存在的大部分寄生效应，使基于SOI的BJMOSFET在体效应、热载流子效应、寄生电容、短沟道效应和闩锁效应等方面具有更优良的特性。     

魏氏组织对20#碳钢H2S应力腐蚀开裂性能的影响

文章对H₂S-CO₂-H₂O腐蚀环境下发生H₂S应力腐蚀的20^＃碳钢弯管（无缝钢管）进行了成分、组织、拉伸、硬度和应力腐蚀开裂等性能的试验研究，并与同材质、同时投产、腐蚀环境基本相似而未发生应力腐蚀开裂的在役弯管及未使用的新弯管作对比，结果表明魏氏组织是引起20^＃钢发生应力腐蚀开裂的主要原因；正火能消除魏氏组织，降低钢的应力腐蚀开裂敏感性。     

珠光体球化的分形研究

珠光体球化反映到金相上，是一种不规则图像的变化，并且具有分形的特征，可望用分形几何的方法来进行描述。以Cr-Mo钢的珠光体球化为例，用分形维数来描述珠光体球化程度；用小岛法对15CrMo钢的珠光体球化图谱进行了测量。实验表明，珠光体球化从1级到6级，其相应的分形维数范围为1.3156-1.9282。从电厂运行了10^5h的15CrMo钢管上取样，实测了该试样的珠光体球化等级，结果表明，以分形维数表示的球化程度与按图谱评定的球化等级完全吻合。     

砂岩酸化中水化硅沉淀的影响因素分析

讨论了砂岩酸化中产生水化硅沉淀的反应机理。使高岭土与1.0%HF和多种配比的HCl HF在不同温度(20-90℃)反应不同时间(10-300分钟),用等离子吸收光谱法(ICP)测定酸液中可溶性硅的浓度(mg/L),取某时段测定值的减小量为该时段水化硅沉淀生成量,讨论了多种因素的影响,得到了如下结果和结论。反应温度越高,则高岭土与HF之间的反应越快,形成水化硅沉淀的时间越短,最终生成的沉淀量越大;在HF中加入HCl(使用土酸体系)、减小土酸中HF质量分数、加大土酸中HCl、HF质量分数比,均可使生成沉淀时间延后,使最终生成沉淀量减少。60℃时300分钟沉淀量,在1.0%HF、5.0%HCl 1.0%HF、9.0%HCl 1.0%HF中分别为482、321、201mg/L。提出了在酸化设计与施工中可以采取的6条简便易行的减少水化硅沉淀量的措施。图4表1参6。     

热作模具钢表面激光堆焊耐磨合金层的研究

本文主要通过在H13钢上用大功率CO_2激光束进行堆焊,阐述了激光堆焊工艺变化对堆焊组织和性能的影响,在本试验条件下,得到了高密度弥散金属化合物组织的激光堆焊层,平均硬度为HV800,与基体呈冶金结合,耐磨性比H13模具钢提高149%。     

Electrical and optical properties of semi-insulating polycrystalline silicon thin films: the role of microstructure and doping

We have investigated the relationship between microstructure and electrical conductivity in semi-insulating polycrystalline silicon (SIPOS) with oxygen concentrations in the 2–35 at.% range and the effect of doping with boron, phosphorus, arsenic and erbium by ion implantation. SIPOS thin films are mixtures of silicon and silicon oxide phases. The chemical and morphological evolution of these phases upon annealing is emphasized. Electrical conductivity measurements are interpreted in terms of a physical model containing few free parameters related to the material microstructure. A direct extension of this model explains also the conductivity increase in SIPOS doped with elements of the third or the fifth group. In the last part of the paper, data of electroluminescence at 1.54 μm in Er-implanted SIPOS due to intra-4f transitions of the Er³⁺ ion are shown and discussed.