In Silico Analysis and Experimental Validation of Active Compounds from Cichorium intybus L. Ameliorating Liver Injury

This study aimed at investigating the possible mechanisms of hepatic protective activity of Cichorium intybus L. (chicory) in acute liver injury. Pathological observation, reactive oxygen species (ROS) detection and measurements of biochemical indexes on mouse models proved hepatic protective effect of Cichorium intybus L. Identification of active compounds in Cichorium intybus L. was executed through several methods including ultra performance liquid chromatography/time of flight mass spectrometry (UPLC-TOF-MS). Similarity ensemble approach (SEA) docking, molecular modeling, molecular docking, and molecular dynamics (MD) simulation were applied in this study to explore possible mechanisms of the hepato-protective potential of Cichorium intybus L. We then analyzed the chemical composition of Cichorium intybus L., and found their key targets. Furthermore, in vitro cytological examination and western blot were used for validating the efficacy of the selected compounds. In silico analysis and western blot together demonstrated that selected compound 10 in Cichorium intybus L. targeted Akt-1 in hepatocytes. Besides, compound 13 targeted both caspase-1 and Akt-1. These small compounds may ameliorate liver injury by acting on their targets, which are related to apoptosis or autophagy. The conclusions above may shed light on the complex molecular mechanisms of Cichorium intybus L. acting on hepatocytes and ameliorating liver injury.     

不同晶相结构ZrO2负载铜基催化剂用于二乙醇胺脱氢反应

通过制备不同晶相结构〔单斜相(m-ZrO_2)、四方相(t-ZrO_2)和无定型(a-ZrO_2)〕ZrO_2载体,再通过沉积沉淀法制得Cu/m-ZrO_2、Cu/t-ZrO_2和Cu/a-ZrO_2催化剂,分别用于催化二乙醇胺脱氢合成亚氨基二乙酸反应。采用XRD、氮气物理吸附脱附、XPS、H_2-TPR、CO_2-TPD对催化剂的结构进行了表征。结果表明,Cu/m-ZrO_2催化剂界面更加有利于Cu~+/Cu~0稳定存在,具有更多的碱性位点,且抗氧化性较好。在二乙醇胺脱氢反应中,Cu/m-ZrO_2催化剂性能最好,反应时间为2.5 h,亚氨基二乙酸收率为97.64%。     

Simplified anode architecture for PEMFC systems based on alternative fuel feeding: Experimental characterization and optimization for automotive applications

The need to reduce PEMFC systems cost as well as to increase their durability is crucial for their integration in various applications and especially for transport applications. A new simplified architecture of the anode circuit called Alternating Fuel Feeding (AFF) offers to reduce the development costs. Requiring a new stack concept, it combines the simplicity of Dead-End Anode (DEA) with the operation advantages of the hydrogen recirculation. The three architectures (DEA, recirculation and AFF) are compared in terms of performance on a 5-kW test bench in automotive conditions, through a sensitivity analysis. A gain of 17% on the system efficiency is observed when switching from DEA to AFF. Moreover, similar performances are obtained both for AFF and for recirculation after an accurate optimization of the AFF tuning parameters. Based on DoE data, a gain of 25% on the weight of the anodic line has been identified compared to pulsed ejector architecture and 43% with the classic recirculation architecture with blower only (Miraï).     

An integrated approach to analysing the cost efficiency of postal networks

An integrated approach to measure the cost efficiency of the postal network of Universal Service Provider is proposed. An integrated approach enables the measurement of cost efficiency for delivery and non-delivery postal network units. The proposed approach is verified and tested on the postal network of the selected provider and the results were derived by using Data Envelopment Analysis (DEA). The results show that the main sources of inefficiency are inadequate allocation of resources relative to the network units. In addition, the study indicates that economies of scale have a positive impact on the efficiency of postal network units.     

多晶硅锭中硬质点分析及控制研究

以多晶硅锭中硬质点为研究对象,通过实验研究和数值模拟的方法,对多晶硅锭中硬质点进行形貌和成分分析,并提出改善控制方法。研究结果表明硅锭中部的硬质点较细小,主要由SiC组成;硅锭头部的硬质点较粗大,主要由SiC和Si3N4组成,还有少量O的存在。进一步研究发现多晶硅定向凝固铸锭炉的热场结构对于多晶硅锭硬质点形成有直接影响,通过改进热场结构,优化晶体生长界面,显著减少了铸锭中硬质点的数量。     

A new wavelet based fault detection,classification and location in transmission lines

This paper deals with the application of wavelet transforms for the detection, classification and location of faults on transmission lines. A Global Positioning System clock is used to synchronize sampling of voltage and current signals at both the ends of the transmission line. The detail coefficients of current signals of both the ends are utilized to calculate fault indices. These fault indices are compared with threshold values to detect and classify the faults. Artificial Neural Networks are employed to locate the fault, which make use of approximate decompositions of the voltages and currents of local end. The proposed algorithm is tested successfully for different locations and types of faults.     

The formation of fibrous structure of polyamide 6 induced by the three-step forming process and its prominent reinforcement in nitrile rubber

Nitrile rubber (NBR) blends with excellent performance have always been a hot research topic in petroleum field. Due to the excellent performance and compatibility of polyamide 6 (PA6), it provides an opportunity for the preparation of high-performance NBR/PA6 blends. In this article, NBR/PA6 blends were prepared by the three-step molding process. Experimentally, it was found that PA6 has a prominent reinforcement effect in NBR matrix. The variation of this mechanical property was investigated from different aspects of the crystal structure, crystallinities, phase morphology, and so on. It can be cleared that the formation of fibrous structure of PA6 phase is the main factor for reinforcement of the polymer blends. Meanwhile, the formation mechanism of the special phase structure induced by the three-step process is deeply expounded and its structural evolution schematic is established. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47472.     

大口径光学元件装夹转运结构设计及分析

为了实现大口径光学元件的安全装夹、转运,通过光学元件开槽与不开槽两种装夹方式的分析,得出开槽夹紧转运方式将带来微裂纹、应力集中、成本高等缺陷,提出了利用摩擦力克服光学零件的重力和惯性力的低应力装夹转运方案。通过对光学元件低应力夹紧结构设计,并利用有限元分析方法,得到不开槽装夹方式下,光学元件的最大主应力为1.11 MPa,最大切应力为0.73 MPa,远低于光学元件破坏的强度极限,且受力均匀,无应力集中现象。