分离压对不同基底上含活性剂液滴铺展特征的影响

针对不同基底结构上含不溶性活性剂液滴的铺展过程,引入受活性剂浓度影响的分离压模型,应用润滑理论建立了液滴厚度和活性剂浓度演化方程组,通过数值计算得到了分离压作用下含活性剂液滴过程的演化特征。研究表明不考虑分离压时,最小液膜高度贴近壁面,诱发去润湿现象发生,基底不平整度增加加剧液膜变形;分离压作用下最小液膜高度显著上升,铺展前沿处衍生出的子波结构明显减少,铺展更加稳定;分离压具有抑制液膜表面变形促进液滴铺展的作用。     

基于GaAs电感模型的微波功率放大器

基于0.15μm砷化镓(GaAs)工艺建立一种电感模型,并用高频结构模拟器(High Frequency Structure Simulator,HFSS)仿真验证,并在此基础上设计一种微波功率放大器,并用高级系统设计软件(Advanced Design System,ADS)进行仿真。仿真结果显示在8¹2GHz频率范围内,饱和输出功率大于21.9dBm,1dB压缩点输出功率大于20dBm,功率增益大于26dB,功率附加效率大于34%,稳定系数大于1。     

Evaluating the role of composition and local structure on alkali out-diffusion in glasses for thin-film solar cells

The presence of alkali ions has reportedly improved the performance of CIGS/CZTS–based thin-film solar cells. The out-diffusion of the alkali ion, in particular, Na, from the glass substrate offers a facile scalable route of supplying the alkali ions during the growth of the absorber layer. In this work, we demonstrate the diffusion of different alkali ions (Li/Na/K) from composition tuned glasses with intentionally incorporated excess alkali ions into a thin Mo film, typically used as a bottom electrode in solar cells. We also evaluate the physical, mechanical, and thermal properties of the glasses for suitability as a substrate in thin-film deposition. The out-diffusion of alkali ions to the overlayer is found to be critically influenced by the composition and the local structure of the glasses. The Na ions exhibit the highest extent of diffusion among the alkali ions present in glass substrates, while that for the K-ions is the lowest. For the glasses with mixed alkali ions, the presence of Li facilitated the out-diffusion of Na, whereas K ions appear to inhibit the same. Differently with the existing reports, we show that the activation energy and the presence of Ca ions as additional modifiers play a crucial role in the transport mechanism of the ions. In addition, the synthesized glasses exhibit hardness of the order 5-7 GPa, density ~2.55 g cm^-3. The glass transition temperature lies between 535 and 580°C and the coefficient of thermal expansion 8.5-10 ppm/K, which is highly suitable for use as substrates in thin-film solar cells.     

Indentation method for fracture resistance determination of metal/ceramic interfaces in thick TBCs

The indentation technique has been used to measure the adhesion of plasma- sprayed ceramic coatings on metals intended for thick thermal barrier coating ( TTBC) applications. This approach provides the adhesion value as the critical strain energy release rate,Gc, of the interface, which also takes into account any residual stresses. The theoretical background of the method is outlined, and specific examples are reported with respect to the effect of substrate temperature on the metal/ceramic adhesion of thick TBCs.     

不锈钢基体上化学镀铜工艺研究

不锈钢基体上化学镀铜易造成镀层鼓泡,这不仅影响了镀层与基体的结合力,而且直接影响到外观质量.为此,将镀前酸处理过的不锈钢片放在烘箱中加热,以除去酸洗时渗入到基体的氢.确定了热处理温度和时间,采用此方法解决了镀层起泡问题,得到所需要的镀层.     

热处理对两种铜膜结合强度的影响

采用PVD和CVD技术制备Cu/TiN/PI试样，研究表明，TiN薄膜可以有效地阻挡Cu向PI基板内部扩散，CVD工艺制备的Cu膜内部残余应力很小，Cu膜有相对高的结合强度；而PVD制备的Cu膜，在有TiN阻挡层存在的情况下，Cu膜内存在拉应力，拉应力降低了Cu膜结合强度，300℃退火可以消除膜内残余应力，结合强度提高。     

INTERFACIAL REACTIONS OF METAL FILMS WITH AlN SUBSTRATE

ＩＮＴＥＲＦＡＣＩＡＬＲＥＡＣＴＩＯＮＳＯＦＭＥＴＡＬＦＩＬＭＳＷＩＴＨＡｌＮＳＵＢＳＴＲＡＴＥＨｅＸｉａｎｇｊｕｎ；ＴａｏＫｕｎ；ＦａｎＹｕｄｉａｎ（ＤｅｐａｒｔｍｅｎｔｏｆＭａｔｅｒｉａｌｓＳｃｉｅｎｃｅａｎｄＥｎｇｉｎｅｅｒｉｎｇ，Ｔｓｉｎｇｈ...     

基板温度对PVD薄膜分维的影响

采用动态蒙特卡罗（KMC）方法研究物理气相沉积（PVD）制备薄膜过程中基板温度对薄膜微观结构的影响，并用分维理论研究薄膜表面的复杂程度。该KMC模型中既包括入射原子与表面之间的碰撞，又包括被吸附原子的扩散。模拟中用动量机制确定被吸附原子在表面上的初始构型，用分子稳态计算（MS）方法计算扩散模型中跃迁原子的激活能，用红黑树选择跃迁路径并更新系统跃迁机率。研究结果表明：基板温度大于500K时，薄膜表面分维均小于2．04，表面光滑，而当基板温度小于500K时薄膜分维随基板温度降低而增大，表面随基板温度升高变得越来越粗糙，直到基板温度降到250K时，分维达到最大的稳定值2．32，表面情况非常复杂，具有细致的皱褶和缺陷。分维与基板温度之间的关系说明高基板温度有利于分维小、表面光滑薄膜的制备，而低基板温度使薄膜分维增大、表面结构更加复杂。该研究结果与基板温度对PVD薄膜表面粗糙度影响的研究结果趋势上一致，分维能更细致地评价薄膜表面的复杂程度。     

Au-Ni-Kovar合金系统基底元素表面偏聚的SAM和XPS研究SCIEI

本文采用SAM和XPS对实用Au-Ni-Kovar合金系统热处理样品(250—350℃,0.5—1.5h)进行了基底元素穿透Au层的表面偏聚研究,给出了这一复杂系统中Ni,Co表面偏聚机理的直观证据,即Ni,Co主要是通过晶界扩散穿透Au层而后以表面扩散覆盖镀Au表面的;表面偏聚元素化学态的研究则不仅表明,氧的吸附和氧化反应是Ni,Co表面偏聚的驱动力,而且发现,上述偏聚会引起样品表面吸水的现象。     

Quenching stress in plasma sprayed coatings and its correlation with the deposit microstructure

Quenching stress arises within a thermally sprayed splat as its thermal contraction after solidification is constrained by the underlying solid. Dependence of the quenching stress in plasma-sprayed deposits of Ni-20Cr alloy and alumina on the substrate temperature during spraying was discussed in conjunction with the change in the nature of the interlamellar contact between splats. It was found by mercury intrusion porosimetry and observation of cross sections of impregnated deposits that the interlamellar contact is improved significantly by raising the substrate temperature during deposition from 200 to 600 °C. The positive dependence of the quenching stress on the substrate temperature in this temperature range was attributed to a stronger constraint against thermal contraction of sprayed splats after solidification due to the improved contact.