Splash Splat to Disk Splat Transition Behavior in Plasma-Sprayed Metallic Materials

A variety of metallic powder particles were thermally sprayed onto the mirror polished metallic substrate surface and the effect of both substrate temperature and ambient pressure on the flattening behavior of the particle was systematically investigated. In the flattening behavior of the sprayed particle onto the substrate surface, critical conditions were recognized both in the substrate temperature and ambient pressure. That is, the flattening behavior changed transitionally on that critical temperature and pressure range, respectively. A transition temperature, T _t, and transition pressure, P _t, were defined and introduced, respectively for those critical conditions. The fact that the dependence of both transition temperature and transition pressure on the sprayed particle material had similar tendency indicated that the wetting of the substrate by the molten particles seemed to be a domination in the flattening. Three-dimensional transition curvature by combining both transition temperature and transition pressure dependence was proposed as a practical and effective controlling principle of the thermal spray process. This article is an invited paper selected from presentations at the 2007 International Thermal Spray Conference and has been expanded from the original presentation. It is simultaneously published in Global Coating Solutions, Proceedings of the 2007 International Thermal Spray Conference, Beijing, China, May 14-16, 2007, Basil R. Marple, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, and Ghislain Montavon, Ed., ASM International, Materials Park, OH, 2007.     

Flame-Sprayed Glaze Coatings: Effects of Operating Parameters and Feedstock Characteristics Onto Coating Structures

Many substrates do not sustain the conventional glazing process (i.e., vitreous glazing) due to the relatively high temperature required by this treatment (i.e., up to 1400 °C in some cases) to fuse glazes after their application on the surface to be covered. Flame spraying could appear as a solution to circumvent this limitation and to avoid thermal decomposition of substrates. This contribution describes some structural attributes of glaze coatings manufactured by flame spraying. It also discusses the influence of the feedstock powder morphology and some of its physical properties on coating characteristics. This article is an invited paper selected from presentations at the 2007 International Thermal Spray Conference and has been expanded from the original presentation. It is simultaneously published in Global Coating Solutions, Proceedings of the 2007 International Thermal Spray Conference, Beijing, China, May 14-16, 2007, Basil R. Marple, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, and Ghislain Montavon, Ed., ASM International, Materials Park, OH, 2007.     

表面状态和处理对涂层下A3钢腐蚀和涂层失效的影响

采用模拟大气腐蚀装置，用挂片法研究了不同表面处 理和表面状态、不同湿度对涂层失效的影响.通过对基体金属的腐蚀形貌观察，微区元素分析，并结合傅利叶变换红外光谱(FTIR)，研究了金属在涂层下的腐蚀产物和涂层结构的变化.同时探讨了金属在涂层下的腐蚀和涂层失效机理.     

Millimeter‐wave planar high gain SIW antenna using half elliptic radiation slots

This article reports a high gain millimeter‐wave substrate integrated waveguide (SIW) antenna using low cost printed circuit board technology. The half elliptic slots which can provide small shunt admittance, low cross polarization level and low mutual coupling are etched on the board surface of SIW as radiation slots for large array application. Design procedure for analyzing the characteristics of proposed radiation slot, the beam‐forming structure and the array antenna are presented. As examples, an 8 × 8 and a 32 × 32 SIW slot array antennas are designed and verified by experiments. Good agreements between simulation and measured results are achieved, which shows the 8 × 8 SIW slot array antenna has a gain of 20.8 dBi at 42.5 GHz, the maximum sidelobe level of 42.5 GHz E‐plane and H‐plane radiation patterns are 22.3 dB and 22.1 dB, respectively. The 32 × 32 SIW slot array antenna has a maximum measured gain of 30.05 dBi at 42.5 GHz. At 42.3 GHz, the measured antenna has a gain of 29.6 dBi and a maximum sidelobe level of 19.89 dB and 15.0 dB for the E‐plane and H‐plane radiation patterns. © 2015 Wiley Periodicals, Inc. Int J RF and Microwave CAE 25:709–718, 2015.     

Electron‐beam deposition of MgO on plastic substrate and manufacturing flexible flat fluorescent lamp

Abstract— A flexible fluorescent lamp that utilizes the same plasma discharge mode as in PDPs has been manufactured. The structure of the flexible lamp is simple and easy to manufacture. All‐plastic materials including plastic substrates, barrier ribs (spacers), and sealants for low‐temperature manufacturing processing have been adopted except for the phosphor and MgO thin film. The MgO thin films were coated on the plastic substrates as a protection layer against the plasma discharge. The adhesion and biaxial texture of MgO thin film deposited on the plastic substrates, poly‐ethyle‐nenaphthalate (PEN) and polycarbonate (PC), at low temperature (100–180°C) has been characterized. The MgO film on PEN shows good adhesion under a repeated bending test. The manufactured flexible lamp consists of two plastic substrates of about 3 in. on the diagonal, barrier rib (spacer), and external ITO electrodes. The Ne‐Xe (5%) gas mixture at 100–200 Torr was used for the discharge gas. A maximum surface luminance of about 100 cd/m² was achieved for a 1 ‐kHz AC pulse.     

Successful fabrication of bicrystal Si substrates for YBa2Cu3O7 − y Josephson junctions

Bicrystal Si(BiSi) substrates for grain boundary (GB) Josephson junctions (GBJJs) have been fabricated by a direct bonding technique using a hot press method. The fracture strength and structure of the bonding interfaces were investigated to obtain substrates suitable for the junctions. It was found that an increase in the pressure of the hot press improves the reproducibility of the GBJJs. YBa₂Cu₃O_{7 − y} GBJJs were successfully fabricated on Bi-Si substrates with a misorientation angle of 15 ° bonded under a pressure of 90 kgf cm⁻² at 1200 °C in a vacuum of ≈10⁻³ Pa. These junctions showed typical I-V curves described by the RSJ model. The Shapiro steps induced by millimetre wave irradiation of 101 GHz were clearly observed in the I-V curves up to 3 mV, corresponding to at least 1.5 THz (, where e is the unit charge, V the voltage and h Planck's constant).     

大口径空间相机反射镜高反膜研究进展

大口径反射镜高反膜是大口径空间相机光学系统中的重要光学元件。为了观测到更多的目标、获取更多的地球以及空间观测信息,对大口径空间相机的反向射膜提出了更高要求,即要求有更宽的工作谱段和更高的反射率,还要提升基底光学性能,降低空间环境对高反膜性能的影响以及降低薄膜应力等等。对近年国内外天基大口径空间相机反射镜高反膜研究进行了综述,概述了针对以上要求所取得的成果。尽管高反膜的设计制造仍面临许多困难,但随着研究的深入与新方法的提出,这几方面难点已基本找到解决的途径。     

碳化硅器件挑战现有封装技术

碳化硅(SiC)器件的新特性和移动应用的功率密度要求给功率器件的封装技术提出了新的挑战。现有功率器件的封装技术主要是在硅基的绝缘栅双极晶体管(Insulated Gate Bipolar Transistor,IGBT)和金属氧化物半导体场效应晶体管(Metal Oxide Semiconductor Field Effect Transistor,MOSFET)等基础上发展起来的,并一直都在演进,但这些渐进改良尚不足以充分发挥SiC器件的性能,因而封装技术需要革命性的进步。在简述现有封装技术及其演进的基础上,主要从功率模块的角度讨论了封装技术的发展方向。同时讨论了功率模块的新型叠层结构以及封装技术的离散化、高温化趋势,并对SiC器件封装技术的发展方向做出了综合评估。     

Ku波段宽带高增益基片集成腔圆极化阵列天线北大核心CSCD

提出了一款应用于Ku波段的宽带高增益基片集成腔(Substrate Integrated Cavity,SIC)圆极化阵列天线。通过引入沿SIC口径面对角线放置的一对半月形寄生贴片和SIC底部馈电纵缝,使SIC中的TM_(211)和TM_(121)谐振模式幅值相等、相位相差90°,产生高增益圆极化辐射。同时,双寄生贴片还引入了一种背腔缝隙耦合振子圆极化辐射模式,扩宽了天线高增益圆极化辐射带宽。在此基础上,设计了一款2×2单元顺序旋转馈电的SIC圆极化阵列天线。阵列天线采用双层基片集成波导顺序相移馈电网络进行馈电,进一步增大了天线的圆极化带宽。综合考虑天线的-10 dB反射系数带宽、3 dB轴比带宽和3 dB增益带宽,测试结果表明,圆极化阵列天线的有效带宽为10.74-13.30 GHz(21.3%),在通带范围内最大增益为14.50 dBi。     

一种Ku波段综合馈电多功能板的研制

基于多层微波数字复合基板层叠互联技术,研制的Ku波段综合馈电多功能板集成了射频收发网络、电源分配网络、阵面波控及波控分配网络,主要负责16个片式T/R组件的功率分配与合成,同时为各T/R组件提供电源及控制信号。文中对多功能板的架构设计、工作原理进行了说明,重点介绍了各微波垂直互联电路和射频收发网络的设计,最后加工并测试了验证样件,测试结果良好。收发网络总口驻波＜1.9,分口驻波＜1.3,插损＜16 dB,相邻端口的隔离度＞20 dB,且幅度一致性≤0.602 dB,相位一致性≤6.429°。工程应用可行性和实用性得到了验证。