Conducting composites of polythiophene and polyfuran with acetylene black

Conducting composites of polythiophene (PTP) and polyfuran (PF) with acetylene black (AB) were prepared via chemical oxidative polymerization of thiophene and furan in a suspension of AB in CHCl₃ at room temperature using anhydrous FeCl₃ as the oxidant. Formation of PTP and PF and their subsequent incorporation in PTP–AB and PF–AB composite systems were confirmed by FTIR analysis. Scanning electron microscope analysis showed the presence of compact clusters of particles in both composites. Transmission electron micrographs of PTP–AB and PF–AB composites showed formation of globular polymer encapsulated AB particles with average diameters of the order of ～100 nm in both systems. Thermogravimetric analysis revealed that the overall thermal stability varied in the order: AB > PTP–AB > PTP and AB > PF–AB > PF. DC conductivity values for the PTP–AB and PF–AB composites were of the order of 10^?2 and 10^?3 S cm^?1, respectively. Copyright © 2004 Society of Chemical Industry     

Application of boundary element method to 3-D problems of coupled thermoelasticity

This paper deals with a new boundary element method for analysis of the quasistatic problems in coupled thermoelasticity. Through some mathematical manipulation of the Navier equation in elasticity, the heat conduction equation is transformed into a simpler form, similar to the uncoupled-type equation with the modified thermal conductivity which shows the coupling effects. This procedure enables us to treat the coupled thermoelastic problems as an uncoupled one, A few examples are computed by the proposed BEM, and the results obtained are compared with the analytical ones available in the literature, whereby the accuracy and versatility of the proposed method are demonstrated.     

热分析在PVA纤维预处理中的应用

用差热、热重法对原丝的热性能及由不同预处理方法所引起的PVA纤维的热行为变化进行了研究;并通过模拟脱水条件,用不同升温速率,求出了经不同预处理纤维的脱水反应活化能。结果表明,PVA原丝在230℃有一软化点,三种预处理都不同程度地影响了原丝的热效应变化;纤维在180～340℃主要为脱水反应;原丝及经脱水剂、O_3和O_3综合脱水剂处理的纤维,其脱水反应的表观活化能分别为:164.3kJ/mol,92.9kJ/mol,130.5kJ/mol和117.6kJ/mol。     

Time‐dependent heat transfer coefficient of a wall

A time‐dependent coefficient of heat transfer is proposed for the computation of thermal power required, so that a room temperature reaches a desired value within a given time. A mathematical formulation of the room heating transient phenomenon is constructed in a dimensionless form. Using an integral approximate solution an analytical expression for this coefficient is provided and it is verified by diagrams adopted by DIN 4701. Copyright © 2003 John Wiley & Sons, Ltd.     

A simplified method for modelling the effect of blinds on window thermal performance

An approximate method is presented for predicting the effect of a louvered blind on the centre‐glass thermal performance of a fenestration. The method combines a one‐dimensional heat transfer model with data from a numerical simulation of the window and blind. Sample results for a blind mounted on the indoor surface of a window show the effect of blind slat angle on heat transmission. Both summer and winter conditions are considered. The results show that a louvered blind can improve the U‐value of a standard double‐glazed window by up to 37%. Also, the radiation heat exchange with the room can be dramatically reduced (by up to 60%), which will improve the level of occupant comfort. However, there was found to be a trade‐off between U‐value and occupant comfort; placing the blind closer to the window improves the U‐value, but increases the radiation heat exchange with the room. The predictions from the present simplified method compare well with results from a full two‐dimensional computational fluid dynamics solution of the conjugate blind/window interaction. Copyright © 2005 John Wiley & Sons, Ltd.     

Sequence‐Specific Molecular Lithography Towards DNA‐Templated Electronics

Recent advances in the realization of individual molecular‐scale devices [1,2] highlight the integration of individual devices into large‐scale functional circuits as the major challenge. DNA‐programmed assembly is a promising avenue in that direction due to the large amount of information that can be coded into the molecules and the ability to translate that information into physical constructs [3]. Large‐scale DNA‐templated electronics require, however, complex manipulation of double‐stranded DNA (dsDNA) molecules, as well as patterning of the electrical properties instilled to them by, e.g., metallization. To that end, sequence‐specific molecular lithography on single DNA molecules has been developed [4]. This was achieved by harnessing the exquisite homologous recombination process of the RecA protein. Sequence‐specific patterning of the metal coating of DNA molecules, localization of arbitrary labeled molecular objects at any desired dsDNA address without prior modifications, and generation of molecularly accurate stable dsDNA‐dsDNA junctions are demonstrated. The information encoded in the DNA molecules directs the lithographic process in analogy to the masks used in conventional microelectronics. The RecA protein provides the assembling capabilities, as well as the resist function.     

A positive‐working photosensitive polyimide based on thermal cross‐linking and acidolytic cleavage

A novel positive‐working photosensitive polyimide (PSPI) based on a poly(hydroxyimide) (PHI), a crosslinking agent having vinyl ether groups, and a photoacid generator (PAG) was prepared. The PHI as a base resin of the three‐component PSPI was synthesized from 4,4′‐oxydiphthalic anhydride and 2,2′‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane through ring‐opening polymerization and subsequent thermal cyclization. 2,2′‐bis(4‐(2‐(vinyloxy)ethoxy)phenyl)propane (BPA‐DEVE) was used as a vinylether compound and diphenyliodonium 5‐hydroxynaphthalene‐1‐sulfonate was used as a PAG. The phenolic hydroxyl groups of the PHI and the vinyl ether groups of BPA‐DEVE are thermally crosslinked with acetal structures during prebake step, and the crosslinked PHI becomes completely insoluble in an aqueous basic solution. Upon exposure to UV light (365 nm) and subsequent postexposure bake (PEB), a strong acid generated from the PAG cleaves the crosslinked structures, and the exposed area is effectively solubilized in the alkaline developer. The dissolution behavior of the PSPI containing each 11.5 wt % of BPA‐DEVE and of the PAG was studied after UV exposure (365 nm) and PEB. It was found that the difference in dissolution rates between exposed and unexposed areas was enough to get high resolution. A fine positive pattern with a resolution of 5 μm in a 3.7‐μm‐thick film was obtained from the three‐component PSPI. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Study on the long‐term thermal‐oxidative aging behavior of polyamide 6

The long‐term thermal‐oxidative aging behavior of polyamide 6 (PA6) was studied by comparison with the stabilized sample in this work. The variation of mechanical properties of the pure and the stabilized samples of PA6 with aging time at 110°C, 130°C, and 150°C were investigated, respectively. The aging mechanism of PA6 under heat and oxygen was studied in terms of the reduced viscosity, crystallization behavior, dynamic mechanical behavior, and chemical composition through the methods of polarized light microscopy (PLM), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), X‐ray photoelectron energy spectrum (XPS), and so on. The results indicated that at the initial stage of aging, the molecular crosslinking reaction of PA6 dominated resulting in the increase of the mechanical strength, reduced viscosity, and the glass transition temperature of the sample. And the molecular degradation dominated in the subsequent aging process resulting in the decrease of the melting temperature, the increase of the crystallinity, and the formation of the oxides and peroxides products. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Polyurethane foams with 1,3‐pyrimidine ring

Attempts of obtaining of polyurethane foams using polyetherols with 1,3‐pyrimidine ring (obtained in reactions of 6‐aminouracil with oxiranes) are reported. Properties of the foams are investigated, especially their thermal stability. The foams show an improved thermal stability up to 200°C for a long time. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Influence of the amount of ferromagnetic addition on the rheological properties of spinning solutions,the structure,the strength,and thermal properties of polyacrylonitrile fibres

The rheological properties of spinning solutions of polyacrylonitrile in dimethyl formamide (DMF) containing various amounts of a ferromagnetic nanoaddition were investigated. The porous structure, the strength and thermal properties of fibers obtained from these solutions were assessed, as well as the uniformity of the nanoaddition distribution on the fiber surface was estimated. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008