基于MC9S12XET256MAL的汽车车身控制模块系统电路设计

本设计是以Freescale导体的MC9S12XET256MAL设计车载车身控制单元,主要实现功能包含车窗控制,车灯控制,背光控制,RKE,雨刮,清洗电机,防盗报警,中控门锁,行车喇叭,安全指示灯,CAN总线,LIN总线。增强汽车的安全、舒适和方便性。用户可以对外部按键操作实现相应功能,同时采集相关传感器自动实现相关功能,例如雨刮,防盗报警。利用总线将显示系统、驾驶员信息系统、导航系统、计算机网络系统、状态监测与故障诊断系统等连接。     

9Ni钢中马氏体孪晶界面结构研究

本文和电子显微研究了９Ｎｉ钢中马氏体孪晶界面精细结构，结果表明，马氏体孪晶不是平直的孪生面（１１２），而是由一系列以享生面（１１２）为平台的小平面组成的台阶状或凹凸不平的界面。小平面大多沿「１１０」方向形成，沿「１１１」方向较少形成。     

Effect of cooling and aging on microstructure and mechanical properties of Sn－9Zn solder

The microstructure and tensile properties of Sn-9Zn solder under different cooling and aging condition were studied.During solidification, the distribution of Zn-rich phases and grain size in the microstructure of Sn-9Zn solder were decided by the cooling rate.The Zn-rich phase in Sn-9Zn solder under furnace cooling, air cooling and water cooling media was separately existed as coarsen dendritic and needle like shape, fine needle like shape and very fine rod-like shape, respectively.After aging, the coarsen dendritic was broken and the coarsen needle like Zn-rich phase was partly changed into fine distribution of Zn-rich phase for Sn-9Zn solder with furnace cooling, and the rod-like Zn phase in the Sn-9Zn solder under water cooling was changed to conglomerated Zn with needle shape.During tensile testing on Sn-9Zn solder, tensile strength and ductility reached the best with water cooling, but decreased with aging effect.Meanwhile, the ductility of solder with air cooling and the strength of solder with furnace cooling increased with aging.The fracture mode was ductile and was independent of cooling media and aging effect.The size and depth of dimples decreased from water, furnace to air cooling.After aging, number and size of dimples increased on the solder with furnace cooling and air cooling.The change on the size of dimples for the Sn-9Zn solder under different cooling condition and with aging effect was accordance to the tensile properties.     

一类三元线性分组码的译码

Ｐｌｅｓｓ［１］证明了三元（１２，６，６）Ｇｏｌａｙ码具有一种双层结构，并据此给出了该码的快速硬判决译码算法。本文推广了Ｇｏｌａｙ码的Ｐｌｅｓｓ结构，给出了由三元（ｎ，ｋ，ｄ）线性分组码构造的三元（３，ｎ＋ｋ，≥ｍｉｎ（ｎ，２ｄ，６））线性分组码，其中包括（１２，６，６）Ｇｏｌａｙ码和（１８，９，６）码，并以三元（１８，９，６）码为例给出了这类码的最大似然软判决译码算法。     

2015年国外空空导弹发展动态研究

全面介绍了2015年国外空空导弹最新发展情况,重点论述了美国的AIM－9X, AIM－120, T3项目和微型自卫弹药（MSDM）,欧洲的ASRAAM, CAMM和“流星”,以色列I－Derby和印度的“阿斯特拉”等空空导弹最新研制进展和试验情况,并对空空导弹最新发展特点进行总结。     

Mg-9Gd-Sm-0.5Zr合金组织和力学性能研究

采用合金熔炼、组织分析和拉伸试验,研究Mg-9Gd-Sm-0.5Zr合金的微观组织和力学特性。结果表明,合金的组织由α-Mg基体、Mg5Gd和Mg41Sm5相组成,晶界上有许多颗粒状相和短棒状相,晶内分布少数尺度比较大的鱼骨状和块状析出相。与其它系镁合金不同的是,Mg-9Gd-Sm-0.5Zr合金抗拉强度随温度升高而升高。     

鄂尔多斯盆地伊陕斜坡长9烃源岩特征与生烃潜力

鄂尔多斯盆地伊陕斜坡发现多个长9烃源岩邻近的下组合含油有利区,为推进该区下组合石油勘探,亟需深化长9烃源岩特征及生烃潜力研究。利用测井、录井和岩心资料,分析研究区长9烃源岩分布特征。应用岩石热解、总有机碳、干酪根显微组分分析及饱和烃色谱-质谱生物标志化合物分析等方法,研究长9烃源岩地球化学特征与生烃潜力。结果表明,长9₁烃源岩在吴起、靖边、志丹、安塞等地区均有分布,厚度最大超20 m。长9₂烃源岩主要发育在甘泉—洛川地区,厚度最大超12 m。长9烃源岩有机质丰度较高,有机质来源于低等水生生物和陆源高等植物。有机质类型以Ⅰ型和Ⅱ₁型为主,处于成熟阶段,烃源岩生烃转化率高、生烃能力较强的区域主要为志丹—安塞地区。长9烃源岩多数为较好—好烃源岩,少数为优质烃源岩,具备较强的生烃能力和排烃能力,为伊陕斜坡延长组下组合石油聚集成藏提供了物质基础。     

基于ARM 9的电力电缆局部放电检测系统

高压XLPE电缆是电力系统的重要组成部分,通过监测电缆绝缘的局部放电,可以有效地判断电缆的电树枝老化状况,实现状态维修,这对电力系统的长期稳定运行具有重要意义。为此,文中设计了一种基于ARM9的嵌入式便携电力电缆局部放电监测系统,具有便携、易于接入网络、低成本的特点,适合于野外作业。     

Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint

To investigate the effect of stand-off height (SOH) on the microstructure and mechanical behavior of certain solder joints, Cu/Sn9Zn/Cu solder joints with a SOH of 100 μm, 50 μm, 20 μm, and 10 μm were prepared and studied. It was found that, as the SOH is reduced, the Zn content in the solder bulk experiences a rapid decrease due to consumption by metallurgical reaction in the reflow process; hence, the microstructure of the solder bulk is changed significantly from a Sn-Zn eutectic structure to a hypoeutectic structure. By contrast, Cu content in the solder bulk experiences a rapid increase with reducing SOH, and this leads to more dissociative intermetallic compounds (IMCs) in the solder bulk. These compositional and microstructural changes induced by reducing the SOH correlate closely with the mechanical properties of the solder joints. In our study it is found that, as SOH is reduced, the tensile strength of the solder joints decreases, the fracture path of the solder joint transfers from the solder bulk into the interface between the IMC layer and the solder bulk, and the fracture mode tends to change from ductile to brittle. These findings point to a probable way to improve the mechanical properties of miniaturized solder joints by controlling the composition and dissociative IMCs in the solder bulk.     

Effect of gas mixing ratio on etch behaviors of Ba2Ti9O20 (BTO) and Pt thin films in Cl2/Ar inductively coupled plasma

An investigation of the Ba₂Ti₉O₂₀ (BTO) and Pt thin films etch mechanism in the Cl₂/Ar inductively coupled plasma was carried out. It was found that an increase in Ar mixing ratio at fixed gas pressure and input power causes a fast decrease in the BTO etch rate (26.9-1.2 nm/min for 0-100% Ar) while the Pt etch rate increases slightly from 17.4-23.0 nm/min. Langmuir probe diagnostics and zero-dimensional plasma modeling provided the data on plasma parameters, steady-state composition and fluxes of active species on the etched surface. From the model-based analysis of etch kinetics, it was shown that the behavior of the BTO etch rate corresponds to the reaction-rate-limited etch regime, where the etch rate is limited neither by physical sputtering of the main material nor by the ion-stimulated desorption of low-volatile reaction products. The etch process of Pt appears in the transitional regime and is controlled by the neutral and ion fluxes together.