Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

锰铜基高阻尼合金中锌量的测定──硫氰酸盐萃取分离络合滴定法

基于甲基异丁基甲酮于稀盐酸介质中定量地萃取Ｚｎ￣（２＋）与ＣＮＳ￣－形成的络阴离子。从而达到与共存的锰、镍、铝、铬的完全分离。在有氟化物、硫脲存在时Ｆｅ￣（３＋）、Ｃｎ￣（２＋）和Ａｇ￣＋也不被萃取。有机相中的锌于ＰＨ５．５“六胺”缓冲介质中返萃取回水相，用ＥＤＴＡ滴定。在文中给定的条件下锌的一次被萃取率可达９９％以上，成功地解决了锰铜基高阻尼合金中共存离子对锌量测定的干扰问题。     

冶金过程中复杂夹杂物和钢液化学平衡计算

本文提出一个同温冶炼过程中预测非金属夹杂物沉淀的计算机程序。本研究中，多元硅酸盐溶体的Ｇｉｂｂｓ自由能由基于统计热力学的晶胞模型来计算，该晶胞模型按照氧与周围的阳离子构成的对称和非对称晶胞来描述硅酸盐熔体结构，假定高温冶炼时认与非金属夹杂物平衡，钢液中氧化物元素的活度由Ｗａｇｎｅｒ交互作用系数来计算，利用本程序可以估计炼钢时沉淀的非金属氧化物的成分，为调整冶炼工艺和提高产品质量提供指导，进一步可计     

超细Fe3O4粒子表面包覆酞菁钴性质研究

本文研究了合成载氧体的金属有机化学液相淀积法制造工艺，所得产物经ＴＥＭ、ＸＰＳ、Ｍｏｓｓ－ｂａｕｅｒ谱和Ｂ－Ｈ仪等手段，研究了它的结构和磁性能。实验表明，酞青钴以薄层形式包覆在Ｆｅ＿３Ｏ＿４的表面，封闭了Ｆｅ＿３Ｏ＿４的表面孔洞，稳定了Ｆｅ＿３Ｏ＿４的物相，增强了磁性能。     

光纤0_2/CO_2复合传感器的研制

本文报导一种新型的光纤氧、二氧化碳复合传感器.通过在同一敏感膜载体上固定两种不同的荧光试剂——芘丁酸及羟基芘三磺酸,制作了一种对氧和二氧化碳敏感的复合敏感膜.该传感器在医学临床检验范围内具有良好的线性,其测氧的分辩率是0.1％,测二氧化碳的分辩率是0.5％,响应时间短于1min.文中还讨论了三种敏感膜载体的比较及复合传感器测量进程中氧和二氧化碳的相互干扰问题.     

1，4－丁二醇的生产及市场需求

介绍了１，４－丁二醇的生产工艺、生产能力、产量和市场需求。     

ATMOSPHERIC DEPOSITION OF CHEMICAL SPECIES TO POLAR SNOW

Particles and gases can deposit from the atmosphere to polar snow by several mechanisms. Dry deposition can be considered to consist of three steps: aerodynamic transport from the free atmosphere to the viscous sublayer near the surface, boundary layer transport across the sublayer, and interactions with the surface. The particle dry deposition mass flux is dominated by the largest particles present in a size distribution. Wet deposition includes in-cloud and below-cloud scavenging, where the former refers to uptake of particles during nucleation of cloudwater as well as scavenging of particles and gases by existing droplets and ice crystals. Of all the wet deposition mechanisms, nucleation scavenging is often the most important mechanism for particles in the polar regions. Finally, incorporation of particles and gases into fog droplets and subsequent settling of the fog to the snow surface can be an important removal process in regions of frequent fog. For Summit, Greenland, the total deposition of MSA, SO₄^2-, Na⁺, K⁺, and Ca²⁺ during May 24-July 13, 1993 was dominated by wet deposition: this mechanism accounted for an average of 62% of the total deposition for these species. Fog and dry deposition accounted for 21% and 17% of the total, respectively. These results suggest that all three mechanisms may need to be considered when estimating total deposition of certain chemical species to polar snow.     

液闪效率示踪法校正效果的评价

本文评价了Aloka商品液闪仪效率示踪法dpm校正的效果。轻,中度猝灭校正效果理想,具有简便、实用和适用性广泛的特点。严重化学和颜色猝灭样品的校正结果分别随猝灭增加而向增大和减小的方向偏离,形成喇叭状曲线,文中对这一现象给出初步解释。