GaN外延结构中微区应变场的测量和评价

 采用电子背散射衍射(EBSD)技术,测量GaN/蓝宝石结构中的弹性应变场.将EBSD菊池衍射花样的图像质量IQ值及小角度错配作为应力敏感参数,表征GaN-Buffer层-蓝宝石结构中的晶格畸变和转动,显示微区弹性应变场.在GaN/蓝宝石系统中,弹性应变的影响范围大约200×700nm.采用快速傅立叶变换(FFT)提取菊池花样的衍射强度,识别GaN外延结构中的应变/无应变区域.     

86.5GHz下输出功率257mW的 W波段GaN MMIC放大器

我们报道了一个三级W波段GaN MMIC功率放大器。考虑到W波段MMIC的耦合效应,所有的匹配电路和偏置电路都是先进行电路仿真以后,再用3D电磁场仿真软件进行系统的仿真。此MMIC功率放大器在频率为86.5GHz下输出功率能达到257mW,相应的功率附加效率(PAE)为5.4%,相应的功率增益为6.1dB。功率密度为459 mW/mm。另外,此MMIC功率放大器在83 GHz到90 GHz带宽下有100mW以上的输出功率。以上特性都是在漏极电压为12V时测试得到。     

立方相GaN的高温MOCVD生长

利用MOCVD技术在提高生长温度(900℃)下生长出了高质量的立方相GaN,生长速度提高到1.6μm/h.高温生长的GaN样品近带边峰室温光荧光半高宽为48meV,小于在830℃下生长的GaN样品.在ω扫描模式下,X射线衍射表明高温生长的GaN具有较小的(002)峰半高宽21′.可以看出,尽管立方GaN是亚稳态,高生长温度仍然有利于其晶体质量的提高.本文对GaN生长中生长温度和生长速度之间的关系作了讨论.     

面向高速应用的GaN基HEMT器件

工作在毫米波、亚毫米波频段的固态功率放大器可广泛应用于无线通信、汽车雷达等电子系统。氮化物材料具备禁带宽度大、电子速度高等特点,使得GaN 基HEM T 器件成为面向高频器件和高速数字电路等高速应用的理想候选器件。但是为实现更佳的器件指标,仍需要进行多层次的设计和优化。重点讨论了面向高速应用的GaN 基器件所面临的挑战,如载流子限域性、电子速度以及在等比例缩小规律下的导通电阻等问题。分析表明,这些问题的解决将使GaN 基器件在高速、高频等领域得到广泛应用。     

氮化镓薄膜的研究进展

主要讨论了Ⅲ—Ⅴ族化合物半导体材料氮化镓(GaN)薄膜的制备工艺、掺杂、衬底和缓冲层等相关问题，并提出了目前GaN研究中所面临的主要问题以及氮化镓材料的应用前景。     

Extraction of physical Schottky parameters using the Lambert function in Ni/AlGaN/GaN HEMT devices with defined conduction phenomena

Electrical characterization analyses are proposed in this work using the Lambert function on Schottky junctions in GaN wide band gap semiconductor devices for extraction of physical parameters. The Lambert function is used to give an explicit expression of the current in the Schottky junction. This function is applied with defined conduction phenomena, whereas other work presented arbitrary (or undefined) conduction mechanisms in such parameters'' extractions. Based upon AlGaN/GaN HEMT structures, extractions of parameters are undergone in order to provide physical characteristics. This work highlights a new expression of current with defined conduction phenomena in order to quantify the physical properties of Schottky contacts in AlGaN/GaN HEMT transistors.     

High-performance and current crowding-free InGaN-GaNbased LEDs integrated by an electrically-reverse-connected Schottky diode and a Mg-delta doped p-GaN

This work demonstrates high-performance and current crowding-free InGaN/GaN light-emitting diodes (LEDs) using an electrically-reverse-connected Schottky diode (SD) and an Mg-delta (δ) doped layer.Poss...     

Recent progress of physical failure analysis of GaN HEMTs

Gallium nitride (GaN)-based high-electron mobility transistors (HEMTs) are widely used in high power and high frequency application fields,due to the outstanding physical and chemical properties of the GaN material.However,GaN HEMTs suffer from degradations and even failures during practical applications,making physical analyses of post-failure devices extremely significant for reliability improvements and further device optimizations.In this paper,common physical characterization techniques for post failure analyses are introduced,several failure mechanisms and corresponding failure phenomena are reviewed and summarized,and finally device optimization methods are discussed.