基于能带调制模型的高压增强型AlGaN/GaN HFET器件

提出了一种能带调制模型,通过在异质结界面处引入负离子电荷(如氟离子)调制异质结处的局部能带分布,实现了对异质结界面处的高密度2DEG的改变。基于能带调制模型,提出了一种复合调制沟道AlGaN/GaNHFET器件。通过在增强型沟道调制区和RESURF调制区分别引入不同剂量的负离子,不仅实现了增强型器件,而且可以降低尖峰电场,优化异质结电场分布,提高器件击穿电压。通过器件仿真软件对其器件工作原理进行了模拟分析,并通过实验结果表明,其器件品质因子FOM由传统器件的4.8MW.cm-2提高到26.7MW.cm-2。     

The profile of temperature and voltage dependent series resistance and the interface states in (Ni/Au)/Al0.3Ga0.7N/AlN/GaN heterostructures

The temperature dependence of capacitance-voltage (C-V) and the conductance-voltage (G/w-V) characteristics of (Ni/Au)/Al_0.3Ga_0.7N/AlN/GaN heterostructures were investigated by considering the effect of series resistance (R_s) and interface states N_ss in a wide temperature range (79-395 K). Our experimental results show that both R_s and N_ss were found to be strongly functional with temperature and bias voltage. Therefore, they affect the (C-V) and (G/w-V) characteristics. The values of capacitance give two peaks at high temperatures, and a crossing at a certain bias voltage point (∼3.5 V). The first capacitance peaks are located in the forward bias region (∼0.1 V) at a low temperature. However, from 295 K the second capacitance peaks appear and then shift towards the reverse bias region that is located at ∼−4.5 V with increasing temperature. Such behavior, as demonstrated by these anomalous peaks, can be attributed to the thermal restructuring and reordering of the interface states. The capacitance (C_m) and conductance (G/w-V) values that were measured under both reverse and forward bias were corrected for the effect of series resistance in order to obtain the real diode capacitance and conductance. The density of N_ss, depending on the temperature, was determined from the (C-V) and (G/w-V) data using the Hill-Coleman Method.     

压电半导体的极化处理及性能研究

极化处理是压电半导体材料制备及构件设计中的关键工艺,直接影响着其压电性能。根据夹层极化的方法,研制出一种多样性极化实验装置,解决了压电半导体的极化问题,并对极化后的GaN材料性能进行了系统研究。实验结果表明:(1)极化使GaN材料具备了压电性能,改变了其力电性能参数;(2)极化显著提高了压电半导体的导电能力,改变了其弯曲强度。     

基于表面势的GaN HEMT 集约内核模型

从器件表面势机理出发,考虑载流子浓度升高时费米势的变化,首次在二维泊松方程中引入新的费米势近似式,重构表面势源头方程,提出了一种直接基于表面势建立氮化镓高电子迁移率晶体管(GaN HEMT)器件模型的方法,建立了包括积累区和过渡区的物理基集约内核模型。表面势引入模型突破了现有的建模技术,给集约模型的建立提供可信的内核模型方程和理论基础。模型采用解析近似求解获得表面势,Pao-Sah模型验证可行性,I-V、C-V特性曲线与TCAD软件仿真的结果有很好的拟合,能准确描述各种偏置条件下GaN HEMT的电流、电荷特性。     

GaN基发光二极管芯片光提取效率的研究

基于蒙特卡罗方法模拟分析了限制GaN基发光二极管(LEDs)芯片光提取效率的主要因素。结果表明,GaN与蓝宝石之间的较大折射率差别严重限制了芯片光提取效率的提高,通过蓝宝石背面出光比通过p型GaN层的正面出光的芯片光提取效率至少高20％;同时,低GaN光吸收系数、高电极反射率以及环氧树脂封装可以有效的增加芯片光提取效率,并且LEDs芯片尺寸在400μm以下时光提取效率较高。     

HEMT太赫兹探测器响应度和NEP的检测与分析

在0.8～1.1 THz内,对AlGaN/GaN高电子迁移率晶体管(HEMT)太赫兹探测器的响应度和噪声等效功率进行了具体测试和分析。在太赫兹波辐射下,HEMT太赫兹探测器源漏端产生能被栅压灵敏调控的直流光电流。该型探测器在300 K和77 K下的电流响应度分别为83 mA/W和4.1 A/W,电压响应度分别为4 kV/W和50 kV/W,噪声等效功率分别达到22 pW/Hz0.5和1 pW/Hz0.5。采用两种较为典型的测量方法,通过对实验结果的比较,确定了影响该类型探测器的响应度和噪声等效功率的主要因素,并提出了增强响应度和降低噪声等效功率的具体措施。     

Traps centers and deep defects contribution in current instabilities for AlGaN/GaN HEMT's on silicon and sapphire substrates

AlGaN/GaN high electron mobility transistors (HEMTs) with Si and Al₂O₃ substrates reveals anomalies on I_ds-V_ds-T and I_gs-V_gs-T characteristics (degradation in drain current, kink effect, barrier height fluctuations, etc.). Stress and random telegraph signal (RTS) measurements prove the presence of trap centers responsible for drain current degradation. An explanation of the trapping mechanism responsible for current instabilities is proposed. Deep defects analysis performed by capacitance transient spectroscopy (C-DLTS), frequency dispersion of the output conductance (G_ds(f)), respectively, on gate/source and drain/source contacts and RTS prove the presence of deep defects localized, respectively, in the gate and in the channel regions. Defects detected by C-DLTS and G_ds(f) are strongly correlated, respectively, to barrier height inhomogeneities and kink anomalies. Gate current analysis confirms the presence of (G-R) centers acting like traps at the interface GaN/AlGaN. Finally, the localization of these traps defects is proposed.     

GaN基蓝光发光二极管峰值波长偏移的研究

通过对蓝光和红光发光二极管在直流和脉冲电流两种情况下进行变电流测试,对其峰值波长的偏移情况进行了深入的对比分析和研究,指出主要是热效应和极化效应两个因素造成蓝光LED的峰值波长发生偏移,并计算出热效应单独引起峰值波长偏移的温度系数为0.080 7nm/K,In0.2Ga0.8N/GaN发光二极管量子阱中的极化强度为3.765 0 MV/cm;分析还认为电流注入下多量子阱中栽流子分布不均匀也是影响器件峰值波长的一个因素,并计算得到去除极化影响后量子阱中的场强,验证了在电流注入下多量子阱中载流子分布不均匀的结论.     

InGaN/GaN多量子阱蓝光LED的p-GaN盖层的MOCVD生长研究

利用金属有机物化学气相淀积（MOCVD）生长了InGaN／GaN多量子阱（MQW）蓝光发光二极管（LED）,研究了不同Cp2Mg流量下生长的p-GaN盖层对器件电学特性的影响。结果表明,随着Cp2Mg流量的提高,漏电流升高,并且到达一临界点会迅速恶化;正向压降则先降低,后升高。进而研究相同生长条件下生长的p-GaN薄膜的电学特性、表面形貌及晶体质量,结果表明,生长p-GaN盖层时,Cp2Mg流量过低,盖层的空穴浓度低,电学特性不好;Cp2Mg流量过高,则会产生大量的缺陷,盖层晶体质量与表面形貌变差,使得空穴浓度降低,电学特性变差。因此,生长p-GaN盖层时,为使器件的正向压降与反向漏电流均达到要求,Cp2Mg流量应精确控制。     

GaN薄膜制备及脉冲激光沉积法的研究进展

介绍了国内外制备GaN材料的历史和现状。分析了GaN材料及其薄膜的各种制备工艺的特点,并详细介绍了采用激光沉积工艺制备GaN薄膜的研究进展。