衡阳钢管厂Φ89mm半浮芯棒连轧管机组工艺及设备结构特点

衡阳钢管厂Φ８９ｍｍ半浮芯棒连轧管机组是一种新型机组，其选配的变形工艺路线能很好地适应生产小规格的热轧无缝钢管。本文论述了该机组的工艺及设备结构特点。     

新型耐磨蚀铸造高铬钢的研制

本文设计了用于含有磨粒的强酸介质的新型耐磨蚀钢的化学成分，采用金相显微镜、Ｘ射线衍射、扫描电子显微镜、腐蚀与磨蚀试验等方法，观察与分析了钢的显微组织与磨蚀形貌，研究了新型铸造高铬钢的性能，并对其磨蚀机理进行了较为深入的探讨。试验结果表明，较高的含铬量和含碳量与适量的钼、铜的复合使用，使新型高铬钢具有比高合金化的ＺＳ２８合金更好的抗磨蚀性能，而且成本比较低，具有广阔的应用前景。     

AlSn20Cu/Steel双金属板(带)复合轧制过程的厚度匹配

通过对AlSn20Cu/Steel双金属板(带)复合轧制过程变形区变形规律的分析，确定了轧制过程的总变形率与各分层变形率的关系，解决了实际生产中各分层原料的厚度匹配问题。     

宽带钢冷轧机颤振控制的数值模拟

本文以较为准确的轧机振动状态下的轧制压力模型为基础，对宽带钢冷轧机干摩擦阻尼减振进行了数值模拟的研究。研究结果与实际观测值相等。     

Stress concentration and fatigue of profiled reinforcing steels

Stress concentrations arise from profiles of ribbed reinforcing steel bars and in this study the results of calculated stress concentration factors (SCF), by using finite element method, are related to the fatigue test results. It is apparent that the degree of confinement of a ribbed bar embedded in concrete not only affects the magnitude of the ultimate bond stress but also the bond stress-slip relation. Thus the rib geometry or profile pattern is designed for optimum bond characteristics and not for fatigue considerations. However the rib geometry influences the fatigue performance through the SCFs arising from the root radius, width and flank angles of the profiles. It is shown that these latter factors have a significant influence on the fatigue behaviour of reinforcing steel bars.     

基于呼叫中心的客户关系管理系统服务流程优化研究

针对钢铁企业物流公司客户关系管理现状,及其客户服务请求处理流程中的不足,提出了基于呼叫中心的钢铁企业最优化客服请求处理流程及其技术实现,给出了平台功能设计,探讨了平台实现的关键技术。该系统充分满足客户满意度以及服务请求处理的及时性,快速性,确切性,可操作性等方面要求。     

Thermodynamic calculation of S−Sb system and Cu−S−Sb system

Sb₂S₃ and CuSbS₂ have been proposed as alternative earth-abundant absorber materials for thin-film solar cells. However, no thermodynamic study of the S−Sb binary system and the Cu−S−Sb ternary system were investigated. In this paper, The S−Sb system and the Cu−S−Sb system are calculated utilizing the so-called CALPHAD (CALculation of PHAse Diagrams) technique. Using TEM-EDS and XRD, Cu_0.9Sb₁S₂ is experimentally confirmed at the Cu₁Sb₁S₂ and Sb₂S₃ two-phases region in the isothermal section at 673 K of the Cu−S−Sb ternary system. Given the asymmetric shape and miscibility gap of the liquidus in the S−Sb phase diagram, the associate solution model for the liquid phase is adopted. The solution phases (liquid, bcc, fcc) are treated with the Redlich–Kister equation. The compounds S₃Sb₂, Cu₃SbS₃, Cu₁₂Sb₄S₁₃, CuSbS₂, and Cu₃SbS₄ are described as a stoichiometric compound. A set of self-consistent thermodynamic parameters of the S−Sb binary system and the Cu−S−Sb ternary system are obtained. The calculated results are in good agreement with the experimental data. This study provides a set of reliable thermodynamic parameters to the Cu−Sb−S thermodynamic database, and a cost-effective tool to design material synthesis experiments and manufacturing processes.     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

基于2,4-二羟基苯甲酸铜(Ⅱ)为载体的硫氰酸根电极的电位响应

制备了基于一种简单的金属铜配合物2,4-二羟基苯甲酸铜(Ⅱ)(Cu(Ⅱ)DHBA)为载体的PVC膜硫氰酸根离子(SCN-)选择性电极。该电极在1.0×10-1～1.0×10-6mol/LSCN-浓度范围内呈现斜率为-59.5mV/dec的近Nernst电位响应,检测下限为9.1×10-7mol/L。利用紫外可见光谱及交流阻抗技术初步探讨了电极对SCN-呈现的选择性电位响应机理。该电极作为直接电位分析法的指示电极,成功运用于实验室废水中硫氰酸盐含量的测定。     

Cu—Cr合金电极触头板铸件的熔制

含０．４％～１．０％Ｃｒ的Ｃｕ－Ｃｒ合金具有优良的导电、导热性能，铸件经热处理强化后可获得较高的综合力学性能。近年来该合金作为一种新材料被广泛地用于制作电子工业、电器设备上的电极触头板、接触环、夹持体等零件。Ｃｕ－Ｃｒ合金存在易氧化吸气、凝固范围窄、收缩较大、易形成集中缩孔等缺陷，这些铸造特性给生产优良的Ｃｕ－Ｃｒ合金铸件带来一定的困难。以采用常规的熔炼设备和造型材料熔铸出Ｃｕ－Ｃｒ合金铸件——高压大电流电极触头板为例讨论这一熔铸的工艺方法。