微晶合金在电流互感器中的应用

从微晶合金的性能特点出发，分析了其在电流互感器中的应用前景。     

TiAl基合金板材制备技术的发展现状

综述了TiAl基合金板材制备技术的发展现状。介绍了的制备TiAl基合金板材三种技术的工艺过程及制得的TiAl基合金板材的显微组织和力学性能。     

45钢表面超音速电弧喷涂Ti-Al涂层的组织与性能研究

采用自行开发研制的超音速电弧喷设备，在45钢表面制成了钛铝合金复合涂层。并利用金相显微镜、X射线衍射仪、扫描电镜、电子探针，对涂层的成分、相结构、显微组织及其结合强度、显微硬度进行了研究。结果表明，利用超音速电弧喷涂设备，可以在45钢表面形成 度高、孔隙率低，结合强度较好和硬度高的Ti-Al合金涂层。     

电沉积法制备铜分散电极

研究了电沉积制备铜分散电极的方法,通过对阴极极化曲线的测试,考察了电流密度及不同冲击电流方式对铜粉粒度的影响。结果表明:适当的电流密度、合适的分散剂、间歇式的电流是得到较细铜粉的条件。同时对铜分散电极的电化学性质进行初步测试,结果表明铜粉细化以后,铜分散差电池的电动势值有所上升。     

高温预析出对Al-Zn-Mg系铝合金时效硬化和应力腐蚀的影响

研究了高温固溶后降温处理工艺对中强可使预析出LC52和7039铝合金的组织、时效硬化和应力腐蚀的影响。金相观察发现,高温预析出可优先在晶界处产生,并提高随后时效状态下晶界析出相的不连续分布程度,温度降低到一定程度晶内和晶界产生大量析出。合金拉伸性能和应力腐蚀结果表明,预析出在保持强度和塑性的同时,可提高抗应力腐蚀性能。而预析出温度降低,合金强度呈下降趋势。     

Influence of inhibitor addition on the corrosion protection performance of sol–gel coatings on AA2024

Sol–gel films are actively investigated during the last decade as possible candidates for environmentally friendly pre-treatments. However, the important drawback in this case is the lack of active corrosion protection and self-healing ability.     

EIS evaluation of the filiform corrosion of aluminium coated by a cataphoretic paint

Filiform corrosion is mainly considered as a cosmetic attack and is undesirable in most applications. The initiation and propagation of the filaments are related to different parameters such as the presence of defects, the permeability of the coating to water and oxygen, the adherence of the paint system and the presence of salts.

The aim of this work is to study the behaviour of painted aluminium samples towards filiform corrosion or delamination. The 6082 Aluminium alloy was selected and the samples were covered with a cataphoretic epoxy primer without lead (PPG Industries France). Prior to the application of the electrocoat, the samples were pre-treated by a commercial Zr/Ti or chromate conversion treatment or simply etched with a commercial acid etching product.

Filiform corrosion was studied by the normalized test (ISO/DIS 4623): painted and scratched samples were inoculated in HCl and exposed in a constant humidity chamber at 40 °C and 82% RH for 3 weeks. After exposure the samples were subjected to a visual and optical microscopic examination.

Electrochemical impedance spectroscopy was used to study the sensitivity to filiform corrosion. The operating mode of this test is similar to the normalized one. The samples were scratched before inoculation for 1 h in HCl and then exposed to the humidity chamber for a maximum of 4 days. The samples were tested by EIS in an acidified 0.1 M Na₂SO₄ electrolyte solution. The resulting impedance spectra were analyzed with an appropriate equivalent electrical circuit which allows the evaluation of the exposed metallic surface area, directly related to the extent of filiform corrosion or delamination. Different parameters were varied: the exposure time in the humidity chamber; the immersion time in the electrolyte sulphate solution as well as its pH and the coating thickness.     

FeBP非晶态合金超细微粒的合成及其对PH3分解的催化作用

用化学还原法合成了FeBP非晶态合金超细微粒，用电感耦合等离子体光谱（ICP）、X射线粉末衍射（XRD）、透射电子显微镜（TEM）和差热分析（DSC）等手段对其进行了物性表征，并用微型催化反应装置考察了其对PH3分解的催化作用，结果表明，非晶态合金FeBP对PH3的分解具有良好的催化作用，能使PH3的分解温度从800℃以上降到500℃左右。490℃时分解率超过90％，540℃时达100％。     

Influence of nano-scaled dispersed second phase on substructure of deformed dispersion strengthened copper alloy

The deformation behavior of dispersion strengthened copper alloy Cu-Al2O3 was studied by TEM. The results show that nano-scaled dispersed second phase not only increases dislocation density in matrix, but also has an important influence on the dislocation substructure. The presence of fine dispersed Al2 O3 particles results in a uniform and random dislocation distribution in matrix copper and causes the difficulty in formation of dislocation cell structure and the decrease in the amount of cell structure during deformation. Deformation gives rise to much more dislocations and dislocation cells form more difficultly and the decrease in the cell size with the increase of dispersion degree.