液态金属离子源发射尖的制备工艺与技术

发射尖是液态金属离子源(LMIS)的关键部件之一，其性能的优劣直接影响到整个离子源的工作稳定性。通过对系统软件和硬件的设计，开发了一套发射尖自动腐蚀装置，该装置可以对发射尖腐蚀过程中的速度和深度以及腐蚀电压进行控制，实现发射尖腐蚀工艺的重复性、可靠性，从而为液态金属离子源以及聚焦离子束系统的研制、开发提供了一个有效的辅助工具。     

Magnetic effects of direct ion implantation of Mn and Fe into p-GaN

In p-GaN implanted with Mn (3×10¹⁶ cm⁻² at 250 keV), the material after annealing shows ferromagnetic properties below 250 K. Cross-sectional transmission electron microscopy (TEM) revealed the presence of platelet structures with hexagonal symmetry. These regions are most likely Ga_xMn_1−xN, which produce the ferromagnetic contribution to the magnetization. In p-GaN implanted with Fe, the material after annealing showed ferromagnetic properties at temperatures that were dependent on the Fe dose, but were below 200 K in all cases. In these samples, TEM and diffraction analysis did not reveal any secondary phase formation. The results for the Fe implantation are similar to those reported for Fe doping during epitaxial growth of GaN.     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

真空微电子荧光平板显示器件的实验研究

真空微电子荧光平板显示器件的实验研究刘杰明，李志能，陈秀峰（浙江大学信息与电子工程学系）关键词：真空微电子，反应离子刻蚀一、引言近十年来，随着真空微电子学的崛起，利用微细加工技术，使真空元器件集成化和高性能化已成为可能，一种新型场致发射阵列真空荧光平...     

离子注入中污染的产生及防护

本文概述了离子注入过程中污染产生的原因和防止污染的措施，特别强调了对微粒污染和金属污染的防护以满足ＵＬＳＩ加工对离子注入的要求。     

GaN and AlGaN high-voltage rectifiers grown by metal-organic chemical-vapor deposition

In this paper, we report the study of the electrical characteristics of GaN and AlGaN vertical p-i-n junctions and Schottky rectifiers grown on both sapphire and SiC substrates by metal-organic chemical-vapor deposition. For GaN p-i-n rectifiers grown on SiC with a relatively thin “i” region of 2 μm, a breakdown voltage over 400 V, and forward voltage as low as 4.5 V at 100 A/cm² are exhibited for a 60-μm-diameter device. A GaN Schottky diode with a 2-μm-thick undoped layer exhibits a blocking voltage in excess of ∼230 V at a reverse-leakage current density below 1 mA/cm², and a forward-voltage drop of 3.5 V at a current density of 100 A/cm². It has been found that with the same device structure and process approach, the leakage current of a device grown on a SiC substrate is much lower than a device grown on a sapphire substrate. The use of Mg ion implantation for p-guard rings as planar-edge terminations in mesageometry GaN Schottky rectifiers has also been studied.     

氧化锌压敏电阻的老化机理

研究了ZnO压敏电阻的老化现象,提出了一种新的老化机理-线性链理论。该理论认为,在外电场作用下,压敏电阻势垒高度降低;当降低到一定值时,晶界可变电阻转化为线性晶界电阻,从而压敏链转化为线性链。线性链是稳定的,因而压敏电阻老化到一定程度后其电性能将不能完全恢复。     

荷能束辐照致使Cu/Ag表面偏析的研究

本文研究了金属(Cu)/金属(Ag衬底)系统的荷能束辐照引起的表面偏析现象。观察到Cu在多晶Ag衬底上溅射淀积过程中,Ag原子在Cu膜表面的偏析,且淀积Cu原子能量越大,Ag原子偏析程度越大,即观察到了淀积Cu原子10~(-1)～1eV量级的平均能量差异对膜层表面偏析行为的影响。对溅射淀积所得膜层进行keV量级的离子束辐照,Ag原子的表面偏析程度更甚。     

再生用碱的质量对阴离子交换树脂性能的影响

我国许多电厂在再生阴离子交换树脂时都习惯采用隔膜法生产的工业氢氧化钠，这种氢氧化钠中的杂质离子含量较高，会对阴离子交换树脂的性能产生很大的影响。就碱中杂质成分对阴离子交换树脂的影响，通过比较两种不同纯度的碱再生后的阴离子交换树脂的技术经济性，提出再生阴离子交换树脂时应优先选择纯度较高的碱。     

铜线材酸性高速电镀致密光亮锡、锡铜合金

为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 .5mm的铜线上电镀Sn和Sn Cu合金镀层。DL0 1、0 2的主要成分是无芳香族的希夫碱 ,DL0 3的主要成分是醇醛缩合物。结果表明 ,在含有DL0 1、0 2、0 3和 35g/LSnSO4 ,137g/LH2 SO4 的镀液中 ,在Jc=10～ 90A/dm2 ,v=16 0～ 314m/min时 ,所得镀层致密、柔软、光亮。在含CuSO4 ·5H2 O 0 .5 ,3.5g/L的硫酸镀槽中 ,在Jc=9,18A/dm2 ,v=16 0m/min时获得了致密、柔软、光亮的Sn (0 .3%～ 0 .6 % )Cu合金镀层。