碳化硅金刚线切割表面粗糙度的研究

碳化硅是新兴的第三代半导体材料。用固定磨料金刚线切割机对其进行切割加工,分析了加工过程的各项参数对晶片表面粗糙度的影响,为优化碳化硅金刚线切割过程提出依据。     

Evolution of grain structure in thin film reactions

In this paper, we examine, both experimentally and theoretically, the kinetics of formation and microstructure of product phases in thin film reactions, using the Nb/Al and Ti/Al systems as our prototypes. The results of calorimetry and microscopy studies are interpreted using simple kinetic and morphology models. In particular, the kinetic models employed here focus on the nucleation and growth components of the phase formation process and the morphology models provide a starting point for the classification of product grain structures. An erratum to this article is available at .     

Control of Al and B doping transients in 6H and 4H SiC grown by vapor phase epitaxy

The atomic concentration profiles in 4H and 6H SiC created by Al and B doping turn-on and turn-off during vapor phase epitaxy (VPE) was investigated by secondary ion mass spectrometry (SIMS). It was found that dopant traces were adsorbed to the reactor walls and re-evaporated after the dopant precursor flow was switched off. This adsorption/re-evaporation process limits the doping dynamic range to about three orders of magnitude for Al, and two orders of magnitude for B. An order of magnitude in doping dynamics could be gained by simultaneously switching the gases and changing the C:Si precursor ratio. By adding a 10 min growth interruption with an H or HC1 etch at the doping turn-off, the background doping tail could be considerably suppressed. In total, a doping dynamics for Al of almost five orders of magnitude can be controlled within a 30 nm layer. For B, the dynamic range is more than three orders of magnitude, and the abruptness is most probably diffusion limited. Abackground doping level of 2 × 10¹⁵ cm⁻³ for Al and 2 × 10¹⁶ cm⁻³ for B was obtained. For Al, the background doping is most probably due to the adsorption/re-evaporation of dopants at the reactor walls; while for B, the background doping may in addition be limited by diffusion.     

2.25Cr-1Mo钢焊接接头蠕变后焊缝中 M6C碳化物的析出位向关系

本文用透射电镜研究了２．２５Ｃｒ－１Ｍｏ钢焊接接头蠕变后焊缝中的Ｍ６Ｃ碳化物。结果表明,高温长期蠕变促进了Ｍ６Ｃ的析出长大,从焊缝内析出的Ｍ６Ｃ与α－Ｆｅ铁素体间存在Ｎ－Ｗ位向关系,即：（１１１）Ｍ６Ｃ∥（１１０）ａ「０１１）Ｍ６Ｃ∥「００１」ａ。文中还讨论分析了其他两种取向关系：（１１１）Ｍ６Ｃ∥（１１０）ａ;「１０１」Ｍ６Ｃ∥「１１１「ａ及（１１１）Ｍ６Ｃ∥（１１０）ａ;「１１２」Ｍ６Ｃ∥「１     

Y_2O_3-MgO-Al_2O_3烧结助剂对SiC陶瓷烧结和导热性能的影响

对SiC粉体进行热处理,采用Y2O3-MgO-Al2O3烧结助剂,在1 750~1 950℃下30 MPa热压烧结1 h,制备SiC陶瓷。TG分析SiC的氧化特性,测定Zeta-电位研究SiC粉体的分散特性,测定其高温浸润性研究烧结助剂与SiC之间的亲和性。结果表明:SiC粉体热处理和提高SiC浆体的pH值,有利于提高Zeta-电位,进而提高分散均匀性;Y2O3-MgO-Al2O3烧结助剂高温下与SiC具有良好的浸润性;SiC粉体热处理明显降低了烧结温度。尽管Y2O3-MgO-Al2O3烧结助剂在高温下有一定的挥发,但是当其含量大于等于9%(质量分数)时,1 800~1 950℃下热压烧结可获得显气孔率小于等于0.19%的致密SiC陶瓷,其热导率大于190 W.m–1.K–1。     

碳化硅衬底精密加工技术

介绍了一种包含多线切割、研磨、抛光等主要工序的75 mm(3英寸)碳化硅衬底精密加工技术,该技术成功对本单位自主研制的碳化硅衬底进行精密加工。实验过程中使用了几何参数测试仪、强光灯、微分干涉显微镜(DIC)、原子力显微镜(AFM)、扫描电镜(SEM)等检测手段对加工工艺效果进行监控。通过该技术制备出了几何尺寸参数良好、表面质量优良的碳化硅晶片。     

新型阶梯变掺杂SiC漂移阶跃恢复二极管

漂移阶跃恢复二极管(DSRD)一般应用于超宽带脉冲信号源,可以将纳秒级高压脉冲换向负载,这对于输出脉冲的上升前沿有很高的要求.文章提出了一种具有基区变掺杂的新型宽禁带材料漂移阶跃恢复二极管,将传统的基区掺杂变为阶梯式的浓度分布,基区内形成由浓度差导致的内建电场,该内建电场在DSRD放电回路反向泵浦阶段调节载流子分布,并...     

MoO2/Mo2C Heteronanotubes Function as High‐Performance Li‐Ion Battery Electrode

Instead of carbon, Mo₂C is used to modify the MoO₂ material for the first time. The presence of highly conductive and electrochemical inactive Mo₂C decreases the resistance of the charge transport and enhances the structural stability of MoO₂ nanoparticles upon lithiation and delithiation, ensuring the superior cycling stability and high rate capability of the heteronanotubes. Cycled at 200 and 1000 mA g^?1 for 140 cycles, the discharge capacities of the MoO₂/Mo₂C heteronanotubes remain to be 790 and 510 mAh g^?1, respectively. This work demonstrates the potential of the novel heteronanotubes for application as an electrode material for high‐performance Li‐ion batteries.     

非晶碳化硅薄膜的结构及其光学特性研究

采用等离子体增强化学气相沉积系统制备非晶碳化硅薄膜,通过控制反应气体中甲烷和硅烷的流量比R来调节薄膜中的碳/硅比,获得具有不同碳/硅比的薄膜结构.采用Raman、XPS以及FT-IR等技术手段对样品的结构进行表征.通过对样品吸收谱的测量,对样品的光学特性进行了研究.研究结果表明,薄膜中C-H键以及Si-C键含量的增加引起薄膜的光学带隙展宽,在R=10时薄膜的光学带隙达到2.4 eV.     

Comparison of Solid-State Microwave Annealing with Conventional Furnace Annealing of Ion-Implanted SiC

Rapid solid-state microwave annealing was performed for the first time on N⁺-, Al⁺-, and B⁺-implanted SiC, and the results were compared with the conventional furnace annealing. For microwave annealing, temperatures up to 2,000 °C were attained with heating rates exceeding 600 °C/s. An 1,850 °C/35 s microwave anneal yielded a root-mean-square (RMS) surface roughness of 2 nm, which is lower than the 6 nm obtained for 1,500 °C/15 min conventional furnace annealing. For the Al implants, a minimum room-temperature sheet resistance (R _s ) of 7 kΩ/□ was measured upon microwave annealing. For the microwave annealing, Rutherford backscattering (RBS) measurements indicated a better structural quality, and secondary-ion-mass-spectrometry (SIMS) boron implant depth profiles showed reduced boron redistribution compared to the corresponding results of the furnace annealing.