基于维氏硬度的粗集料磨光值衰减模型

测试了硅质石灰岩、石灰岩、玄武岩和辉绿岩4种岩石粗集料的维氏硬度、洛杉矶磨耗值和磨光值.依照渐近指数函数形式建立了基于维氏硬度的粗集料磨光值衰减模型.结果表明：粗集料洛杉矶磨耗值、磨光稳定终值与粗集料维氏硬度相关性良好;粗集料磨光值衰减速率与粗集料硬度、矿物颗粒间硬度差异有关,粗集料磨光稳定终值则取决于粗集料维氏硬度.     

环带式磁流变抛光装置设计

针对"点接触"磁流变抛光技术存在对机床机械结构精度要求高,需对被抛光表面进行预抛光处理和抛光效率低等问题,提出一种采用环带式磁流变抛光技术实现平面和球面光学零件抛光的方法。该方法基于"面接触"抛光思想,采用闭合直流环带旋转磁场实现对工件抛光的原理,设计出了平面和球面光学元件自动抛光装置。分析了硬件控制和软件设计的具体结构,并采用制作出的装置进行相应的工艺实验。实验结果表明,该方法能够实现平面和球面光学元件的抛光需求。     

在铜CMP过程中降低抛光压力与磨料的机械作用

Chemical mechanical planarization(CMP) is a critical process in deep sub-micron integrated circuit manufacturing. This study aims to improve the planarization capability of slurry, while minimizing the mechanical action of the pressure and silica abrasive. Through conducting a series of single-factor experiments, the appropriate pressure and the optimum abrasive concentration for the alkaline slurry were confirmed. However, the reduced mechanical action may bring about a decline of the polishing rate, and further resulting in the decrease of throughput.Therefore, we take an approach to compensating for the loss of mechanical action by optimizing the composition of the slurry to enhance the chemical action in the CMP process. So 0.5 wt% abrasive concentration of alkaline slurry for copper polishing was developed, it can achieve planarization efficiently and obtain a wafer surface with no corrosion defect at a reduced pressure of 1.0 psi. The results presented here will contribute to the development of a “softer gentler polishing” technique in the future.     

Design surfaces by laser remelting

Molds and dies are used today in the manufacturing of a wide range of industrial products. They have a broad field of applications from the air and space technology, the automotive sector, to electrical engineering, to household products and consumer goods. The surface of a part or product strongly influences its properties and functions e.g. it's visual appearance. The gloss thereby reflects one of the most important properties of a surface when it comes to evaluate the visual appearance. Therefore, among others, in this paper the influence of laser polishing on the generated specular gloss is investigated for the hot work steel 1.2343 (AISI: H11). On the one hand laser polished surfaces are measured by WLI and investigated by a spectral analysis of surfaces roughness. A spectral analysis is achieved by a discrete convolution of the surface profile with a Gaussian loaded function similar to ISO 11562. On the other hand specular gloss measurements were carried out at 20°, 60° and 85°. For the experiments a fiber‐coupled solid state disc laser (Yb : YAG; Q‐switched) is used (P_L,max = 550 W; repetition frequency: f_P = 5–20 kHz, pulse duration: t_P = 0,7–3,5 µs, pulsed and cw‐operation). In general, scanning velocity and average laser power are two crucial procedural parameters for laser polishing with significant influence on the resulting surface roughness. These procedural parameters are investigated systematically, while other procedural parameters, such as laser beam diameter d_L = 250 µm and track offset dy = 25 µm were kept constant. By this a significant reduction of roughness was achieved, especially for the wavelength interval λ < 320 µm. A correlation between specular gloss of surfaces and the measured micro‐roughness is carried out. In order to make a systematic classification laser polished fields are compared to surfaces which were prepared by conventional mechanical manufacturing processes, such as turning, milling, grinding, high end manual polishing etc. Specular gloss shows a good exponential correlation with micro‐ and meso‐roughness were as macro roughness shows no significant influence on the specular gloss. Additionally, a complete process chain for selectively laser polishing of metallic surfaces was developed in order to apply different levels of gloss onto free formed work pieces. Selective laser polishing and the process chain are demonstrated for a free formed tool insert with leather textured surface, where only the indentations of the leather texture were laser polished selectively.     

线性液动压抛光流场的剪切特性研究

以动压润滑理论为基础,推导了线性液动压抛光的流场剪切力数学模型。借助FLUENT软件研究了流场底面的剪切力分布,通过单因素控制变量试验探究了各参数对剪切力的影响规律,灵敏度从高到低依次为：抛光间隙、抛光液黏度、抛光辊子转速、抛光辊子半径。以正交试验结果为训练集,建立了基于支持向量回归（SVR）的剪切特性预测模型,相关系数为98.35%、均方误差为3.44×10-3。最后计算了剪切力理论值。对比发现,数值模拟和理论计算误差在15%以内;不同参数组合下剪切力分布趋势相同;SVR预测模型可信度高。     

基于溶胶凝胶法的纳米磨料抛光工具基体特性研究(英文)

相对于传统化学机械抛光(CMP)技术存在的磨料浪费和抛光液污染环境等问题,一种以海藻酸钠(SA)水凝胶为基体的纳米磨料抛光工具开始展现其潜在的应用前景和环保优势.为了解决凝胶干燥成膜过程中基体严重收缩导致的磨料层很薄以及储存过程中基体继续失水引起的工具表面干裂失效等问题,采用了向基体中添加干燥控制化学添加剂(DCCA)的方法;并通过正交实验和极差分析,分析了不同DCCA对基体收缩的影响程度,选择了最佳的添加剂浓度配比.最后通过硅片抛光试验,对改良后的工具加工性能进行了检验.试验结果表明,向基体中添加质量分数为4%的纳米二氧化硅、12%的蔗糖和0.14%的十二烷基硫酸钠(SDS)对基体收缩的抑制效果最明显,磨料层的厚度提高了1.7倍,且在储存过程中不再出现明显的脱水失效.同时,该工具的基体变成了疏松多孔的结构,进而提高了工具的加工性能.     

一种提高光学零件沥青盘修形抛光稳定性的新方法

材料去除的时不变性是计算机控制光学修形的基础.为了提升沥青盘数控抛光的材料去除稳定性,采用抛光液喷淋添加方式进行光学零件沥青盘数控抛光.从沥青盘的力学特性出发,根据沥青材料针入度与温度的规律确定抛光液喷淋添加方式能够有效控制加工区域的温度,从而显著提高了抛光稳定性和大幅度延长了沥青盘使用寿命.同时,提出了最佳喷淋温度的选取策略来指导加工,研究结果对提升光学零件沥青盘抛光收敛效率和抑制误差具有重要意义.     

布线图案导致的集成电路平坦化损伤研究

使用化学机械抛光(CMP)的方式,对商用芯片进行拆解,获得了不同制造工艺的铜/低k介质互连结构样品。通过对所获得的32 nm制造工艺的铜/低k介质互连结构样品进行进一步的化学机械抛光实验来研究抛光过程中出现的损伤。实验结果发现,抛光压力过大和过小分别会造成宏观缺陷和导线腐蚀,互连线的分布会导致导线自身的碟型缺陷、不同图案布线结构交界两侧明显的表面高度差异以及同一图案布线结构内部的表面周期性高度起伏。这种表面高度差异可以通过预补偿的方式得到一定的改善。     

碳化硅反射镜表面粗糙度的优化

空间光学技术的迅猛发展对空间光学系统提出了更高的要求;碳化硅材料以其优秀的物理性质,成为广泛应用的反射镜材料;碳化硅反射镜的光学加工研究也在国内外广泛开展。简要讨论了碳化硅反射镜的抛光机理;介绍了碳化硅材料抛光的实验方法;定性分析了碳化硅材料的抛光过程;通过大量的工艺实验和理论分析,讨论磨料粒度、抛光盘材料、抛光盘压力、抛光盘转速、抛光液酸碱度等工艺参数对碳化硅反射镜表面粗糙度的影响,并对各个参数加以优化,得到了优良的实验结果。     

磁力电解复合抛光片的研制

根据磁力电解复合抛光对抛光片的特殊要求,本文利用TPU材料强度高、耐磨性好的特点,以TPU为基体,添加磨料和各种助剂,并对其进行微孔处理和合理配方,采用注射成型工艺,研制出了一种硬度和拉伸强度高、耐磨性和开孔性好的磁力电解复合抛光片.并且通过对不锈钢材料工件的磁力电解复合抛光试验,验证了该磁力电解复合抛光片的良好性能.