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Lead-bismuth eutectic (LBE) has good characteristics for the coolant and/or target of various nuclear systems, but it also has a problem of polonium contamination. In the study, baking experiment was performed to remove polonium contamination on type 316 stainless steel plate that was originated from neutron irradiated LBE. The contaminated type 316 stainless steel plate was baked in a vacuum condition at various temperatures from 200°C to 600°C. In the previous preliminary study, the effect of short time baking was investigated. In the study, the effect of long time baking was investigated. The detail of the experimental method was also described. The result of long time baking experiment showed that the baking method was effective for removal of polonium from stainless steel surface contaminated by neutron irradiated LBE, if the baking was performed at 500°C and higher in a vacuum condition. The obtained result was consistent to the previous preliminary study. 相似文献
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The thermal conductivities of three plasma-sprayed cermets have been determined over the temperature range 23–630°C from the measurement of the specific heat, thermal diffusivity, and density. These cermets are mixtures of Al and SiC prepared by plasma spray deposition and are being considered for various applications in magnetic confinement fusion devices. The samples consisted of three compositions: 61 vol% Al/39 vol% SiC, 74vol% Al/26vol% SiC, and 83 vol% Al/17 vol% SiC. The specific heat was determined by differential scanning calorimetry through the Al melt transition up to 720°C, while the thermal diffusivity was determined using the laser flash technique up to 630°C. The linear thermal expansion was measured and used to correct the diffusivity and density values. The thermal diffusivity showed a significant increase after thermal cycling due to a reduction in the intergrain contact resistance, increasing from 0.4 to 0.6 cm2·–1 at 160°C. However, effective medium theory calculations indicated that the thermal conductivities of both the Al and the SiC were below the ideal defect-free limit even after high-temperature cycling. The specific heat measurements showed suppressed melting points in the plasmasprayed cermets. The 39 vol% SiC began a melt endotherm at 577°C, which peaked in the 640–650°C range depending on the sample thermal history. Chemical and X-ray diffraction analysis indicated the presence of free silicon in the cermet and in the SiC powder, which resulted in a eutectic Al/Si alloy.Paper presented at the Ninth Symposium on Thermophysical Properties, June 24–27, 1985, Boulder, Colorado, U.S.A. 相似文献
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本文通过理论分析,导出了共晶生长条件下液相中溶质分布规律的一般表达式。理论结果表明,在快速生长条件下,λ~2V 不为常数,与生长速度 V、分配系数 K 和相体积比 f 等因素有关。Jackson—Hunt 模型中的λΔT、(ΔT~2)/V 关系在一般条件下应为λ(ΔT-ms)、(ΔT-ms)~2/V。在快速凝固条件下λ(ΔT-ms)和(ΔT-ms)~2/V 均不为常数,与 V、K、f 等因素有关。 相似文献
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针对ZM5铸镁缺陷补焊难题,开展光纤激光填丝焊接工艺特性研究,并采用SEM及EDS对焊缝组织进行分析。结果表明,激光束离焦量增加至20 mm时,由激光深熔焊变为热导焊模式,焊缝变宽,熔深变小,稀释率降至0.65,焊缝成形良好;随激光功率增加,稀释率变大,润湿角变大;焊接速度减小,稀释率变小。激光功率为2.1 k W,焊接速度v=0.5 m/min,稀释率为0.52,焊缝成形良好。激光热导焊接热输入小,焊缝组织晶粒细化,先析出α-Mg相基体弥散分布β-Mg17Al12与δ-Mg共晶相。 相似文献
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Metal wafer bonding is being investigated in industry and research fields due to the relatively low process temperatures (T?500?°C) and, at the same time, to obtain a metallic junction able to offer greater reliability compared with other materials. In this work, electrodeposition of eutectic Sn-Cu alloy, suitable for wafer bonding, was studied using ethylene glycol (EG) as a solvent. The resulting organic electrolyte was used for its promising properties, such as a wider electrochemical window than traditional aqueous electroplating baths. Ethylene glycol solutions containing copper(II) and tin(II) chloride salts were characterised electrochemically by means of cyclic voltammetry (CV) and linear sweep voltammetry (LSV). Deposition was performed both under direct (DC) and pulsed (PC) current conditions and the advantages of the latter are discussed, also in terms of surface morphology as observed by scanning electron microscope (SEM). Wafer bonding was successfully achieved and the interdiffusion of copper and tin species in the bonding region is discussed. 相似文献
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