CdTe and HgTe surface growth kinetics for molecular and metalorganic molecular beam epitaxy

The surface growth kinetics of CdTe and HgTe have been investigated during molecular and metalorganic molecular beam epitaxy. The surface growth kinetics was studied through in-situ measurements of the growth rate as a function of flux ratio and substrate temperature on the (001), (111)B, and (211)B CdTe surface orientations. For the (001) and (111)B CdTe growth kinetics, the existence of low binding energy surface precursor sites was proposed for both molecular and atomic growth species before lattice incorporation. Intensity oscillations were observed during HgTe growth on misoriented (111)B surfaces and during CdTe growth on the (211)B orientation. The (211)B surface reconstructions displayed both vicinal and singular surface characteristics, depending on the growth flux ratio.     

Rapid thermal annealing effects on the photoluminescence properties of molecular beam epitaxy-grown GaIn(N)As quantum wells with Ga(N)As spacers and barriers

This article describes the effects of rapid thermal annealing (RTA) on the photoluminescence (PL) emission from a series of GaIn(N)As quantum wells. Indium compositions of both 20% and 32% were examined with nominal N compositions of 1% or 2%. The N location was varied within our quantum structure, which can be divided into three regions: (1) quantum well, (2) Ga(N)As spacer layers at the barrier-to-well interface and well-to-barrier interface, and (3) barriers surrounding each quantum well. Eight combinations of samples were examined with varying In content, Ga(N)As spacer layer thickness, N content, and N location in the structure. In the best cases, the presence of these Ga(N)As spacer layers improves the PL properties, due to annealing, with a reduction in the emission wavelength blueshift by ～400 Å, a reduction of the decrease in the full-width at half-maximum (FWHM) by ～5 meV, and a threefold reduction of the increase in integrated intensity. It was also observed that relocating N from the quantum wells to the barriers produces a comparable emission wavelength both before and after annealing. Our results further show that the composition of incorporated N in the material is most influential during the stages of RTA in which relatively small amounts of thermal energy is present from our lower annealing times and temperatures. Hence, we believe a low thermal-energy anneal is responsible for the recovery of the plasma-related crystal damage that was incurred during its growth. However, the In composition in the quantum well is most influential during the latter stages of thermal annealing, at increased times and temperatures, where the wavelength blueshift was roughly independent of the amount of incorporated N. As a result, our investigations into the effects of RTA on the PL properties support other reports that suggest the wavelength blueshift is not due to N diffusion.     

InAlSb/InAs/AlGaSb Quantum Well Heterostructures for High-Electron-Mobility Transistors

Heterostructures for InAs-channel high-electron-mobility transistors (HEMTs) were investigated. Reactive AlSb buffer and barrier layers were replaced by more stable Al_0.7Ga_0.3Sb and In_0.2Al_0.8Sb alloys. The distance between the gate and the channel was reduced to 7–13 nm to allow good aspect ratios for very short gate lengths. In addition, n⁺-InAs caps were successfully deposited on the In_0.2Al_0.8Sb upper barrier allowing for low sheet resistance with relatively low sheet carrier density in the channel. These advances are expected to result in InAs-channel HEMTs with enhanced microwave performance and better reliability.     

Influences of silicon doping in quantum dot layers on optical characteristics of InAs/GaAs quantum dot infrared photodetector

We have investigated the effects of silicon doping concentration within thirty-period self-assembled quantum dot (QD) layers on quantum dot infrared photodetectors (QDIPs). The lens-shaped quantum dots with the dot density of 1 × 10¹¹ cm^− 2 were observed by atomic force microscope (AFM). From the high ratio of photoluminescence (PL) peak intensities from dot layer to that from wetting layer, we have concluded that high dot density caused the short diffusion length for carriers to be easily captured by QDs. Moreover, the Si-doped samples exhibited the multi-state transitions within the quantum dots, which were different to the single level transition of undoped sample. Besides, the dominant PL peaks of Si-doped samples were red-shifted by about 25 meV compared to that of the undoped sample. It should result from the dopant-induced lowest transition state and therefore, the energy difference should be equal to the binding energy of Si in InAs QDs.     

采用Ti/TiW/Au栅制作Si衬底上CaAs MESFET与集成电路

本文从制备硅集成电路(SiIc)与砷化镓集成电路(GaAs IC)单片兼容电路的要求出发,提出了Ti/TiW/Au肖特基金属化结构,制备出了性能良好的Ti/TiW/Au栅Si衬底上分子束外延(MBE)的GaAsMESFET与GaAs IC。     

Galvanomagnetic properties of two-dimensional electron gases in strain relaxed InxGa1−xAs(x<0.40) heterostructures grown by molecular beam epitaxy on GaAs substrates

We have investigated, as a function of indium content x, the galvanomagnetic and Shubnikov de Haas (SdH) properties of two-dimensional electron gases (2DEG) formed at lattice matched, strain relaxed InAlAs/InGaAs heterojunctions. These were grown by molecular beam epitaxy on GaAs misoriented substrates with a two degree offcut toward the nearest (110) plane. Variable temperature resistivity and Hall measurements indicate an increase in the electron sheet density n_s from 0.78×10¹²cm⁻² for x=0.15 to 1.80×10¹² cm⁻² for x=0.40 at 300K, and from 0.75×10¹²cm⁻² to 1.67×10¹²cm⁻² at T=1.6K. The room temperature electron mobility, measured along the in plane [110], direction is independent of indium content and equals approximately 9500 cm²/Vs. For T<50K, the mobility is independent of temperature decreasing with increasing x from 82000 cm²/Vs for x=0.15 to 33000 cm²/Vs for x=0.40. The ratios (τ_t/τ_q) at 1.6K between the electron relaxation time τ_t and the single particle relaxation time τq, for the strain relaxed specimens, as well as for pseudomorphically strained Al_0.35Ga_0.65As/In_0.15Ga_0.85As structures grown on GaAs substrates, and In_0.52Al_0.48As/In_0.53Ga_0.47As heterostructures grown lattice matched on InP substrates. Such a study indicates the presence of inhomogeneities in the 2DEGs of the strain relaxed specimens which appear to be related to the process of strain relaxation. Such inhomogeneities, however, have little effect on the electron relaxation time τ_t which, at low temperatures, is limited principally by alloy scattering.     

Optical and Structural Properties of CdTe Grown by Molecular Beam Epitaxy at Low Temperature for Resonant-Cavity-Enhanced HgCdTe Detectors

Investigation into resonant-cavity-enhanced (RCE) HgCdTe detectors has revealed a discrepancy in the refractive index of the CdTe layers grown by molecular beam epitaxy (MBE) for the detectors, compared with the reported value for crystalline CdTe. The refractive index of the CdTe grown for RCE detectors was measured using ellipsometry and matches that of CdTe with an inclusion of approximately 10% voids. X-ray measurements confirm that the sample is crystalline and strained to match the lattice spacing of the underlying Hg_(1−x)Cd_(x)Te, while electron diffraction patterns observed during growth indicate that the CdTe layers exhibit some three-dimensional structure. Secondary ion mass spectroscopy results further indicate that there is enhanced interdiffusion at the interface between Hg_(1−x)Cd_(x)Te and CdTe when the Hg_(1−x)Cd_(x)Te is grown on CdTe, suggesting that the defects are nucleated within the CdTe layers.     

Molecular-beam epitaxial growth of HgCdTe infrared focal-plane arrays on silicon substrates for midwave infrared applications

Molecular beam epitaxy has been employed to deposit HgCdTe infrared detector structures on Si(112) substrates with performance at 125K that is equivalent to detectors grown on conventional CdZnTe substrates. The detector structures are grown on Si via CdTe(112)B buffer layers, whose structural properties include x-ray rocking curve full width at half maximum of 63 arc-sec and near-surface etch pit density of 3–5 × 10⁵ cm⁻² for 9 μm thick CdTe films. HgCdTe p⁺-on-n device structures were grown by molecular beam epitaxy (MBE) on both bulk CdZnTe and Si with 125K cutoff wavelengths ranging from 3.5 to 5 μm. External quantum efficiencies of 70%, limited only by reflection loss at the uncoated Si-vacuum interface, were achieved for detectors on Si. The current-voltage (I-V) characteristics of MBE-grown detectors on CdZnTe and Si were found to be equivalent, with reverse breakdown voltages well in excess of 700 mV. The temperature dependences of the I-V characteristics of MBE-grown diodes on CdZnTe and Si were found to be essentially identical and in agreement with a diffusion-limited current model for temperatures down to 110K. The performance of MBE-grown diodes on Si is also equivalent to that of typical liquid phase epitaxy-grown devices on CdZnTe with R₀A products in the 10⁶–10⁷ Θ-cm² range for 3.6 μm cutoff at 125K and R₀A products in the 10⁴–10⁵ Θ-cm² range for 4.7 μm cutoff at 125K.     

分子束外延生长液晶光阀用ZnSxSe1-x薄膜的研究

描述了ZnSxSe1-x光盲紫外液晶光阀的结构和工作原理 ,并从器件的电学模型出发 ,着重讨论了整体器件对ZnSxSe1-x光敏层的特殊要求。采用分子束外延技术在ITO导电玻璃上制备了具有 (111)面定向生长结构的ZnSxSe1-x多晶薄膜 ,通过控制反应时的生长参数 ,制备出了符合器件设计要求的光敏层薄膜。室温下 ,该薄膜的紫外 /可见光响应对比度大于10 3 ;响应波长截止边可通过控制薄膜中的Se组分 ,在 (36 0～ 4 10 )nm范围内连续可调 ;薄膜的暗电阻率在 (4 32× 10 9～ 2 0 3×10 11)Ω·m之间 ,并随着晶粒的增大而减小 ;在液晶光阀工作的低频段 (<2 0 0Hz) ,其光 /暗阻抗比在 0 2 2～ 0 36之间。     

RHEED振荡精确测量AlGaAs生长速率研究

采用分子束外延技术,在GaAs衬底上生长GaAs,AlAs和AlGaAs时,实现RHEED图像和RHEED强度振荡的实时监测已被证明是一种有效工具。通过RHEED可讨论GaAs表面结构和生长机制,并可以估算衬底温度,更重要的是能计算出材料的生长速率。RHEED强度振荡周期决定生长速率,每一个周期对应一个单层。实验测量GaAs的生长周期为0.82s,每秒沉积1.22单分子层,AlAs的生长周期为2.35s,每秒沉积0.43单分子层。