Crude Oil Production

Current data on crude oil, field/lease condensate, and natural gas liquids produced from NGL plants. Updated on a monthly basis.     

Natural Gas Production

Current data on natural gas production, as well as a breakdown of production by country. Updated on a monthly basis.     

自恢复的电子纸屏幕显示管理策略研究

电子纸电子书阅读器的技术不断进步,但是电子纸屏幕始终存在刷新速度慢、屏幕残影和清除残影刷新闪烁的问题,增加了电子纸屏幕控制软件的设计复杂度。文章提出了屏幕衰老和屏幕恢复的概念,基于此概念对电子纸屏幕刷新过程的用户阅读舒适度建立数学模型描述,针对该模型提出了自恢复的屏幕管理算法,并通过实验验证了算法的有效性。     

番茄黄瓜菜汁豆腐加工工艺

以番茄汁、黄瓜汁和大豆为原料研制了色泽美观的天然、营养豆腐,丰富了豆腐的品种,有良好的发展前景。     

刺桐花红色素的稳定性研究

研究了刺桐花红色素的提取方法和稳定性。结果表明：用酸醇溶液提取刺桐花红色素可得到较稳定的红色素,在60℃以下、pH小于5的酸性条件下稳定性好;对有机酸、碳水化合物、多种金属离子较稳定;但对光比较敏感;在中性和碱性条件下不稳定。     

电解电容器脉冲老练法及电源的研制

在氧化膜修补机制的基础上,分析了老练工序费时的根本原因,并据此研究了脉冲老练法,开发出脉冲老练电源。对比实验表明,可将高压老练时间从11.0h缩短到2.5h,能保证电容器具有同等的电性能与寿命,且对高温贮存寿命试验的漏电流回升有明显改善,可节约高压电容器的制造成本5%～10%。     

JUFrame应用服务器的ARX老化模型

针对JUFrame应用服务器老化情况,设计了多种类型的客户请求程序和服务器端程序,记录了各种参数共计5类36个参数;对影响应用服务器中间件性能的主要指标采用多维时间序列分析的方法建模。用实测数据进行分析的结果表明,用所建模型得到的预测值能很好地拟合原始数据,该模型可以用于系统实际运行时的预测,预测结果可作为再生的依据;与一维AR模型相比,预测精度提高了7%。     

老化处理试验对铜箔与树脂基板的附着性的影响

概述了镀锌的铜箔暴露于老化处理氛围中（313K,90％RH,168h）以后,铜箔上镀锌层的取向和HCl浸渍后的剥离损失对附着性的影响。试验结果表明箔镀层（0002）取向的锌基面比其它取向具有较低的HCl浸渍后的剥离损失。     

AI虚拟数字人技术在融合媒体生产中的运用

重大活动无线电安全保障肩负着贯彻国家安全战略,维护社会稳定,维护国家形象的重要使命。通过对重大活动无线电安全保障工作内容的梳理,深化对无线电保障工作的认识,更好地服务于今后的重大活动无线电保障工作。     

Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150°C) were studied. Composite solders were prepared by either incorporating 2 wt.% Cu (3 μm to 20 μm) or Cu₂O (∼150 nm) particles into SAC405 paste. Aggressive flux had the effect of reducing the Cu₂O nanoparticles into metallic Cu which subsequently reacted with the solder alloy to form the Cu₆Sn₅ intermetallic. While all solders had similar interfacial intermetallic growth upon reflow, both of the composite solders’ growth rates slowed through aging to reach a common growth rate exponent of approximately 0.38, considerably lower than that of the nonreinforced solder (n = 0.58). The nanoscale reinforced solder additionally exhibited the highest tensile strength in both the initial and aged conditions, behavior also attributed to its quick conversion to a stable microstructure.