Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High-Temperature Applications

There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high-temperature packages, but the high costs and lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost and time benefits, as well as 3D structures and embedded features. However, the properties and reliability of additive packaging materials at extreme temperatures are not well known. Herein, the reliability at temperatures up to 750 °C in terms of electrical performance and mechanical strength of aerosol jet printed gold thick films onto ceramic substrates are assessed. Thermal coefficient of resistance of printed gold films is measured. The electrical resistance stability and leakage current of printed gold structures are also characterized during over 100 h of aging at temperatures up to 750 °C. Finally, the mechanical adhesion strength of the printed gold films is evaluated after aging for 100 h at temperatures up to 750 °C. The adhesion of the printed gold to the ceramic substrates remains high after aging, very stable resistances and minimal leakage currents have been observed.     

Flexible amorphous‐silicon non‐volatile memory

Abstract— The development of a flexible, rewritable, non‐volatile memory (NVM) that is implemented on a standard, low‐temperature a‐Si:H process without additional mask steps is reported. This NVM is a part of a flexible‐display system. Each NVM cell is composed of differentially configured thin‐film‐transistors (TFTs). The cell reads out one of two stable states depending on the relative threshold voltages of the differentially configured TFTs. Information is stored in each cell by increasing the threshold voltage of one differential TFT or the other, utilizing the well‐known electrical‐stress degradation intrinsic to a‐Si:H TFTs. The stored information is retained indefinitely with no applied power. A test array of individually addressable NVM cells has been successfully fabricated and tested on flexible stainless‐steel substrates. Read and write operation, as well as preliminary reliability measurements, are described. The design is readily scalable to large memory arrays.     

Temporary bond—debond technology for high‐performance transistors on flexible substrates

Abstract— A processing technology based upon a temporary bond—debond approach has been developed that enables direct fabrication of high‐performance electronic devices on flexible substrates. This technique facilitates processing of flexible plastic and metal‐foil substrates through automated standard semiconductor and flat‐panel tool sets without tool modification. The key to processing with these tool sets is rigidifying the flexible substrates through temporary bonding to carriers that can be handled in a similar manner as silicon wafers or glass substrates in conventional electronics manufacturing. To demonstrate the power of this processing technology, amorphous‐silicon thin‐film‐transistor (a‐Si:H TFT) backplanes designed for electrophoretic displays (EPDs) were fabricated using a low‐temperature process (180°C) on bonded‐plastic and metal‐foil substrates. The electrical characteristics of the TFTs fabricated on flexible substrates are found to be consistent with those processed with identical conditions on rigid silicon wafers. These TFTs on plastic exhibit a field‐effect mobility of 0.77 cm²/V‐sec, on/off current ratio >10⁹ at Vds = 10 V, sub‐threshold swing of 365 mV/dec, threshold voltage of 0.49 V, and leakage current lower than 2 pA/μm gate width. After full TFT‐array fabrication on the bonded substrate and subsequent debonding, the flexible substrate retains its original flexibility; this enables bending of the EPD display without loss in performance.     

电子类专业计算机网络课程实践教学体系

针对电子类专业人才对网络技术的新需求,以该专业的网络应用为背景,从培养具有创新精神的电子类应用型人才角度出发,提出一个电子类专业计算机网络课程的实践教学体系,以提高教学效果和学生的综合应用能力。     

Operational active fire mapping and burnt area identification applicable to Mexican Nature Protection Areas using MODIS and NOAA-AVHRR direct readout data

Since 1999, the National Commission for the Knowledge and Use of the Biodiversity (CONABIO) in Mexico has been developing and managing the “Operational program for the detection of hot-spots using remote sensing techniques”. This program uses images from the MODerate resolution Imaging Spectroradiometer (MODIS) onboard the Terra and Aqua satellites and from the Advanced Very High Resolution Radiometer of the National Oceanic and Atmospheric Administration (NOAA-AVHRR), which are operationally received through the Direct Readout station (DR) at CONABIO. This allows the near-real time monitoring of fire events in Mexico and Central America. In addition to the detection of active fires, the location of hot spots are classified with respect to vegetation types, accessibility, and risk to Nature Protection Areas (NPA). Besides the fast detection of fires, further analysis is necessary due to the considerable effects of forest fires on biodiversity and human life. This fire impact assessment is crucial to support the needs of resource managers and policy makers for adequate fire recovery and restoration actions. CONABIO attempts to meet these requirements, providing post-fire assessment products as part of the management system in particular for satellite-based burnt area mapping. This paper provides an overview of the main components of the operational system and will present an outlook to future activities and system improvements, especially the development of a burnt area product. A special focus will also be placed on the fire occurrence within NPAs of Mexico.     

基于传感器的汽车主动安全设计

从汽车主动安全方面进行研究,通过对车辆道路行驶时关键要素的危险状态识别,实现完善汽车主动安全性能.本设计采取自动控制方法,通过研究汽车防碰撞检测和预防以及偏离车道报警,为汽车安全系统提供信息支持,实现车辆主动避免碰撞危险,减少或避免交通事故发生,大大提高汽车行驶主动安全性.所设计汽车主动安全防撞系统主要包括激光防撞测距、激光车道检测、报警警示系统等.     

一种面向汽车电子的配置界面动态生成方法

汽车电子的开发需要根据特定硬件平台资源情况对基础软件功能进行裁剪,而汽车电子的基础软件模块具有配置需求量大、复杂度高等特点。因此,设计一种具有高可配置性、通用的配置工具原型,具有非常重要的应用推广价值。针对汽车电子基础软件的实际需求,提出一种动态生成配置界面的方法。该方法分离配置参数与配置界面,从而极大提高配置工具的可扩展和可维护性。实验结果显示该方法是可行且有效的。     

电子设备冷却中热电制冷的设计与应用

大适当的应用条件下,热电制冷是一种有效的电子设备冷却方法,经济性是热电制冷器设计与使用的核心问题,本文分析了制冷量对热电制冷设计和控制的影响,给出了一种提高制冷器运行经济性的控制方法。