The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules

Thermo-electric modules (TEMs) can be used to convert heat into electricity by utilizing the Seeback effect. It is now possible to buy BiTe thermo-electric modules that can operate up to temperatures of around 300 °C. However, many applications, such as the harvesting of excess gas turbine heat, may occur at higher temperatures. Therefore, new materials and manufacturing processes need to be developed to produce packaged TEMs that can operate at a maximum operating temperature of 650 °C. Two critical areas in the manufacture of a SiGe TEM are the choice and strength of materials used to both sintered joint the TE material to the rest of the module and the metal used for the interconnects. The interconnection material needs to be sufficiently strong to withstand large temperature fluctuations while maintaining a low contact resistance, as well as being compatible with the nano-Ag sintered joint. Shear force tests of the sintered thermo electrical leg material showed that the joints are brittle when sintered to W metallized AlN substrates are used and ductile fracture behavior when sintered to Cu metallized AlN substrates using the NanoTach K nano silver paste. Almost all of the joints were found to be brittle when using the NachTach X nano silver paste. Shear testing of the sintered joints showed that the X paste joints were variable in strength and stiffness, having a typical Young’s modulus between 10 and 100 MPa at room temperature. The K paste joints were stiffer, but had a similar strength as compared to the X paste joints.     

Efficient design of parity preserving logic in quantum-dot cellular automata targeting enhanced scalability in testing

Design of parity preserving logic based on emerging nanotechnology is very limited due to present technological limitation in tackling its high error rate. In this work, Quantum-dot cellular automata (QCA), a potential alternative to CMOS, is investigated for designing easily testable logic circuit. A novel self-testable logic structure referred to as the testable-QCA (t-QCA), using parity preserving logic, is proposed. Design flexibility of t-QCA then evaluated through synthesis of standard functions. The programmability feature of t-QCA is utilized to implement an ALU, realizing six important functions. Although the parity preservation property of t-QCA enables concurrent detection of permanent as well as the transient faults, an augmented test logic circuit (TC) using QCA primitives has been introduced to cover the cell defects in nanotechnology. Experimental results establish the efficiency of the proposed design that outperforms the existing technologies in terms of design cost and test overhead. The achievement of 100% stuck-at fault coverage and the 100% fault coverage for single missing/additional cell defects in QCA layout of the t-QCA gate, address the reliability issues of QCA nano-circuit design.     

一种直线感应电机的电磁场有限元分析

直线感应电机目前已经在地铁、轻轨等轨道交通中得到了很好的应用，在高速交通系统和其它一些游乐设施中也有光明的前景。本文针对正在建设中的直线电机综合测试试验台所用的直线电机，通过合理简化的方法建立了MAXWELL2一D仿真模型，同时也介绍了该类电机的结构和其传统等值电路。通过对有限元仿真结果与直线电机等效电路的计算值比较研究，发现用这两种不同方法得出的直线电机牵引力值和初级电流值非常接近，从而验证了仿真的正确性，仿真结果对今后控制系统的优化有着重要意义。     

基于第一类Whitney单元的FETD中质量矩阵集中公式的一种推导

给出基于第一类Whitney基函数的时域有限元方法中质量矩阵对角化公式的一种推导方法。在单元内部电场为常量场的假设下,使用局部仿射坐标架,确定出每个单元上自由度所服从的约束关系,由此导出对角化质量矩阵的公式。分别考虑了二维和三维两种情况。     

Thermal analysis and design of a 75-W hybrid-type DC–DC converter for space applications

Hybrid DC–DC converters for space applications should be designed for operation at full rated power within the military specification for temperature range of −55 to +125 °C. Hence, the thermal design is a crucial step in the design process of converter, ensuring that no component of the converter exceeds its rated maximum operating temperature. One of the objectives of this work is to guarantee that all electronic components operate below their maximum allowable temperature. For this purpose, a three dimensional model of a converter based on the finite element method was developed. Results based on numerical simulation were validated by experimental data from infrared camera. The total amount of dissipated power in every component was determined experimentally based on a prototype converter. In the case of a component with high power consumption, such as the field effect transistor, the increase in temperature was minimized by applying designed heat sink with a high-thermal-conductivity material.     

BGA焊点的形态预测及可靠性优化设计

制定了BGA(球栅阵列)焊点的形态预测以及可靠性分析优化设计方案，对完全分布和四边分布的两种BGA元件，通过改变下焊盘的尺寸得到不同钎料量的焊点，并对其形态进行了预测，建立了可靠性分析的三维力学模型。采用有限元方法分析了元件和焊点在热循环条件下的应力应变分布特征，预测了不同种类和不同形态的BGA焊点的热疲劳寿命，由此给出了最佳的上下焊盘比例范围。     

FD-MEI方法和变尺度优化技术应用于二维电磁成像

本文从电磁散射的微分方程出发,利用不变性测试方法（ＭＥＩ方程）与有限差分法求解电磁散射问题,邮等效原理与格林函数的渐近式求得远区散射场,以测量的散射场和计算的散射场偏差的平方为目标函数,通过共轭梯度法与变尺度优化地优化介质参数使目标函数达到最小值来重构散射体,导出了目标函数梯度的精确计算公式,最后给出了基于测量数据的反演结果。     

Chip Scale Package (CSP) solder joint reliability and modeling

A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue behavior of the solder joints in Chip Scale Packages (CSP) mounted on Printed Circuit Boards (PCB). The time-dependent and time-independent viscoplastic strain rate and plastic hardening work factors of solder material were used in 2-D plane strain finite element models. The viscoplastic strain rate data was fitted to the viscoplastic flow equation. The plastic hardening factors were considered in the evolution equation. A viscoelastic constitutive model was used for molding compound. Finite element models, incorporating the viscoplastic flow and evolution equations for solder and the viscoelastic equations for molding compound, were verified by temperature cycling tests on assembled CSPs. The effect of the cyclic frequency, dwell time, and temperature ramp rate on the response of the viscoplastic deformation was studied for a tapeless Lead-on-Chip (LOC) CSP and a flexible substrate CSP. The ramp rate significantly affects the equivalent stress range in solder joints while a dwell time in excess of 10 min per half cycle does not result in increased strain range. The failure data from the experiments was fitted to the Weibull failure distribution and the Weibull parameters were extracted. After satisfactory correlation between the experiment and the model was observed, the effect of material properties and package design variables on the fatigue life of solder joints in CSPs was investigated and the primary factors affecting solder fatique life were subsequently presented. Furthermore, a simplified model was proposed to predict the solder fatigue life in CSPs.     

Variable step length finite difference method for calculation of the 3-phase electromagnetic field in the long conductor approach

The original motivation of this research is to describe comprehensive solutions based on Finite Difference Method (FDM) together with its software implementation that can handle the infinity long conductor. This paper focuses on developing FDM procedures for solving the interface regions, defined as regions where the step sizes change. Attention has been paid in this problem for creating robust and efficient techniques for solving the complex electromagnetic field at long distance from the transmission line based on a variable step size for the grid of FDM. Reduction in memory requirements has been achieved in these approaches. The industry has identified that there is a pressing need for a comprehensive method together with its software implementation that can handle the infinity long conductor problem. The research results of the project have immediate and practical application to the power industries.     

MEI系数的快速算法

不变性测试方程法已被证明是解决电磁问题的一种有效方法。目前电大尺寸问题中ＭＥＩ系数的计算已成为一个瓶颈。提出了一个快速算法用于加速ＭＥＩ系数的计算,它使用快速多极子方法计算测试子的散射场,使得ＭＥＩ系数的计算速度从Ｏ（Ｎ＾２）变为Ｏ（Ｎ＾１．５Ｌｏｇ２Ｎ）。