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101.
苏林奋 《电信工程技术与标准化》2020,(7)
5G业务场景uRLLC要求端到端时延小于1ms,低时延是5G专线业务最大的特征。网络架构重构为CU-DU-AAU, CU放置位置会影响时延。通过软管道隔离来实现网络切片会造成带宽抢占,丢包重传会增大时延。通过网络结构调整可以降低线路传输时延,通过FlexE的1.5层快速转发可以降低设备转发时延,通过信道硬隔离隔离可以避免业务拥塞。综合以上技术方案可以有效实现5G专线业务低时延的特性。 相似文献
102.
This paper compares two interactive interfaces, Dress and Ange, designed to facilitate an experiential address of the user or viewers relationship to touch. Dress, a polypropylene dress fitted with small counters, which offer glimpses of human flesh for sale, is a shop that sells the possibility to touch human skin. The sales-person wears this body-shop and wanders through public domains inviting people to pull on a pearl of their choice and, thereby, expose a parcel of skin that they are to caress gently, momentarily with their fingertips. The second device, Ange, consists of a transparent corset with metal rib-like protuberances. Through the strategic use of flex sensors, these rib-keys act as points of actuation and volume control levers for corresponding sound samples. Ange has been designed to be exhibited, performed or worn in the public domain in a similar way to Dress. The inspiration and consequent design of both Dress and Ange will be discussed and compared, as will their public exhibition and performance in order to demonstrate the effectiveness of these design solutions. In conclusion, the value of particular design strategies to coerce or seduce a viewer to address highly personal issues, will be raised. 相似文献
103.
网络新技术的发展为5G注入了新的活力,针对5G新定制化网络应用领域及需求,如何构建一张具备灵活切片能力的移动承载网,成为5G承载网建设重中之重。从FlexE技术架构及应用场景等方面进行了深入研究与探索,详细介绍了FlexE接口技术原理与应用,并与FlexE电路交叉技术进行了对比分析,创新性地提出了基于IP/MPLS机制结合FlexE接口技术的STN承载网切片架构,并给出了5G STN承载网采用FlexE接口部署网络切片发展方向与建议,满足推进5G STN承载网切片大规模商用部署。 相似文献
104.
105.
潘大四 《数字社区&智能家居》2007,3(14):449
RIA(Rich Internet Application,富网络应用系统)技术将客户层的设计从以页面为中心提升到以组件为中心,组件以XML数据文档为中介与后台数据库通信.在对Flex组件技术研究基础上,提出一种基于数据绑定构建XML数据文档方法.该方法不仅能够提高生成、解析XML文档的速度,而且可提高程序开发效率. 相似文献
106.
107.
为适应当前大学计算机基础教学的创新要求,设计出基于Flex与J2EE多层架构的RIA智能E-Learning教学平台。应用Flex作为表示层,Hibernate作为持久层,并结合Spring技术作为业务层搭建了富英特网应用(RIA)系统模型。 相似文献
108.
Thermosonic flip-chip bonding process with a nonconductive paste (NCP) was employed to improve the processability and bonding strength of the flip-chip onto flex substrates (FCOF). A non-conductive paste was deposited on the surface of the copper electrodes over the flex substrate, and a chip with eight gold bumps bonded onto the copper electrodes by the thermosonic flip-chip bonding process.For the chips and flex substrates assembly, ultrasonic power is important in the removal of some of the non-conductive paste on the surface of copper electrodes during thermosonic bonding. Accordingly, gold stud bumps in this study were directly bonded onto copper electrodes to form successful electrical paths between chips and the flex substrate. A particular ultrasonic power resulted in some metallurgical bonding between the gold bumps and the copper electrodes, increasing the bonding strength. The ultrasonic power was not only to remove the NCP from the copper electrodes, but also formed metallurgical bonds during the thermosonic flip-chip bonding process with NCP.In this study, the parameters of the bonding of chips onto flex substrates using thermosonic flip-chip bonding process with NCP were a bonding force of 4.9 N, a curing time of 40 s, a curing temperature of 140 °C and an ultrasonic power of 14.46 W. The processability and bonding strength of flip-chips on flex substrates using thermosonic bonding process with NCP was verified in this study. This process has great potential to be applied to the packaging of consumed electronic products. 相似文献
109.
本文将Adobe公司推出的Flex+Flash Media Server的网络发布平台以及Flash Lite+Flash Cast的移动网络发布平台与SMG的东方宽频、东方龙等新媒体发布平台进行比较,将Adobe发布平台对现有业务的覆盖进行了分析,并展望了其在国内的应用前景。 相似文献
110.
利用Flex和BlazeDS技术,研究并实现了基于Web的EPICS数据实时监测系统.实时监测系统通过基于Java的接口技术对EPICS数据进行采集,以网页的形式显示EPICS数据.该系统可以选定显示时间长度,对选定区域进行放大,自动更新显示页面,不需人工干预,极大地方便了用户浏览和查看. 相似文献