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91.
92.
This study investigates the reliability of the assembly of chips and flex substrates using the thermosonic flip-chip bonding process with non-conductive paste (NCP). The high-temperature storage (HTS) test, the temperature cycling test (TCT), the pressure cooker test (PCT) and the high-temperature/high-humidity (HT/HH) test were conducted to examine the reliability of chips that are bonded on flex substrates. The environmental parameters used in the various reliability tests were consistent with the JEDEC standards. After the reliability tests, a peeling test was performed and the microstructure of the tested specimen observed to evaluate further the reliability.The bonding strength increased with the storage period in the HTS test. After the peeling test, a layer of copper electrodes was observed to be stuck on gold bumps over the fractured morphology of the chips when the chips and flex substrates were assembled using an ultrasonic power of 14.46 W, indicating that the bonding strength between the gold bumps and the copper electrodes was even higher than the adhesive strength of the layers that were deposited on the flex substrates. The HTS test yielded sufficient thermal energy to promote atomic interdiffusion between gold bumps and copper electrodes. Metallurgical bonding between the gold bump and the copper electrode occurred, improving the bonding strength. In the assembly of chips and flex substrates without the application of ultrasonic power in bonding process, the adhesive strength of NCP was highly reliable after HTS test, because the bonding strength was maintained after HTS test for various storage periods. The typical failure mode of PCT was interfacial delamination between NCP and flex substrates. Approximately 80% of the specimens exhibited full separation after PCT at 336 h when chips and flex substrates were assembled without applied ultrasonic power to the bonding process, revealing that the NCP cannot withstand the PCT and lost its adhesive strength. Applying an adequate ultrasonic power of 14.46 W in the bonding process not only improved the bonding strength, but also enabled the bonding strength to be maintained at high level after PCT. The high bonding strength was attributable to the strong bonding of the gold bumps on the copper electrodes after PCT for various storage periods. This experimental result demonstrates that ultrasonic power can increase the reliability of PCT on chips and flex substrates that were assembled with the NCP. The bonding strength of the gold bumps on the flex substrates did not change significantly after the TCT, revealing the great reliability of TCT on chips and flex substrates that were assembled using the thermosonic flip-chip bonding process with the NCP. The bonding strength of chips bonded to flex substrates increased with the storage periods of the HT/HH test if ultrasonic power was applied to bonding process. Neither delamination nor any defect at the bonding interface was observed. The reliability of the HT/HH test for chips bonded on flex substrates using the thermosonic flip-chip process with the NCP fulfills the requirements stated in the JEDEC standards.According to the experimental findings of various reliability tests, the chips that were bonded to flex substrates using the thermosonic bonding process with NCP met the JEDEC specifications; with the exception of the adhesive strength of NCP under PCT which must be improved. 相似文献
93.
本文将Adobe公司推出的Flex+Flash Media Sewer的网络发布平台以及Flash Lite+Flash Cast的移动网络发布平台与SMG的东方宽频、东方龙等新媒体发布平台进行比较。将Adobe发布平台对现有业务的覆盖进行了分析。并展望了其在国内的应用前景。 相似文献
94.
《Energy Policy》2014
The modified Renewable Fuel Standard (RFS2) prescribes a volume of biofuels to be used in the United States transportation sector each year through 2022. As the dominant component of the transportation sector, we consider the feasibility of the light-duty vehicle (LDV) parc to provide enough demand for biofuels to satisfy RFS2. Sensitivity studies show that the fuel price differential between gasoline and ethanol blendstocks, such as E85, is the principal factor in LDV biofuel consumption. The numbers of flex fuel vehicles and biofuel refueling stations will grow given a favorable price differential. However, unless the feedstock price differential becomes extreme (biomass prices below $100 per dry ton and oil prices above $215 per barrel), which deviates from historical price trends, LDV parc biofuel consumption will fall short of the RFS2 mandate without an enforcement mechanism. Additionally, such commodity prices might increase biofuel consumption in the short-term, but discourage use of biofuels in the long-term as other technologies that do not rely on any gasoline blendstock may be preferable. Finally, the RFS2 program goals of reducing fossil fuel consumption and transportation greenhouse gas emissions could be achieved through other pathways, such as notable improvements in conventional vehicle efficiency. 相似文献
95.
基于Flex和BlazeDS推技术实现WEB方式实时监控系统 总被引:1,自引:0,他引:1
监控系统逐步向B/S框架结构^[1]转变,但由于HTTP协议固有的缺陷,使WEB模式在工业监控实时领域应用一直不尽人意,AJAX技术出现虽然解决了异步通讯和页面刷新问题^[2],但其依然使用HTTP请求拉方式(Pull)并没有真正解决实时问题。Flex技术和BlazeDS^[3]技术的出现,结合消息服务技术实现的推技术(Push),解决了实时难题,彻底实现了Web实时监控工作模式。 相似文献
96.
介绍Flex的事件流的框架及其对自动化的支持,自动化测试工具与Flex源码的交互机制,从Flex自动化支持、流程、维护三方面框架提出Flex自动化工程的重要因素。 相似文献
97.
本文通过与传统Web应用程序(ASP、PHP、JSP)的比较,深入地阐述了Coldfusion与Flex协调开发富网络应用程序的优势,并通过一个实例,来演示Coldfusion与Flex完美结合后所达到的用户体验的效果。 相似文献
98.
99.
桥梁伸缩装置设计选型与安装 总被引:2,自引:0,他引:2
本文主要介绍桥梁伸缩装置的功能、分类,设计选型应考虑的因素,影响伸缩装置伸缩量的基本因素,伸缩装置伸缩量的计算公式和方法以及伸缩装置施工安装步骤。 相似文献
100.
开发基于Flex+Spring+Hibernate架构的数据发布系统,设计了一套灵活、松耦合、可扩展的数据发布系统,该系统具有数据发布功能、用户管理功能、日志管理功能,初步解决了当前数据发布中存在的问题。 相似文献