用FPGA实现基于PC／104的ARINC429接口模块

针对分离元件设计的总线接口电路复杂、可靠性差等缺点,采用FPGA技术结合高性能的HS-3282/HS-3182芯片组实现了基于PC/104的ARINC429总线接口模块。硬件上,该接口模块具有模块化强、电路简单、器件少、可靠性高等特点,软件上采用简洁方便的C语言实现多种工作方式下数据的收发功能。     

基于支持向量机的思维脑电信号特征分类研究

探索一种实用的基于想象运动思维脑电的脑-机接口(BCI)方式,为实现BCI应用奠定比较坚实的理论和实验基础。对6名受试者进行三种不同时段(箭头出现2s、1s和0s后提示按键)情况下想象左右手运动思维作业的信号采集实验,利用小波变换和支持向量机对实验数据进行离线处理。对三种情况下的延缓时间△t0、△t1和△t2分析发现:△t0与△t1和△t2之间都有显著性差别(p<0.05),而△t1与△t2之间没有显著差别(p>0.05);平均分类正确率分别达到68.00%、80.00%和56.67%(p<0.05);实际按键前0.5~1s左右,想象左右手运动的思维脑电特征信号都发生了明显改变。通过合理的实验设计获取的信号有助于识别正确率的提高,为BCI系统中思维任务的特征提取与识别分类提供了新思路和方法。     

Classification of Imagined Speech EEG Signals with DWT and SVM

With the development of human–computer interaction technology, brain–computer interface (BCI) has been widely used in medical, entertainment, military, and other fields. Imagined speech is the latest paradigm of BCI and represents the mental process of imagining a word without making a sound or making clear facial movements. Imagined speech allows patients with physical disabilities to communicate with the outside world and use smart devices through imagination. Imagined speech can meet the needs of more complex manipulative tasks considering its more intuitive features. This study proposes a classification method of imagined speech Electroencephalogram (EEG) signals with discrete wavelet transform (DWT) and support vector machine (SVM). An open dataset that consists of 15 subjects imagining speaking six different words, namely, up, down, left, right, backward, and forward, is used. The objective is to improve the classification accuracy of imagined speech BCI system. The features of EEG signals are first extracted by DWT, and the imagined words are classified by SVM with the above features. Experimental results show that the proposed method achieves an average accuracy of 61.69%, which is better than those of existing methods for classifying imagined speech tasks.     

基于“嵩山”超级计算机系统的大规模管网仿真

供水管网仿真广泛应用于城市供水输配调度,是城市供水管网监测与维护的重要技术手段。由于在面向城市级的大规模管网中产生了海量的计算数据,因此在一般计算平台上无法满足管网仿真计算的算力需求。为提升城市级供水管网仿真的计算效率,提出一种有效的并行化方案。基于“嵩山”超级计算机系统采用中央处理器+数据缓存单元（CPU+DCU）架构,利用其在密集数据计算方面的优势,对“嵩山”超级计算机进行供水管网仿真。参照可移植性异构计算接口（HIP）异构编程模型,在“嵩山”超级计算机上实现供水管网仿真的异构计算,并结合管道数据分割方案,使用消息传递接口开启多进程以实现DCU加速数据通信传递。通过重定义数据类型解决计算过程中结构体传输问题,实现单节点内多DCU的大规模密集计算。在不同计算平台和多种计算策略仿真上的对比结果表明,与传统x86平台相比,该优化方案在小规模数据与大规模数据上的加速比分别达到5.269、10.760,与采用计算统一设备架构异构编程模型的传统GPU异构平台相比,计算性能有明显提高。     

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Diamond‐dispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbide‐forming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas–solid nucleation and growth process. The Cu particle‐coating acts as a chemical bonding agent at the Cu–D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbide‐forming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cu‐coated diamonds exhibit a thermal conductivity of 475 W m^?1 K^?1 and a thermal expansion coefficient of 12 × 10^?6 °C^?1. These promising thermal performances are superior to that of B‐carbide‐bonded Cu/D composites and similar to that of Cr‐carbide‐bonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cu‐coated diamonds exhibit higher thermal cycling resistance than carbide‐bonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The as‐developed materials can be applicable as heat spreaders for thermal management of power electronic packages. The copper‐carbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.

     

Stress Reduction of 3D Printed Compliance‐Tailored Multilayers

Multilayered multi‐material interfaces are encountered in an array of fields. Here, enhanced mechanical performance of such multi‐material interfaces is demonstrated, focusing on strength and stiffness, by employing bondlayers with spatially‐tuned elastic properties realized via 3D printing. Compliance of the bondlayer is varied along the bondlength with increased compliance at the ends to relieve stress concentrations. Experimental testing to failure of a tri‐layered assembly in a single‐lap joint configuration, including optical strain mapping, reveals that the stress and strain redistribution of the compliance‐tailored bondlayer increases strength by 100% and toughness by 60%, compared to a constant modulus bondlayer, while maintaining the stiffness of the joint with the homogeneous stiff bondlayer. Analyses show that the stress concentrations for both peel and shear stress in the bondlayer have a global minimum when the compliant bond at the lap end comprises ≈10% of the bondlength, and further that increased multilayer performance also holds for long (relative to critical shear transfer length) bondlengths. Damage and failure resistance of multi‐material interfaces can be improved substantially via the compliance‐tailoring demonstrated here, with immediate relevance in additive manufacturing joining applications, and shows promise for generalized joining applications including adhesive bonding.     

PC机多路数据采集接口卡及编程

介绍了以MC14433为A／D转换器,与IBM－PC总线实现接口的数据采集卡,并通过CD4051多选一开关实现多路输入。文中给出了硬件电路和采样驱动程序流程图。     

计算机接口技术课程实验教学探讨

计算机接口技术课程中的实验非常重要,根据不同实验目的将实验分为验证型实验、扩展型实验和综合型实验。针对这三类实验,结合多年的教学经验,给出了计算机接口技术实验教学改革分三步走的策略。通过具体的实例,强调了验证型实验要注重于过程监控,扩展型实验要注重于激发兴趣,综合型实验要注重于挖掘创新能力。     

基于中间件的航电系统接口仿真通用软件设计

提出了一种基于”仿真软件＋中间件”的接15／仿真系统通用软件架构。开发了Interface_RTI中间件,使用XML文件作为系统配置文件,无需重新编译Interface_RTI中间件程序就可以支持在不同系统上的仿真运行,降低了软件维护成本。对仿真软件进行了合理的任务划分和优先级设置,减少了任务调度开销,保证了软件实时性。该软件能满足某型UAV航电系统的接口仿真功能、性能、通用性、可靠性及灵活性要求。     

用户界面松耦合设计及其实现

针对如何进行复杂用户界面(UI)程序设计及UI组件难以重用的问题,总结界面设计的解耦原则,提出统一的设计思想及其实现方法。解耦原则符合敏捷软件的开发及可测试要求,通过依赖注入使系统界面组件的耦合性降到最低,组件之间能够灵活组合。医疗影像归档系统界面的设计与实现证明了该设计原则及方法具有较好的灵活性及适用性。