蘸水笔刻蚀技术(DPN)影响因素分析

蘸水笔技术(Dip-Pen)是近年来发展起来的一种新的扫描探针刻蚀加工技术,有着广泛的应用前景.该技术是直接把弯曲形水层作为媒介来转移"墨汁"分子,在样品表面形成纳米结构.尖端曲率半径、针尖在基底表面滞留时间、针尖扫描速度、空气湿度、表面粗糙度等均会影响纳米结构的线宽.针尖在基底表面滞留时间与圆半径的平方成一次函数关系,线宽随着尖端半径的增大而变宽,扫描速度与线宽成反比关系.通过控制湿度可以控制"墨水"分子的转移速度,从而影响纳米结构的线宽.线宽随着样品表面粗糙度增加而变宽.     

Interior-architectured ZnO nanostructure for enhanced electrical conductivity via stepwise fabrication process

Fabrication of ZnO nanostructure via direct patterning based on sol-gel process has advantages of low-cost, vacuum-free, and rapid process and producibility on flexible or non-uniform substrates. Recently, it has been applied in light-emitting devices and advanced nanopatterning. However, application as an electrically conducting layer processed at low temperature has been limited by its high resistivity due to interior structure. In this paper, we report interior-architecturing of sol-gel-based ZnO nanostructure for the enhanced electrical conductivity. Stepwise fabrication process combining the nanoimprint lithography (NIL) process with an additional growth process was newly applied. Changes in morphology, interior structure, and electrical characteristics of the fabricated ZnO nanolines were analyzed. It was shown that filling structural voids in ZnO nanolines with nanocrystalline ZnO contributed to reducing electrical resistivity. Both rigid and flexible substrates were adopted for the device implementation, and the robustness of ZnO nanostructure on flexible substrate was verified. Interior-architecturing of ZnO nanostructure lends itself well to the tunability of morphological, electrical, and optical characteristics of nanopatterned inorganic materials with the large-area, low-cost, and low-temperature producibility.     

一种激光直写式光刻光路系统

针对曲面栅网器件的光刻工艺,提出了一种可动态调焦的激光直写式光刻系统,该系统将紫外激光器的光束经过整形扩束、动态z向调焦、x/y振镜、聚焦等单元使器件上相应位置涂覆的光刻胶直接感光,再经过显影、刻蚀等工艺直接制作出相应器件. 它可以应用到一些精度要求不太高的平面或非平面器件的光刻加工工艺, 取代传统的使用掩模版的光刻工艺或其它的加工工艺.     

温度气压对高分辨力光刻物镜像质影响研究

分析温度气压对物镜光学材料、透镜厚度间隔,以及空气折射率的影响,并用空气折射率对物镜像质影进行模拟计算。研究表明物镜焦面产生较大漂移,对僧率有一定影响,而对畸变影响较小,指出对物镜进行温度气压控制补偿是必要的。     

电子束曝光UV3正性抗蚀剂的工艺研究

为了在体硅CMOSFinFET中用等离子体腐蚀精细凹槽图形，研究了将电子束直写曝光用于原为深紫外光学曝光的UV3正性抗蚀剂的工艺技术；详细分析了包括膜厚、曝光能量、曝光剂量、显影时间、设计尺寸和衬底材料等在内的各类工艺参数与实际曝光图形效果的关系；特别指出了曝光过程中特有的延迟效应及解决办法。采用最终的优化工艺条件，得到了合适的图形效果。     

Microdroplet and Atomic Force Microscopy Probe Assisted Formation of Acidic Thin Layers for Silicon Nanostructuring

In this work, an aqueous acidic thin‐layer‐based strategy for fabricating nanostructures on silicon by using atomic force microscopy (AFM) nanolithography is presented. The approach involves the formation of microscale droplets via dilute hydrofluoride (DHF) etching, the conversion of the droplets to acidic thin layers by AFM‐probe scanning, and subsequent lithographic operations using a biased probe in the aqueous layers. By varying the concentration of the acidic DHF layers, the thin layers can facilitate the creation of both positive and negative patterns, such as oxide dots and Si pores, through anodic oxidation and dissolution. In particular, the anodic oxidation in the acidic media is associated with the field‐enhanced nonequilibrium dissociation of the weak electrolyte. The Si pore structure formation is related to the field‐assisted dissolution of anodic oxides and the Si substrate. The acidic‐layer‐based technique allows switching between different lithographic modes by changing the acidity of the DHF layers, and is complementary to bulk solution‐based and local meniscus‐based approaches in AFM nanolithography. In principle, this method can also be extended to other materials that have similar reactions with DHF.     

Deposition thickness based high-throughput nano-imprint template

International Technology Roadmap for Semiconductors 2003 projected nano-imprint lithography has the potential of high throughput, sub-20 nm resolution, and low cost [S.Y. Chou, P.R. Krauss, P.J. Renstrom, Appl. Phys. Lett. 67 (1995) 3144; Science 272 (1996) 85, J.A. Rogers, C. Mirkin, Mater. Res. Bull. 26 (2001)]. For nano-imprint lithography, a template with 1X resolution is required. The existing industrial infrastructure for supporting deep ultra violet 4X photo masks by e-beam and/or a laser beam scanning writer does not offer pitch (center-to-center distance of an array of patterned lines) less than ∼60 nm [<http://public.itrs.net/2003ITRS>]. For nano-imprint lithography to be accepted across the industry, a reproducible simple fabrication process to make a high resolution, single emboss template is essential [L. Jay Guo, J. Phys. D: Appl. Phys. 37 (2004) R123-R141]. Here we show, a general fabrication method and fabricated nano-imprint templates with sub-15 nm template line width and 10 nm pitch length through out the entire 200 mm wafer, varying the deposition thickness of multiple alternate films, using atomic layer deposition. Although multilayer nano-imprint templates and their exciting use have been demonstrated, [W.J. Dauksher et al., J. Vac. Sci. Technol. B 22 (2004) 3306, B. Heidari, et al., The 49th international conference on electron, ion and photon beam technology and nanofabrication, Orlando, Florida, 2005, William M. Tong, et al., Proc. SPIE 5751 (2005) 46-55, N.A. Melosh, A. Boukai, F. Diana, B. Gerardot, A. Badolato, P.M. Petroff, J.R. Heath, Science 300 (2003) 112] such a small pitch was not shown and either complex lattice mismatch-based epitaxially grown films or unconventional etch chemistry was used. The bare necessity was a simple and economical fabrication process for a high throughput nano-imprint template. In that context, we have developed a template fabrication process using classical micro-fabrication techniques. Successful use of these techniques made the template fabrication process simple, economical, and expedient. Also a novel technique to provide flexible and accurate alignment for nanowire patterning has been described. In this technique, nanowire patterning is accomplished on the entire wafer with a single impression. Industry level batch-fabrication of our scheme illustrates its reproducibility and manufacturability. We anticipate, this simple, economical and time saving technique will help researchers and developers to perform their experiment on nano-scale feature patterned substrates easily and conveniently.     

激光三角法测量技术在光刻机中的应用

介绍了激光三角法测量原理和分类,对不同类型进行了分析比较。介绍了CCD的激光三角法高度测量系统在光刻机中的应用及在高度测量时实时和映射两种工作模式。在应用中可以针对不同的测量对象表面的光学特征,使用对应的表格,提高其测量的适应性和测量效率。