汽车前保险杠型芯的加工工艺

介绍了汽车前保险杠型芯的加工工艺,对需要多面加工和深度比较深的型芯在加工时要注意的事项作了详细说明,型芯在加工中没有产生变形,符合质量要求,取得了良好的经济效益。     

塑封电子器件负极端变色原因分析

利用X—RAY光电子能谱仪对125°下,通电15kV,96h后负极一端出现白色物质的塑封电容器进行分析。对比分析性氧化铝结发现,负极一端白色物质为氧化铝富集所致。造成该现象的原因是,环氧塑封料中含有活性氧化铝,由于固化不完全或吸潮导致环氧塑封料中残留水分,残留的水分与活合,在电应力的作用下,有向电源负极迁移的趋势;同时,由于温度效应的存在,塑封树脂软化,加速了水分与活性氧化铝向电源负极迁移的速度,形成了氧化铝在负极端富聚现象,使电容器负极端呈现白色。     

NVCGM高性能灌浆料的研究及应用

从流变性、竖向膨胀、有效承载接触面积、抗压强度等方面,采用对比试验的方法,系统分析了 NVCGM 灌浆料与国外两种灌浆料、国内某灌浆料的优劣性。试验结果以及工程应用表明,NVCGM 灌浆料是一种综合性能优异的高性能灌浆料。     

论冲压模具定置摆放

重点介绍了汽车冷冲压模具因摆放不合理而存在的安全隐患和发生的工装事故,以及采用工装定置摆放后产生的经济效益和管理价值。     

On the proper characterization of tooling motions and initial conditions in powder die compaction modeling

The present paper is concerned with the finite element modeling of Powder Metallurgy (P/M) cold die compaction process. Rather than on material constitutive theories or on numerical algorithmic issues, attention is confined exclusively on an scarcely addressed issue in the P/M modeling literature: the proper characterization of the boundary (tooling motions) and initial conditions of the problem. A case study of the compaction of an axially symmetric multilevel adapter in an advanced CNC press machine is used to convey the relevance of the accurate representation of these input data in the quality of model predictions. It is shown that unawareness or deliberate simplification of apparently insignificant details in this respect may cause errors far overshadowing those introduced by deficiencies in either the constitutive model or in the corresponding algorithmic solution procedure. The discussion of this case study serves also to provide useful modeling guidelines; illustrate frequent difficulties, as the unavailability of some information when guessing starting conditions; and reveal subtle, yet relevant for modeling purposes, technical details of advanced CNC press machines.     

Split Hopkinson pressure bar testing of 3D woven composites

Results from a series of split Hopkinson pressure bar (SHPB) tests on 3D woven tetxile composites (3DWC) are presented. These tests were done to determine the rate dependent compression response of 3DWC. Three different configurations of the 3DWC, corresponding to compression response in the plane of the material and through-the-thickness direction (out-of-plane) were studied. The rate dependent responses were compared against quasi-static test results and it was found that 3DWC showed an increase in strength in all three directions studied, however, accompanied by a transition in the failure mechanism. The in-plane orientations showed the largest increase in (about 100%) strength at the elevated rates of loading. A follow-on paper provides finite element based results that correspond to the experimental results presented here.     

铝基印制板的成型及压板翘工艺

简述铝基板冲板模具的设计、调试的要点及发生问题的解决方案,重点叙述了通过利用压板翘模具得以成功解决铝基板冲板后板翘的问题。     

A universal roll‐to‐roll slot‐die coating approach towards high‐efficiency organic photovoltaics

This work develops a combinational use of solvent additive and in‐line drying oven on the flexible organic photovoltaics to improve large‐area roll‐to‐roll (R2R) slot‐die coating process. Herein, addition of 1,8‐diiodooctane (DIO) in the photoactive layer is conducted to yield a performance of 3.05% based on the blending of poly(3‐hexylthiophene) (P3HT) and [6,6]‐phenyl C₆₁‐butyric acid methyl ester (PC₆₁BM), and a very promising device performance of 7.32% based on the blending of poly[[4,8‐bis[(2‐ethylhexyl)oxy] benzo[1,2‐b:4,5‐b’] dithiophene‐2,6‐diyl] [3‐fluoro‐2‐[(2‐ethylhexyl)carbonyl]thieno[3,4‐b]thiophenediyl]] (PTB7) and [6,6]‐phenyl C₇₁‐butyric acid methyl ester (PC₇₁BM). Based on this R2R slot‐die coating approach for various polymers, we demonstrate the high‐performance result with respect to the up‐scaling from small high‐PCE cell to large‐area module. This present study provides a route for fabricating a low‐cost, large‐area, and environmental‐friendly flexible organic photovoltaics.     

半导体模具发展历程

介绍半导体模具从单注射头模具发展到双注射头模具、多注射头模具,以及其它封装方式等;通过单注射头模具与双注射头模具、多注射头模具进行比较,可以明确半导体模具发展必然进程,体现出现代半导体模具市场确实是按模具的先进性进行分配市场份额,从而推动半导体模具发展历程。