Estimating thermal stress in BIPV modules

The thermal stress on building‐integrated photovoltaic modules (BIPV) in Espoo, Finland, was studied with field‐testing of amorphous silicon modules. Based on these results, the thermal stress at two other European locations (Paris and Lisbon) was estimated. The estimation procedure entailed thermal modelling of heat transfer in the façade with meteorological data as input. The results indicate that the thermal stress on BIPV modules in Lisbon is, in this case, approximately 50% higher that in Espoo and between 80 and 200% higher than in Paris, depending on the activation energy of the degradation process. The difference in stress between a BIPV module and a free‐standing module in Espoo was 50–200%. Copyright © 2006 John Wiley & Sons, Ltd.     

钢水化学热法升温技术的研究

依据热力学原理，用计算机计算了某些元素与合金的氧化热效应。综述了各种上化学热法升温技术的应用效果。分析讨论了发热剂的类型，升温速度和热效率问题等。     

Effect of temperature on recombinant protein production using the Bm5/Bm5.NPV expression system

A series of experiments have been conducted using a recombinant baculovirus/insect cell expression system (Bm5/Bm5.NPV.CAT) to establish the optimum temperature for both cell growth and virus infection. Bm5 cell growth was found to be limited at temperatures below 22°C and ceased completely at temperatures above 34°C. In the range between 24 and 28°C, final cell densities always reached 96% of the highest achievable viable cell density. The shortest population doubling time was obtained at 28°C. Overall, a consistent increase in metabolism with increasing temperatures was observed. During the infection/viral replication phase, an increase in the temperature from 25 to 31°C resulted in a faster decrease in viable cell density and an earlier production of chloramphenicol acetyltransferase (CAT). Furthermore, protein yield at temperatures above 28°C was significantly reduced. Overall, the best temperature for the infection phase for the Bm5/Bm5.NPV expression system was found to be 25°C when the cells are cultured in serum free media.     

液态金属钠高温沸腾实验回路应力分析与强度计算

本文主要完成了液态金属钠高温沸腾实验回路的应力分析与计算，确定了回路高温区连接管系的布置型式和支吊架系统，是该回路总体设计的重要组成部分。     

高温超高压处理HDPE的WAXD及FT－IR研究

用ＷＡＸＤ和ＦＴ－ＩＲ对高温超高压处理前后的ＨＤＰＥ进行了研究。发现经５．０ＧＰａ的高压处理或２００℃下４．０ＧＰａ的高压同时处理后的ＨＤＰＥ分子链的化学结构未发生变化。ＨＤＰＥ晶体中（２００）面与（１１０）面衍射峰的峰高比（γ）随着压力的升高而增大，表明ＨＤＰＥ分子链在超高压作用下发生了取向排列，且升高温度更有利于这种取向排列，但当压力增大至５．０ＧＰａ及温度升高至２００℃时，γ反而大幅度下降。     

Adaptive control in a heating vessel: A comparative study

This paper presents experimental results obtained in temperature adaptive control of a heating vessel. A non-linear model of the process showed that the feed flow rate causes severe variations in time constant and process gain. An extended horizon self-tuning controller and two different model reference adaptive controllers were tested. The influence of design parameters on control performance for each algorithm was assessed. The control system was disturbed with load and setpoint changes.     

Density of 1,1-dichloro-1-fluoroethane (HCFC 141b) as a function of temperature and pressure

The density of HCFC 141b has been measured at several temperatures between 260 and 320 K, Mid pressures up to 20 MPa, with a mechanical oscillator densimeter. The densimeter was calibrated with 2,2,4-trimethylpentane, whose density was obtained from a correlating cyuation with 0.3% uncertainty. The density data obtained for HCFC 14H) hits a reproducibility of 0.05% and an uncertainty of 0.3%. The data obtained were fitted to a Tait-type equation. which reproduced the experimental densities within 0.11 % and were compared with the data obtained in other works.Paper presented at the Twelfth Symposium on Thermophysical Properties, June 19–24, 1994, Boulder, Colorado, U.S.A.     

PbO－Bi_2O_3－B_2O_3－SiO_2系重金属氧化物玻璃的结构与光学性

通过密度、可见光光谱、红外吸收光谱、Ｃｏ－６０辐照损伤试验及荧光光谱的测试，研究了ＰｂＯ－Ｂｉ２Ｏ３－Ｂ２Ｏ３－ＳｉＯ２玻璃系的光学性能与结构．密度最高可达８．４６４ｇ／ｃｍ３其紫外吸收达截止波长随Ｐｂ２＋及Ｂｉ３＋含量升高而红移．玻璃熔化温度低达８５０℃．在ＰｂＯ－Ｂｉ２Ｏ３－Ｂ２Ｏ３系玻璃中加人ＳｉＯ２可使玻璃结构更致密．室温下该系统玻璃在３６０ｎｍ有一个宽的激发峰，能产生４１８ｕｍ及４３８ｕｍ两个弱的发射峰．该系统玻璃的结构是由［ＳｉＯ４］４－、［ＢＯ３］３－、［ＢＯ４］５－、［ＰｂＯ４］６－及［ＢｉＯ６］９－构成．其中部分Ｐｂ２＋及Ｂｉ３＋以网络外体进入玻璃．     

低温导热绝缘胶粘剂研究

一种低温导热绝胶粘剂用于氢氧发动机系统表面温度传感器的端封和胶接安装，介绍了胶粘剂的技术要求，研究方案及试验结果。以DW－3超低温胶粘剂为基础，经改性设计后，仍能保持胶粘剂原有的耐低温特性，而且其导热，绝缘等性能均能满足设计和使用要求。