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141.
Koji Fushimi 《Electrochimica acta》2006,51(7):1255-1263
Micro-indentation test of passive iron electrode in deaerated pH 8.4 borate buffer solution was carried out to investigate the rupture and repair of passive film. During driving a conical diamond micro-indenter with a load of 0.1 N order downward to the electrode and driving upward from the electrode, a couple of anodic current peaks were observed. The first current peak spiked during loading was responsible for partial exposure of iron substrate to the solution due to rupture of the passive film when the indenter tip contacted. The second peak emerged during unloading when elastic deformation recovered, which was ascribed to repair at the ruptured sites. The second peak current was larger than the first one. Both peaks were sensitively influenced by electrode potential or concentration of sulfate ions containing in solution. The model for a series of rupture and repair processes of the passive film by micro-indentation was proposed to discuss the current transients. 相似文献
142.
S. Multsch A. S. Alquwaizany O. A. Alharbi M. Pahlow H.-G. Frede L. Breuer 《国际水资源开发杂志》2017,33(2):292-309
Agriculture policy changes in Saudi Arabia are investigated by water footprint (WF) assessment. WF is calculated with the model SPARE:WATER for 3758 irrigated sites. The WF of agriculture areas (WFarea, km3 yr?1) has decreased (–17%) since the year 2000 to 13.84 km3 yr?1 (2011), which is mainly caused by the reduction of cropland by –33%. Nevertheless, water consumption per field has increased about 16%, which can be attributed to the cultivation of fodder crops (+12%). A scenario analysis revealed that a shifting cropping pattern towards less fodder crops reduces WFarea by –15%, and implementing improved irrigation technology leads to a combined reduction of up to 32% 相似文献
143.
144.
The viscoelastic and peeling properties of polybutadiene/tackifying resin compatible blends have been studied in detail. Viscoelastic properties have been described through the variations of the complex shear modulus, G*(ω), as a function of frequency, ω and peeling properties through the variations of peeling force (F) as a function of peeling rate (V).
After showing the objective character of the peeling curves obtained, the variations of the peeling force and peeling geometry have been studied as a function of volume fraction of the tackifying resin.
In this first paper, the analysis is focused on the first domain of the peeling curves, i.e. the cohesive fracture region. In this region, the peeling properties have been related to the viscoelastic properties in the terminal region of relaxation. It is shown that the longest relaxation time, τo, is a reducing parameter of the peeling curves, so a peeling master curve-which is independent of temperature, resin volume fraction and polymer molecular weight-may be defined. Furthermore, the variations of the test geometry as a function of peeling rate have been investigated: the variations of the radius of curvature of the aluminium foil have been analyzed with respect to the viscoelastic behavior of the adhesive, which in fact governs the test geometry.
A detailed analysis of all these features leads to a model which allows one to calculate the peeling curves in the cohesive domain from the adhesive formulation. 相似文献
After showing the objective character of the peeling curves obtained, the variations of the peeling force and peeling geometry have been studied as a function of volume fraction of the tackifying resin.
In this first paper, the analysis is focused on the first domain of the peeling curves, i.e. the cohesive fracture region. In this region, the peeling properties have been related to the viscoelastic properties in the terminal region of relaxation. It is shown that the longest relaxation time, τo, is a reducing parameter of the peeling curves, so a peeling master curve-which is independent of temperature, resin volume fraction and polymer molecular weight-may be defined. Furthermore, the variations of the test geometry as a function of peeling rate have been investigated: the variations of the radius of curvature of the aluminium foil have been analyzed with respect to the viscoelastic behavior of the adhesive, which in fact governs the test geometry.
A detailed analysis of all these features leads to a model which allows one to calculate the peeling curves in the cohesive domain from the adhesive formulation. 相似文献
145.
介绍了串级控制在仪化研究院半连续聚酯试验装置酯化釜塔顶温度控制上的应用,解决了酯化釜塔顶温度调节滞后问题,提高了调节过程的品质 相似文献
146.
碗底足的变迁是整个古陶瓷历史变迁的一个缩影。底足鉴定是古陶瓷鉴定的一个重要组成部分。针对碗底足变化的主要特征和碗底足变迁的主要原因,深入浅出地论述了碗底足经历的平底和圈足两大发展阶段,以及推动碗底足发生演变的窑炉技术、装烧方法、成型工艺等制瓷工艺原因和社会经济文化原因。 相似文献
147.
The electrochemical behaviour of several natural ilmenites has been studied by cyclic voltammetry. From the analysis of the current-voltage curves it was concluded that the valences of the metal ions in FeTiO3 are FeII and TiIV. It was also found that little amounts of FeIII and excess of TiIV (probably TiO2) can enter into the composition of the ilmenites. 相似文献
148.
The effects of oxidation/reduction regeneration treatments, with and without 1,2-dichloropropane present as a chlorinating agent, on the structure of Pt(3%)–Sn(4.5%)/Al2O3 catalysts have been correlated with selectivities for butane/H2 reactions. Particles of Pt0 fin Cl-free catalysts were partly covered by Sn0, but retained exposed ensembles of Pt atoms which were active for isomerisation, hydrogenolysis and dehydrogenation reactions, the latter becoming dominant at high reaction temperatures. Coking reduced Pt ensemble size and, hence, also favoured high selectivities for dehydrogenation as hydrogenolysis and isomerisation sites became poisoned. In contrast, the addition of 1,2-dichloropropane in an oxychlorination step before reduction promoted 1:1 Pt0–Sn0 alloy formation after reduction, the proportion of the total Pt in alloy being enhanced by increasing 1,2-dichloropropane concentration and oxychlorination temperature. The alloy surfaces were inactive for isomerisation and hydrogenolysis reactions, giving dehydrogenation as the sole catalytic reaction. 相似文献
149.
150.