Antioxidant High-Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics

As a nontoxic and cost-effective material, copper pastes have attracted great attention in both academia and industry. However, achieving the long-term stability of copper pastes remains challenging due to their susceptibility to oxidation. Therefore, stable copper nanoparticles with a Cu(0)–Cu(I) core–shell structure containing a surface passivation layer of formate ions-involved Cu(I) coordination polymers are developed. Based on the self-reducing nature of the passivation layer, the nanoparticle-based copper pastes can be sintered in <1 min, showing high electrical conductivity (220 000 S cm⁻¹), mechanical flexibility, and long-term stability after sintering. The excellent properties of the developed copper pastes are even comparable with the ones of silver pastes. These stable copper pastes have broad applications in printed electronics (e.g., glucose sensors, RFID tags, and electromagnetic shielding films), showing great potential in the fabrication of flexible printed electronics.     

A Sensing and Stretchable Polymer-Dispersed Liquid Crystal Device Based on Spiderweb-Inspired Silver Nanowires-Micromesh Transparent Electrode

Polymer-dispersed liquid crystal (PDLC) devices are truly promising optical modulators for information display, smart window as well as intelligent photoelectronic applications due to their fast switching, large optical modulation as well as cost-effectiveness. However, realizing highly soft PDLC devices with sensing function remains a grand challenge because of the intrinsic brittleness of traditional transparent conductive electrodes. Here, inspired by spiderweb configuration, a novel type of silver nanowires (AgNWs) micromesh-based stretchable transparent conductive electrodes (STCEs) is developed to support the realization of soft PDLC device. Benefiting from the embedding design of AgNWs micromesh in polydimethylsiloxane (PDMS), the STCEs can maintain excellent electrical conductivity and transparency even in various extreme conditions such as bending, folding, twisting, stretching as well as multiple chemical corrosion. Further, STCEs with the embedded AgNWs micromesh endow the assembled PDLC device with excellent photoelectrical properties including rapid switching speed (<1 s), large optical modulation (69% at 600 nm), as well as robust mechanical stability (bending over 1000 cycles and stretching to 40%). Moreover, the device displays the pressure sensing function with high sensitivity in response to pressure stimulus. It is conceivable that AgNWs micromesh transparent electrodes will shape the next generation of related soft smart electronics.     

Direct Freeform Laser Fabrication of 3D Conformable Electronics

3D conformable electronic devices on freeform surfaces show superior performance to the conventional, planar ones. They represent a trend of future electronics and have witnessed exponential growth in various applications. However, their potential is largely limited by a lack of sophisticated fabrication techniques. To tackle this challenge, a new direct freeform laser (DFL) fabrication method enabled by a 5-axis laser processing platform for directly fabricating 3D conformable electronics on targeted arbitrary surfaces is reported. Accordingly, representative laser-induced graphene (LIG), metals, and metal oxides are successfully fabricated as high-performance sensing and electrode materials from different material precursors on various types of substrates for applications in temperature/light/gas sensing, energy storage, and printed circuit board for circuit. Last but not the least, to demonstrate an application in smart homes, LIG-based conformable strain sensors are fabricated and distributed in designated locations of an artificial tree. The distributed sensors have the capability of monitoring the wind speed and direction with the assistance of well-trained machine-learning models. This novel process will pave a new and general route to fabricating 3D conformable electronic devices, thus creating new opportunities in robotics, biomedical sensing, structural health, environmental monitoring, and Internet of Things applications.     

Diamond semiconductor and elastic strain engineering

Diamond,as an ultra-wide bandgap semiconductor,has become a promising candidate for next-generation microelec-tronics and optoelectronics due to its numerous advantages over conventional semiconductors,including ultrahigh carrier mo-bility and thermal conductivity,low thermal expansion coefficient,and ultra-high breakdown voltage,etc.Despite these ex-traordinary properties,diamond also faces various challenges before being practically used in the semiconductor industry.This review begins with a brief summary of previous efforts to model and construct diamond-based high-voltage switching diodes,high-power/high-frequency field-effect transistors,MEMS/NEMS,and devices operating at high temperatures.Following that,we will discuss recent developments to address scalable diamond device applications,emphasizing the synthesis of large-area,high-quality CVD diamond films and difficulties in diamond doping.Lastly,we show potential solutions to modulate diamond’s electronic properties by the“elastic strain engineering”strategy,which sheds light on the future development of diamond-based electronics,photonics and quantum systems.     

Metal Micropatterning by Triboelectric Spark Discharge

Metal micropatterns play critical roles in flexible electronics. However, the lack of versatile strategies for micropatterning of diverse metal materials on various thin, flexible or stretchable substrates has limited the rapid development of flexible electronics. Here, a metal micropatterning method by triboelectric spark discharge under atmospheric environment is developed, where a triboelectric nanogenerator (TENG) is employed to precisely and safely control the voltage, current, and frequency of the spark discharges. Micropatterns of metal films like gold, silver, copper, aluminum and platinum are successfully fabricated on substrates of polyimide, polyethylene terephthalate, polyvinyl chloride, polydimethylsiloxane, paper or latex, even on ultrathin substrates (5 μm thick) without damage, where the feature sizes of metal patterns are controllable from 20 μm to 1 mm. Experimental insights into the triboelectric spark discharge behaviors and the pattern feature sizes control are discussed. A straightforward fabrication of metal patterns on the balloon surface or human skin through “handwriting” by a pencil as discharge electrode is realized. Besides metals, extended processibility of conductive materials like carbon nanotubes, graphene, MXene, graphite, carbon fibers, and conductive polymers are also demonstrated. This work proves the possibility of microfabrication by TENG, which is of simplicity and attractiveness for flexible electronics.