退火温度对CuGa_(0.8)Ge_(0.2)Se_2薄膜结构及光学特性的影响

采用脉冲激光沉积法在SiO2衬底上制备了CuGa0.8Ge0.2Se2薄膜。采用X射线衍射和X射线能谱仪研究了退火温度对薄膜晶体结构和成分的影响,利用扫描电子显微镜表征了薄膜的表面形貌,采用紫外—可见分光光度计分析了薄膜的光学特性。结果表明,在CuGaSe2中掺杂Ⅳ族元素Ge,光子吸收能量分别为0.65和0.92 e V,禁带宽度为1.57 e V,能够形成中间带。并随着退火温度的升高,CuGa0.8Ge0.2Se2薄膜的光学带隙逐渐减小。     

巨大晶胞化合物Ho117Fe52Ge112的结构磁性能研究

利用X射线衍射技术和振动样品磁强计（VSM）研究了巨大晶胞三元化合物Ho117Fe52Ge112的结构与磁性能,测定了外加磁场为0．5T时该化合物的磁矩随温度的变化关系。该化合物具有Tb117Fe52Ge112结构类型,空间群为Fm3m（No．225）点阵参数为a=2．80832（8）nm。在90K到室温的范围内,Ho117Fe52Ge112的磁化率与温度关系服从居里——外斯定律,每个化学式有效磁矩的实验值为ueff=111．25us。测定了室温（300K）时磁矩随外加磁场的变化关系。当外加磁场到2．1T时,该化合物的磁矩约为3．61emu／g,还没有达到饱和状态。     

Comparison of Bi3Fe5O12 film giant Faraday rotators grown on (111) and (001) Gd3Ga5O12 single crystals

Bismuth iron garnet (Bi₃Fe₅O₁₂, BIG) epitaxial thin films were grown on single crystal (Gd₃Ga₅O₁₂, GGG) (111) and (001) substrates by rf-magnetron sputtering technique. Processing parameters have been optimized to obtain high deposition rate (2.74 μm/h) and the surface rms roughness less than 10 nm. X-ray diffraction reveals films epitaxial quality: exclusive (111) or (001) orientation with narrow rocking curves and strong in-plane texture. Films possess low optical loss and magneto-optical Faraday rotation (FR) as high as 5 deg/μm at 677 nm wavelength. Comparative analysis of films grown on (111) and (001) substrates clearly shows significant superiority of BIG/GGG(001) film. For this film, the coercive field ∼100 Oe appears to be 2.5 times lower while the optical transmission to be 10% higher than that for BIG/GGG(111) film. Enhanced magneto-optical performance of BIG/GGG(001) films relies upon better accommodation of the film-to-substrate mismatch strain through the tetragonal BIG lattice distortions compared to the rhombohedral one in BIG/GGG(111) films.     

离子束溅射制备Si／Ge多层膜研究

采用离子束溅射方法在Si衬底上制备Si／Ge多层膜，通过改变生长温度、溅射速率等因素得到一系列Si／Ge多层膜样品；通过X射线衍射、Raman散射等表征方法研究薄膜结构与生长条件的关系。在小束流（10mA）、室温条件下制备出界面清晰、周期完整的Si／Ge多层膜。     

Use of water vapor for suppressing the growth of unstable low-κ interlayer in HfTiO gate-dielectric Ge metal-oxide-semiconductor capacitors with sub-nanometer capacitance equivalent thickness

Annealing of high-permittivity HfTiO gate dielectric on Ge substrate in different gases (N₂, NH₃, NO and N₂O) with or without water vapor is investigated. Analysis by transmission electron microscopy indicates that the four wet anneals can greatly suppress the growth of a GeO_x interlayer at the dielectric/Ge interface, and thus decrease interface states, oxide charges and gate leakage current. Moreover, compared with the wet N₂ anneal, the wet NH₃, NO and N₂O anneals decrease the equivalent permittivity of the gate dielectric due to the growth of a GeO_xN_y interlayer. Among the eight anneals, the wet N₂ anneal produces the best dielectric performance with an equivalent relative permittivity of 35, capacitance equivalent thickness of 0.81 nm, interface-state density of 6.4 × 10¹¹ eV^− 1 cm^− 2 and gate leakage current of 2.7 × 10^− 4 A/cm² at V_g = 1 V.     

Thermophysical properties data on molten semiconductors

Thermophysical properties of molten semiconductors are reviewed. Published data for viscosity, thermal conductivity, surface tension, and other properties are presented. Several measurement methods often used for molten semiconductors are described. Recommended values of thermophysical properties are tabulated for Si, Ge, GaAs, InP, InSb, GaSb, and other compounds. This review shows that further measurements of thermophysical properties of GaAs and InP in the molten state are required. It is also indicated that a very limited amount of data on emissivity is available. Space experiments relating to thermophysical property measurements are described briefly.Nomenclature Density - C _p Specific heat - Kinematic viscosity - Dynamic viscosity= - Thermal diffusivity - Thermal conductivity=C_p - Volumetric thermal expansion coefficient - Surface tension - d/dT Temperature coefficient of surface tension - g Gravitational acceleration - T Temperature - T Temperature difference - L Characteristic dimension     

低磁场条件下Mn5(Ge3-xSbx)(x=0、0.1、0.2、3)合金磁热效应研究

用真空高频悬浮炉在高纯氩气保护下制备了Mn5（Ge3-xSbx）（x=0、0.1、0.2、3）合金系列样品,用直接测量方法测定了在永磁体提供的低磁场（H=1.3T）条件下样品的磁热效应曲线（ΔTad-T）,结果表明,用元素Sb替代Mn5Ge3合金中的Ge原子,不能增强合金的磁热效应,但对合金的居里温度有一定影响.     

First principles total energy studies of the adsorption of germane on Ge(001)-c(2 × 4)

We perform first principles total energy calculations to study the energetics, and the atomic structure of the adsorption of germane (GeH₄) molecules on the Ge(001)-c(2 × 4) surface. The adsorption of a GeH₄ unit occurs after its dissociation into a germanium trihydride (GeH₃) and a hydrogen atom and a subsequent decomposition into a germanium dihydride (GeH₂) subunit and H atoms. Consequently, we first consider the adsorption of GeH₂ in two different configurations; the on-dimer and the intra-row geometries. Similar to the adsorption of SiH₂ and GeH₂ on Si(001), it is found that the on-dimer site is more stable than the intra-row geometry by 0.13 eV. However, in the adsorption of a GeH₂ fragment together with two H atoms we find that the intra-row geometry is energetically more favorable, again, similar to the adsorption of SiH₂ and GeH₂ (plus two H atoms) on the Si(001) surface.     

Study of Ge2Sb2Te5 Film for Nonvolatile Memory Medium

The amorphous Ge2Sb2Te5 film with stoichiometric compositions was deposited by co-sputtering of separate Ge, Sb, and Te targets on SiO2/Si (100) wafer in ultrahigh vacuum magnetron sputtering apparatus. The crystallization behavior of amorphous Ge2Sb2Te5 film was investigated by X-ray diffraction (XRD), atomic force microscopy (AFM) and differential scanning calorimetry (DSC). With an increase of annealing temperature, the amorphous Ge2Sb2Te5 film undergoes a two-step crystallization process that it first crystallizes in face-centered-cubic (fcc) crystal structure and finally fcc structure changes to hexagonal (hex) structure. Activation energy values of 3.636±0.137 and 1.579±0.005 eV correspond to the crystallization and structural transformation processes, respectively. From annealing temperature dependence of the film resistivity, it is determined that the first steep decrease of the resistivity corresponds to crystallization while the second one is primarily caused by structural transformation from