氘在钨铜复合材料中的渗透和滞留行为研究

对钨铜复合材料中的氢同位素渗透和滞留行为进行了研究,通过采用气体驱动渗透和热脱附谱测试获得了氘在钨及钨铜复合材料中的渗透率、扩散系数、溶解度及相关活化能数据,并对氘在钨铜复合材料中的渗透和滞留性能进行了分析。结果表明:1)氘在钨铜复合材料中的渗透率比在纯钨中大2～3个数量级;2)在钨铜复合材料中的扩散系数比在纯钨中大5～6个数量级;3)随着复合材料中铜的含量增加,氘的渗透率与扩散系数均呈现增大趋势;4)钨铜复合材料之间的相界面具有氘快扩散通道作用。氘在钨铜复合材料中的溶解度比起纯钨小很多,溶解激活能也更大,说明铜对氘在钨中的固溶可能具有减弱的作用,这与氘在钨铜复合材料中快速扩散的结论一致。在气相热充实验中,因为快速降温使钨铜复合材料中捕获的氘来不及释放,所以钨铜复合材料中氘的表观滞留量比纯钨高约1个数量级。     

Metal injection molding of W-Cu powders prepared by low energy ball milling

Low energy ball milled W/Cu powders were used for metal injection molding (MIM) in order to overcome the low powder volume fraction of MIM parts after debinding as well as the inherently poor sinterability of the W-Cu powder compacts. Ball milling was carried out using commercial fine W and Cu powders to form a powder mixture suitable for injection molding. W powders showed no change in either size or shape during the milling process, but the ductile Cu powders were easily deformed to a three-dimensional equiaxed shape, having a particle size comparable to that of W powders. This modification of powder characteristics by ball milling resulted in an improvement of the solid loading of roughly 58%, maintaining a high and uniform powder packing density in the feedstock. The densification behavior of W-Cu MIM parts is also discussed on the basis of the relationship between Cu composition and W particle size.     

Cu含量对纳米晶W-Cu复合粉末烧结行为的影响

研究了Cu含量对机械合金化纳米晶W—xCu(X=15,20,25)复合粉末烧结行为的影响,并考察了一种新型晶粒长大抑制剂对抑制W晶粒长大的作用,探讨了其作用机理。结果表明,Cu含量增加有利于烧结致密化,并减弱聚晶长大的趋势。纳米晶W—Cu粉末在1200-1250℃烧结30min后,致密度为97％～98％,对应的晶粒度约为300～500nm,其中1200℃烧结30min对应的晶粒尺寸约为300～350nm,明显低于国外1μm的晶粒度水平,新型晶粒长大抑制剂有望对W晶粒长大有明显的抑制效果。     

冷压成型方向对W-Cu电触头材料性能的影响

针对轴向、径向两种压制方向成型的W—Cu合金,采用烧结熔渗法制备W—Cu／Cu整体电触头材料,测定结合面的抗拉强度及W—Cu合金的电性能、显微组织和抗弯强度。结果表明,轴向压制产品烧结后的结合强度远大于径向压制产品烧结后的结合强度。W—Cu合金的物理性能也是轴向压制的比径向压制的好,但两种压制方法对材料的抗弯强度影响不大。     

钨粉粒度对电极用钨铜合金组织和性能的影响

钨粉粒度是影响钨铜合金组织和性能的主要因素之一,采用不同粒度(2.65 μm、4 μm、8 μm)的钨粉用熔渗法制备钨铜合金,通过性能检测和组织分析研究了钨粉粒度对该合金密度、硬度和电导率的影响.实验结果表明:钨粉粒度越细,钨铜合金的密度和硬度越大;但是由细钨粉制备的W-Cu合金闭孔较多,均匀性较差,电导率较小.钨粉粒度为4μm时所得产品综合性能最好,W-30Cu合金密度为14.44 g/cm3、硬度为HB 212、电导率为24.2 MS/m.W-20Cu合金密度为15.38 g/cm3,硬度为HB225,电导率为22.6 MS/m.     

钨铜合金的最新研究进展及其应用

综述了近年来国内外钨铜合金材料制备技术方面的主要进展，并介绍了最新研制成功的几种新型钨铜合金材料，如梯度钨铜材料、纳米钨铜材料等，以及钨铜合金在民用和军事工业上的主要应用，并简要地探讨了钨铜合金今后发展的主要动向和研究重点。     

钨铜合金薄板坯烧结行为研究

以常规工业级钨粉和铜粉作为原料，制备了厚度均匀、密度较高的钨铜薄板坯，并对该薄板坯的烧结行为进行了系统地研究。结果表明，钨铜两相的润湿性对烧结致密化过程起主导作用，它在各温区所引起的致密化因素各异，使致密度变化程度不同。研究发现，钨铜在高温液相烧结过程中的动力学特征，与非晶体粘性流动烧结理论相吻合。     

W-Cu(Mo-Cu)复合材料的研究进展

W-Cu或Mo-Cu两相复合材料具有较高的导热性和较低的热膨胀系数,在大功率器件中被视为一种很好的热沉材料。近年来,有关W-Cu或Mo-Cu作为电子热沉材料的研究在国内外已有一些报道。作者主要就近几年钨铜复合材料研究的几个主要热点问题进行综述报道。分析认为,梯度结构功能材料、纳米结构材料以及注射成形工艺在钨铜复合材料领域中的应用是当今钨铜电子材料发展的主要方向,同时对国内外最新研究进行了归纳总结,指出了今后发展的主要动向。     

CuW复合材料的超声波探伤研究(二)

本文承接第一部分，主要研究了在实际超声波检测过程中如何采用对比试块通过多次反射波法和垂直扫查法对材料进行评价的方法。结合检测实际，给出了实际检测的操作方法和评价方法以及相应的参考标准波形和典型的缺陷图形。     

Copper Alloys From Metal Oxide Precursors for High Conductivity Applications

Extrusion of oxide powders allows fabrication of thin-walled metal articles to produce controlled-geometry, low-density copper alloy architectures. Shapes formed with copper oxide powders mixed with alloying oxides are reduced and sintered to produce high relative densities in the thin walls. This technology has produced square-cell honeycomb extrusions, which are being characterized for heat sink applications. This effort is to determine the bulk properties of alloys produced by this type of thermo-chemical powder processing and to explain behavior based on the final chemistry and microstructure of the alloys. Compositions investigated include Cu, Cu-Ni, Cu-Ag, W-Cu, Cu-Invar, Cu-Al₂O₃, and Cu-Cr alloys. Alloys have been characterized for relative density, thermal conductivity, and grain size. Mechanical properties including tensile and yield strength and elongation were measured on Cu-Ni and Cu-Ag, and the results were analyzed based on porosity and composition of the alloys. Properties were compared to alloys made through conventional processing and powder metallurgy.