W-Cu梯度功能材料的设计、制备与评价

W-Cu梯度功能材料的高W含量侧具有低热膨胀率、高强度和耐热流冲蚀等特点,高Cu含量的另一侧具有高导热性能,而中间过渡层可使内部热应力获得良好的缓和;该材料作为热沉材料、面向等离子体材料以及触头材料等的应用具有非常大的发展潜力,其研究受到广泛的重视。本文作者对W-Cu梯度材料的研究进展进行综合评述,介绍了W-Cu梯度功能材料的设计、制备及评价方法;根据其工作环境,着重对W-Cu梯度功能材料的致密性,热膨胀,热导率,热损蚀和热冲击等性能进行评价,并对W-Cu梯度功能材料的进一步发展作了展望。     

改善钨渗铜喉衬的高温尺寸稳定性研究

某新型号固体火箭发动机的钨渗铜喉衬试车后发生了直径收缩，通过对钨渗铜材料的金相组织，断口形貌，工艺制度以及成分分析发现引起喉衬收缩的原因；一是钨渗铜材料的钨骨架在试车点火时产生的二次烧结收缩；二是材料的高温强度不足，点火试车过程的喉衬沿轴向伸长，相应以径向收缩来补偿体积变化，提出了改善钨－铜材料高温尺寸稳定性的途径并在后续发动机试车实验中获得了成功。     

W骨架连接度对W-Cu复合材料耐电弧烧蚀性能的影响

采用不同的W粉原料制备出W骨架连接度不同的W-Cu复合材料。利用电击穿设备测试了其耐电弧烧蚀性能,并观察了多次击穿后的烧蚀形貌。试验结果表明:高的W骨架连接度可以增加对液相Cu的虹吸作用,减少Cu相的喷溅,并通过大量Cu相的气化降低W骨架的温度,进而减少W骨架的熔化和材料的整体烧蚀量。     

Effect of heat-treatment on the nanostructural change of W-Cu powder prepared by mechanical alloying

W-30wt.%Cu powder prepared by mechanical alloying (MA) was annealed at various temperatures to investigate the structural change of MA W-Cu powder. From differential scanning calorimeter analysis and transmission electron microscope observation, it was revealed that the recovery of W in MA W-30wt.%Cu powder occurred at 700°C and the W grain started growing also at this temperature. The W grain had grown significantly after annealing at 900°C, and the Cu phase in the MA powder was found to act as liquid melt near 900°C. The microstructure of the sintered specimen was similar to that of the W-Cu alloy via liquid phase sintering. This microstructure, even at temperatures below Cu melting, was the new feature observed in the MA W-Cu powder. This suggests that such a microstructure is closely related to the inherent high diffusivity of the nanosized W crystallites as well as the liquid-like behavior of the Cu phase.     

深冷处理对W-Cu合金组织与性能的影响

对粉末冶金熔渗技术制备的不同成分的W-Cu合金在．196℃保温48h条件下进行深冷处理。采用X-射线衍射仪和透射电子显微镜分析了长时间深冷处理的现象与机理。结果表明,深冷处理后铜颗粒在钨基体上弥散析出,出现了短而粗的类马氏体组织。析出的细小弥散的铜颗粒阻碍晶粒粗化和位错移动,铜颗粒部分填充到材料微孔内,同时深冷处理过程中的体积收缩也使材料内的部分缺陷得到弥合(如空位、微孔等),从而使不同成分的W-Cu合金的硬度提高,密度增大,电导率降低。     

残余应力对W-Cu复合材料导热性能的影响

用熔渗法制备的W-Cu复合材料在小批量生产时，发现熔渗结束后样品的热导率数据分散不稳定，受熔渗时摆放位置的影响很大。将熔渗结束后的样品退火，采取不同的方式冷却。用X射线衍射法测量其残余应力，用热脉冲法测量其热导率，研究了残余应力对材料导热性能的影响。结果表明：随冷却速度的加快，残余应力值增大，热导率降低。钨和铜的热膨胀系数相差较大，从高温冷到室温时两相收缩程度不一样，冷却速度过快时，在界面处产生残余应力，使材料的热导率降低。分析了残余应力对材料导热性能的影响及机制。     

Spark plasma sintering on mechanically activated W-Cu powders

Mechanically activated W-Cu powders were sintered by a spark plasma sintering system (SPS) in order to develop a new process and improve the properties of the alloy. Properties such as density and hardness were measured. The microstructures of the sintered W-Cu alloy samples were observed by SEM (scanning electron microscope). The results show that spark plasma sintering can obviously lower the sintering temperature and increase the density of the alloy. This process can also improve the hardness of the alloy. SPS is an effective method to obtain W-Cu powders with high density and superior physical properties.     

The Characterization of W-Cu Composite Coating Prepared by Double-Glow Discharge

In this paper,a W-Cu composite coating was prepared on the Cu substrate through the double-glow discharge technology using a pure W plate as a target.In here argon gas was input into the chamber as the discharge and sputtering gas.The crystal composition and microstructure of W-Cu composite coating were examined by x-ray diffraction(XRD),scanning electron microscopy(SEM).The compose in the cross section was detected by energy dispersive spectrometer(EDS),the distribution of elements along the penetration thickness was then obtained.Then the friction coefficient,the polarization electrochemical corrosion test and the microhardness of W-Cu composite coating was measured.The results indicated that a thick and no-delaminated W-Cu composite coating could be prepared on the Cu substrate by the double-glow plasma technology.     

钨铜箔片表面电沉积铝工艺的研究

利用AlCl3+LiAlH4-四氢呋喃-苯体系有机电镀液在自制W90Cu10箔片上镀铝,成功获得了高质量的镀铝层,分析了AlCl3与LiAlH4的配比、电流密度和电镀时间对镀层微观形貌、物相组成及厚度的影响,并得出了这3种影响因素的最佳取值。分析结果表明:铝镀层呈现锥状颗粒生长特征,表面颗粒排列紧密,镀液中AlCl3相对于LiAlH4的含量越少,电流密度越大,则表面颗粒越粗大;电镀时间越长,镀层颗粒在(220)方向择优生长越突出;可通过控制电流密度和电镀时间来控制铝镀层厚度,但若电流密度过高或电镀时间过长,镀层易出现裂纹、枝晶等缺陷。     

W-Cu复合材料制备新技术与发展前景

W-Cu复合材料具有热膨胀系数低、导电性好、导热性好、高熔点、高硬度以及良好的抗电弧烧蚀性能,在机械加工、电气工程以及电子信息领域被广泛用作电极材料、电接触材料、电子封装材料及靶材等越来越受到国内外的关注。传统粉末冶金方法制备的W-Cu复合材料致密度低、组织结构粗大且均匀性差,严重影响材料性能。采用纳米复合新技术制备的W-Cu复合材料具有很大的技术优势:粉末纳米化使得粉末的烧结活化能大大降低,其烧结活化能在1 420℃时仅为42.1 kJ/mol和29.1 kJ/mol,远低于纯W相同温度范围内的587.9 kJ/mol,同时纳米复合使得W与Cu发生了固溶,从而使得复合粉末表现出良好的烧结活性。采用纳米复合制备的细晶W-Cu复合材料具有非常优异的综合性能,其原因在于经烧结后获得高的致密度和组织结构均匀细小。