Enhanced electron emission from phosphorus-doped diamond-cladsilicon field emitter arrays

Undoped and phosphorus (P)-doped diamond-clad Si field emitter arrays have been successfully fabricated using microwave plasma chemical vapor deposition (MPCVD) technology. The electron emission from the blunt diamond-clad microtips are much higher than those for the pure Si tips with sharp curvature due to a lower work function. Furthermore, the characteristics of emission current against applied voltage for the P-doped diamond-clad tips show superior emission at lower field to the undoped ones. After the examination of Auger electron spectroscopy (AES) and electrical characteristics of as-grown diamond, such a significant enhancement of the electron emission from the P-doped diamond-clad tips is attributed to a higher electron conductivity and defect densities     

Modified atmosphere packaging of a mixed prepared vegetable salad dish

The aim of this study was to design a modified atmosphere package for a mixed vegetable salad consisting of 75 g of cut carrot, 55 g of cut cucumber, 20 g of sliced garlic and 50 g of whole green pepper. Respiration data of all the components were combined with film permeability data to predict package atmospheres and design optimal packages for experimental testing for improved shelf-life of the produce. The optimal package avoided minimum O₂ and maximum CO₂ tolerance limits, and chilling injury temperatures for any component. A pouch form package made of 27 mm low density polyethylene developed a modified atmosphere of 2.0–2.1% O₂ and 5.5–5.7% CO₂, which was beneficial for all components and provided better quality retention than other test packages.     

A new alloy design concept for austenitic stainless steel with tungsten modification for bipolar plate application in PEMFC

The feasibility of a new alloy design concept utilizing the principle of ‘tungsten bronze effect’ is critically evaluated for the development of metallic bipolar plates for proton exchange membrane fuel cell (PEMFC). An austenitic stainless steel (ASS) is modified with W and La to improve the stability of the passive film in an acidic environment as well as to reduce the contact resistance by the tungsten bronze effect. The experimental ASS containing W and La was evaluated in a simulated PEMFC environment of H₃PO₄ and H₂SO₄ solutions at 80 °C, and the electrical property was evaluated by performing a contact resistance test. The test results show that the ASS modified with W and La has good passive film stability for corrosion resistance and low contact resistance. The X-ray photoelectron spectroscopy (XPS) analysis clearly suggests the possibility of the tungsten bronze effect from the change in valency state of W⁶⁺ to W⁵⁺ in the passive film formed on the modified ASS. The feasibility of a new alloy design concept utilizing the ‘tungsten bronze effect’ is well demonstrated; however, more study is highly required for the development of metallic bipolar plates of PEMFC.     

Synthesis and characterization of La2Ti2O7 employed for photocatalytic degradation of reactive red 22 dyestuff in aqueous solution

Perovskite structured La₂Ti₂O₇ catalyst prepared by polymerized complex method was characterized and examined the photocatalytic activity by decomposing an azo dyestuff, Reactive Red 22, in aqueous solutions under UV irradiation. La₂Ti₂O₇ powders prepared by polymerized complex method exhibit higher surface areas, better homogeneity and are more sensitive to solution than those prepared by solid-state method. The first derivatives of UV–vis DRS patterns confirmed the complete crystallization of La₂Ti₂O₇ sintered at temperatures higher than 900 °C. The effects of sintering temperature of catalyst and solution pH of photocatalytic reaction were studied. The photocatalytic decomposition of Reactive Red 22 per unit surface area was found to be higher for experiments using La₂Ti₂O₇ than using TiO₂. However, the electron–hole recombination was found to be more obvious for La₂Ti₂O₇ than for TiO₂ because the network of metal cations constructed within La₂Ti₂O₇ enhances the mobility of photogenerated electrons and holes.     

Planar circularly polarized microstrip antenna with a single feed

A novel circularly polarized (CP) microstrip antenna is introduced. The antenna is fed with a single coaxial probe and the structure is planar. The CP bandwidth is much larger than available single-probe microstrip antennas and the CP radiation quality is excellent over the entire upper hemisphere     

Reparable key distribution protocols for Internet environments

A new concept of reparable key distribution protocol is introduced in this paper. The merit of a reparable protocol is in that once all compromised keys have been replaced by secure keys, the protocol is secure. We show that the key distribution protocol of Lu et al. (1989), for Internet is not reparable. A reparable one is proposed instead     

A Temperature‐Controllable Microelectrode and Its Application to Protein Immobilization

This letter presents a smart integrated microfluidic device which can be applied to actively immobilize proteins on demand. The active component in the device is a temperature‐controllable microelectrode array with a smart polymer film, poly(N‐isopropylacrylamide) (PNIPAAm) which can be thermally switched between hydrophilic and hydrophobic states. It is integrated into a micro hot diaphragm having an integrated micro heater and temperature sensors on a 2‐micrometer‐thick silicon oxide/silicon nitride/silicon oxide (O/N/O) template. Only 36 mW is required to heat the large template area of 2 mm×16 mm to 40°C within 1 second. To relay the stimulus‐response activity to the microelectrode surface, the interface is modified with a smart polymer. For a model biomolecular affinity test, an anti‐6‐(2, 4‐dinitrophenyl) aminohexanoic acid (DNP) antibody protein immobilization on the microelectrodes is demonstrated by fluorescence patterns.     

Chopper stabilised ΠΔΣ analogue to digitalconversion

A chopper stabilised ΠΔΣ ADC architecture is proposed. A chopper stabilised version of ΠΔΣ ADC, which has identical performances to the regular ΠΔΣ ADC but is immune to low frequency noises such as DC offsets, can be obtained without adding hardware complexities     

Board-level reliability of Pb-free solder joints of TSOP and various CSPs

To evaluate various Pb-free solder systems for leaded package, thin small outline packages (TSOPs) and chip scale packages (CSPs) including leadframe CSP (LFCSP), fine pitch BGA (FBGA), and wafer level CSP (WLCSP) were characterized in terms of board level and mechanical solder joint reliability. For board level solder joint reliability test of TSOPs, daisy chain samples having pure-Sn were prepared and placed on daisy chain printed circuit board (PCB) with Pb-free solder pastes. For CSPs, the same composition of Pb-free solder balls and solder pastes were used for assembly of daisy chain PCB. The samples were subjected to temperature cycle (T/C) tests (-65/spl deg/C/spl sim/150/spl deg/C, -55/spl deg/C/spl sim/125/spl deg/C, 2 cycles/h). Solder joint lifetime was electrically monitored by resistance measurement and the metallurgical characteristics of solder joint were analyzed by microstructural observation on a cross-section sample. In addition, mechanical tests including shock test, variable frequency vibration test, and four point twisting test were carried out with daisy chain packages too. In order to compare the effect of Pb-free solders with those of Sn-Pb solder, Sn-Pb solder balls and solder paste were included. According to this paper, most Pb-free solder systems were compatible with the conventional Sn-Pb solder with respect to board level and mechanical solder joint reliability. For application of Pb-free solder to WLCSP, Cu diffusion barrier layer is required to block the excessive Cu diffusion, which induced Cu trace failure.