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排序方式: 共有979条查询结果,搜索用时 24 毫秒
1.
This paper concentrates on revealing the local deformation as a function of applied strain in a polymer coating supported by a plastically deforming and roughening metal substrate. To this end in-situ birefringence microscopy measurements have been executed. The measurements are performed in reflection and an alternative unwrapping scheme for the optical path difference is proposed. From the characterization of PET (polyethylene terephthalate) coated stainless steel it is concluded that strain localization appears below the macroscopic strain at yield and that the surface roughness of the substrate is the driving force of the localization.  相似文献   
2.
TiO_2 nanostructures with strong interfacial adhesion and diverse morphologies have been in-situ grown on Ti foil substrate through a multiple-step method based on conventional plasma electrolytic oxidation(PEO) technology, hydrothermal reaction and ion exchange process. The PEO process is critical to the formation of TiO_2 seeding layer for the nucleation of Na_2Ti_3O_7 and H_2Ti_3O_7 mediates that are strongly attached to the Ti foil. An ion exchange reaction can finally lead to the formation of H_2Ti_3O_7 nanostructures with diverse morphologies and the calcination process can turn the H_2Ti_3O_7 nanostructures into TiO_2 nanostructures with enhanced crystallinity. The morphology of the TiO_2 nanostructures including nanoparticles(NP), nanowhiskers(NWK), nanowires(NW) and nanosheets(NS) can be easily tailored by controlling the NaOH concentration and reaction time during hydrothermal process. The morphology, composition and optical properties of TiO_2 photocatalysts were analyzed using scanning electron microscope(SEM), X-ray diffraction(XRD), photoluminescence(PL) spectroscopy and UV–vis absorption spectrum. Photocatalytic tests indicate that the TiO_2 nanosheets calcined at 500?C show good crystallization and the best capability of decomposing organic pollutants. The decoration of Ag cocatalyst can further improve the photocatalytic performance of the TiO_2 nanosheets as a result of the enhanced charger separation efficiency. Cyclic photocatalytic test using TiO_2 nanostructures grown on Ti foil substrate demonstrates the superior stability in the photodegradation of organic pollutant, suggesting the promising potential of in-situ growth technology for industrial application.  相似文献   
3.
采用FLAC3D对地震动荷载作用下不同地应力状态的地下岩体硐室的动态特性进行了初步分析。分析结果表明,地震荷载作用下,硐室位移随地应力侧压系数的增加明显减小,地应力侧压系数λ<1时的硐室位移量值随侧压系数的变化幅度明显大于地应力侧压系数λ>1时的情况;当侧压系数λ<1,随剪切波入射角的变化,硐室测量点位移响应先增加后减小;而当侧压系数λ>1,随剪切波入射角的增加,硐室测点位移先减小后增加,同时随地应力侧压系数的增加有减小的趋势。  相似文献   
4.
本文介绍了用真空自耗电弧熔铸Cu-Nb合金的方法。采用X射线萤光光谱、扫描电镜、能谱、X射线衍射、定量金相及其它常规测试手段,对铸锭的成分、杂质污染、合金的相结构及组成进行了测试分析,并加以讨论。  相似文献   
5.
《Microelectronics Reliability》2014,54(9-10):1753-1757
Thermo Mechanical Cycle Lifetime (TMCL) test is a widely used test methodology for evaluating the reliability of solder joints in the microelectronics industry. The commonly used measurement techniques to monitor solder joint failures during the TMCL test are either event detector or data logger. In this study, TMCL test has been carried out on the same devices in parallel with both measurement techniques. The pros and cons of both techniques are compared. It is observed that the solder joint reliability results on the investigated samples by both techniques are comparable. The event detector can catch short intermittent events, while the data logger is able to capture the details of the solder joint degradation process. In applications for which performance is dependent on the transmission of signals with a frequency of several hundred megahertz or more, the event detector technique shall be used. In such cases the data logger technique may overestimate product lifetime. On the other hand, for some applications where the performance is less susceptible to intermittent solder joint interconnect interruption but more to the increase of the solder joint resistance, the data logger shall be used. In such cases the event detector technique may underestimate product lifetime. In conclusion depending on the end application of the device, the most suitable technique can be selected.  相似文献   
6.
《Microelectronics Reliability》2014,54(9-10):1661-1665
This paper describes the use of in-situ High Temperature Storage Life (HTSL) tests based on a four point resistance method to evaluate Cu wire interconnect reliability. Although the same set up was used in the past to monitor Au–Al ball bond degradation, a different approach was needed for this system. Using conventional statistical methods of failure probability distributions and a fixed failure criterion were found to be unsuitable in this case. Besides this, tests usually take very long until a sufficient percentage of the population have failed according to that criterion. A simple physical model was used to electrically quantify ball bond degradation due to the prevailing failure mechanism in a substantially smaller amount of test time. The method enabled the determination of activation energies for a number of moulding compounds and is extremely useful for a fast screening of such materials regarding their suitability for Cu wire.  相似文献   
7.
Magnesium alloys, while boasting light weight, suffer from a major drawback in their relatively low strength. Identifying the microstructural features that are most effective in strengthening is therefore a pressing challenge. Deformation twinning often mediates plastic yielding in magnesium alloys. Unfortunately, due to the complexity involved in the twinning mechanism and twin-precipitate interactions, the optimal precipitate morphology that can best impede twinning has yet to be singled out. Based on the understanding of twinning mechanism in magnesium alloys, here we propose that the lamellar precipitates or the network of plate-shaped precipitates are most effective in suppressing deformation twinning. This has been verified through quantitative in situ tests inside a transmission electron microscope on a series of magnesium alloys containing precipitates with different morphology. The insight gained is expected to have general implications for strengthening strategies and alloy design.  相似文献   
8.
利用SEM原位拉伸实验,研究了Ti555211合金具有初始双态组织的拉伸变形和断裂行为。结果表明:在拉伸载荷作用下,双态组织试样中滑移带优先出现在初生α相内(与拉伸轴呈45°),在裂纹扩展过程中,合金内滑移带的密度均随着载荷的增加逐渐增加,双态组织试样的断裂方式为微孔聚集型断裂。原位拉伸试样断口分析表明,韧性断裂是双态组织试样的主要断裂方式,双态组织试样断口没有明显剪切唇,存在小范围的剪切滑移造成的平坦面。SEM原位拉伸实验分析方法能够对该合金的变形和断裂行为进行实时跟踪,该方法的研究结果更加具有重大的理论价值和工程意义。  相似文献   
9.
微弧氧化熔融冷却成膜过程出现的裂纹将影响膜层的强韧性和磨损性能。本研究利用ZrO2自身的强韧性,原位合成具有自修复裂纹作用的ZrO2/MgO膜层,研究原位合成的ZrO2对膜层磨损性能的影响。结果表明,微弧氧化原位合成的ZrO2在高温放电通道发生相变产生体积膨胀使得氧化锆界面萌生微裂纹并阻碍裂纹尖端的裂纹扩展,从而实现了膜层裂纹的自修复。通过控制锆源含量实现了对膜层中ZrO2含量的调控,膜层中原位ZrO2含量为32%时,ZrO2/MgO膜层裂纹呈现细小分散化,裂纹密度较传统膜层下降63.4%,摩擦系数减小53.4%,磨损量降低66.7%。研究认为,原位合成的ZrO2在膜层制备过程实现裂纹自修复并有效降低摩擦系数和磨损量,改善ZrO2/MgO膜层表面磨损性能。  相似文献   
10.
激光熔覆陶瓷增强金属基复合涂层技术的研究进展   总被引:6,自引:3,他引:3  
高才  许斌 《表面技术》2008,37(4):63-66,75
讨论了激光熔覆外加陶瓷增强金属基复合涂层技术中外加陶瓷相与基体的界面问题及一般的解决方法,指出原位合成技术与激光熔覆技术结合可有效解决界面问题,从铁基、镍基等复合涂层的原位反应材料体系、反应机理分析、组织结构和性能的改善等几个方面,综述了激光熔覆原位自生陶瓷增强金属基复合涂层技术的研究进展,最后从微观反应机制和宏观实际应用2个角度提出了今后的研究方向:原位合成试验与热力学理论的互相补充与验证,及计算机数值模拟技术的应用.  相似文献   
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