Thermal behavior of silicon-copper micro vapor chamber for high power LEDs

Micro vapor chamber (MVC) for light emitting diodes (LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroforming copper (Cu) to fabricate three kinds of wick structures, which are star, radiation and parallel ones, and the substrate is silicon with thickness of 0.5 mm. Electroforming Cu on silicon to make micro wick structure was a critical step, the ampere-hour factor was used, and accordingly the electroforming time was predicted. The composition of electroforming solution and parameters of electroforming were optimized too. After charging and packaging, thermal behavior tests were carried out to study the heat dissipation performance of MVCs. When the input power was 8 W, the parallel wick structure reached the equivalent temperature of 69.0 °C in 226 s, while the others were higher than that. The experimental results prove that the wick structures have significant influence on the heat transfer capability of MVCs.     

微热管红外测温系统的设计

根据集成发光二极管(LED)的微热管尺寸小、温升快、温度梯度变化剧烈等特点,搭建了非接触式红外测温系统,以实现对其不同特征区域的温度测量。对该系统的信号采集与转换、误差分析与补偿、测温特性指标、以及微热管的热性能进行了研究。该系统通过LabVIEW编程软件实现红外传感器的电信号采集与温度转换;将不同温度的加热块作为等温体参考,对比热电偶与红外测温结果完成静态和动态测温特性分析,进而通过环境温度补偿方法修正LED辐射热引起的传感器漂移误差;最后基于线性拟合法完成传感器的校准。利用该测试系统在不同热负载下测试了微热管的热性能。结果显示:测温系统的准确度、重复性及线性度分别为1.2~1.5℃、1%和0.2%;时间常数T和响应时间t0.05分别约为15ms和30ms。该红外非接触测温系统能够减小传感元件对被测温度场的影响,具有测温精度高和热惰性小的特点,为微热管热性能评估提供了新的测量方法。     

机电学科工程训练体系与运行模式探索

本文针对“应用型”本科教育,阐述了对其概念、培养目标、培养方式及其特点的理解,总结徐州工程学院(筹)机电学科现行工程训练体系及运行模式的优缺点,构建了新型应用型本科工程训练体系与运行模式。     

Experimental study on high-power LEDs integrated with micro heat pipe

Micro heat pipe (MHP) is applied to implement the efficient heat transfer of light emitting diode (LED) device. The fabrication of MHP is based on micro-electro-mechanical-system (MEMS) technique, 15 micro grooves were etched on one side of silicon (Si) substrate, which was then packaged with aluminum heat sink to form an MHP. On the other side of Si substrate, three LED chips were fixed by die bonding. Then experiments were performed to study the thermal performance of this LED device. The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power, the optimum filling ratio changes from 30% to 48%, and the time reaching stable state is reduced; when the input power is equal to 2.5 W, only the LED device with filling ratio of 48% can work normally. So integrating MHP into high-power LED device can implement the effective control of junction temperature.