The serious warpage issues of ultrathin chip-on-flex (UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly. 相似文献
It is increasingly crucial for flexible electronics to efficiently and reliably peel large-area, ultra-thin flexible films off from rigid substrate serving as substrates of flexible electronics device, especially in industrial production. This paper experimentally investigated the mechanism and technologic characteristics of laser lift-off(LLO) process of ultra-thin(～ 2 μm) polyimide(PI)film. It was found increasingly difficult to obtain desirable ultra-thin PI film by LLO with the decrease of the film thickness. The optimal process parameters were achieved considering laser fluence and accumulated irradiation times(AIT), which were found to be strongly correlative to the thickness of PI film. The process mechanism of LLO of PI film was disclosed that laser ablation of interfacial PI will result in the formation of gas products between the PI and glass substrate, enabling the change of interface microstructures to reduce the interface bond strength. The amount of gas products mainly determines the result of LLO process for ultra-thin PI film, from residual adhesion to wrinkles or cracking. The strategy of multi-scanning based on multiple irradiations of low-energy laser pulses was presented to effectively achieve a reliable LLO process of ultra-thin PI film. This study provides an attractive route to optimize the LLO process for large-scale production of ultra-thin flexible electronics. 相似文献
Visual tracking and grasping of moving object is a challenging task in the field of robotic manipulation, which also has great potential in applications such as human-robot collaboration. Based on the particle filtering framework and position-based visual servoing, this paper proposes a new method for visual tracking and grasping of randomly moving objects. A geometric particle filter tracker is established for visual tracking. In order to deal with the tracking efficiency issue for particle filter, edge detection and morphological dilation are employed to reduce the computation burden of geometric particle filtering. Meanwhile, the HSV image feature is employed instead of the grayscale feature to improve the tracking algorithm's robustness to illumination change.A grasping strategy combining tracking and interception is adopted along with the position-based visual servoing(PBVS)method to achieve stable grasp of the target. Comprehensive comparisons on open source dataset and a large number of experiments on real robot system are conducted, which demonstrate the proposed method has competitive performance in random moving object tracking and grasping. 相似文献
The conventional electronic systems enabled by rigid electronic are prone to malfunction under deformation, greatly limiting their application prospects. As an emerging platform for applications in healthcare monitoring and human-machine interface (HMI), flexible electronics have attracted growing attention due to its remarkable advantages, such as stretchability, flexibility, conformability, and wearing comfort. However, to realize the overall electronic systems, rigid components are also required for functions such as signal acquisition and transmission. Therefore, flexible hybrid electronics (FHE), which simultaneously possesses the desirable flexibility and enables the integration of rigid components for functionality, has been emerging as a promising strategy. This paper reviews the enabling integration techniques for FHE, including technologies for two-dimensional/three-dimensional (2D/3D) interconnects, bonding of rigid integrated circuit (IC) chips to soft substrate, stress-isolation structures, and representative applications of FHE. In addition, future challenges and opportunities involved in FHE-based systems are also discussed.
Almost all conventional open-loop particle image velocimetry(PIV) methods employ fixed-interval-time optical imaging technology and the time-consuming cross-correlation-based PIV measurement algorithm to calculate the velocity field.In this study,a novel real-time adaptive particle image velocity(RTA-PIV) method is proposed to accurately measure the instantaneous velocity field of an unsteady flow field.In the proposed closed-loop RTA-PIV method,a new correlation-filter-based PIV measurement alg... 相似文献
This paper presents an approach to find feasible and practical plans for mechanical assemblies based on a connector-based structure (CBS) hierarchy. The basic idea of the approach is to construct plans for an assembly (i.e. the root node of the CBS hierarchy) by systematically merging plans for primitive structures in the CBS hierarchy, while the plans for primitive structures are built using one of three methods: by reusing the existing plans, by retrieving the stored plans, and by geometric reasoning. The input to the approach consists of the assembly solid model, the connector-based relational model (CBRM) graph, the spatial constraint graphs, and the selected base part for the assembly, all of which are assumed to be generated previously in an interactive and/or automated way. Then, a CBS hierarchy for the assembly is automatically derived from the input CBRM by firstly establishing its functional model, which is constructed from the CBRM by decomposing the assembly or resulted part sets with respect to their connectors. Based on the CBS hierarchy, a set of assembly precedence diagrams representing good plans for the assembly are generated by merging plans for primitive structures systematically in a bottom-up manner. It can be proved that the proposed approach is both correct and complete. To verify the validness and efficiency of the approach, a variety of assemblies including some complicated products from industry are tested in the experimental CBHAP planner. 相似文献
Flexible electronics such as mechanically compliant displays, sensors and solar cells, have important applications in the fields of energy, national defence and biomedicine, etc. Various types of flexible electronics have been proposed or developed by the improvements in structural designs, material properties and device integrations. However, the manufacturing of flexible electronics receives little attention, which limits its mass production and industrialization. The increasing demands on the size, functionality, resolution ratio and reliability of flexible electronics bring several significant challenges in their manufacturing processes. This work aims to report the state-of-art technologies and applications of flexible electronics manufacturing. Three key technologies including electrohydrodynamic direct-writing, flip chip and automatic optical inspection are highlighted. The mechanism and developments of these technologies are discussed in detail. Based on these technologies, the present work develops three kinds of manufacturing equipment, i.e., inkjet printing manufacturing equipment, robotized additive manufacturing equipment, and roll-to-roll manufacturing equipment. The advanced manufacturing processes, equipment and systems for flexible electronics pave the way for applications of new displays, smart sensing skins and epidermal electronics, etc. By reviewing the developments of flexible electronics manufacturing technology and equipment, it can be found that the existing advances greatly promote the applications and commercialization of flexible electronics. Since flexible electronics manufacturing contains many multi-disciplinary problems, the current investigations are confronted with great challenges. Therefore, further developments of the reviewed manufacturing technology and equipment are necessary to break the current limitations of manufacturing resolution, efficiency and reliability.
