进一步提高我国分子束外延技术的探讨

进一步提高我国分子束外延技术的探讨孔梅影，梁基本，曾一平（中国科学院半导体研究所北京１０００８３）十多年来，我国的分子束外延（ＭＢＥ）技术从无到有，并不断改进提高，取得很大的进展。在中国科学院一些单位的共同努力下，我国先后发展了Ⅰ、Ⅱ、Ⅲ、Ⅳ四种型号...     

分子束外延低温生长GaAs缓冲层及性能研究

用国产分子束外延设备(Ⅳ型),在低温(200—300℃)下生长了GaAs,AlGaAs和GaAs-AlGAs超晶格。本文着重提出对在低温生长GaAs缓冲层上生长优质GaAs有源层,尤其对缺陷和杂质很敏感的高电子迁移率晶体管结构材料进行研究。     

前言

<正>随着光子技术在光纤通信、微波光子学、激光雷达、量子信息处理等领域的广泛应用,光子和光电子集成的重要性日益突显,成为解决相关应用面临的体积、功耗和成本瓶颈的关键。实际上,早在20世纪60年代就提出了集成光学的概念。受到集成电路(IC)技术的启发,提出了光子集成回路(PIC)和光电集成电路(OEIC)的概念,期望通过集成技术来增强光电子器件的性能,减小体积和功耗,并提高可靠性。然而,相比于集成电路芯片的迅猛发展,光子和光电子集成由于面临材料和工艺等一系列挑战,直到近十余年才实现突破。目前,大规模光子集成技术正在逐渐走向实用化。     

GSMBE生长掺杂Si及GeSi/Si合金及其电学性质研究

用气态源分子束外延法对Ｓｉ及ＧｅＳｉ／Ｓｉ合金进行了Ｎ、Ｐ型掺杂研究，结果表明，杂质在外延层中的掺入行为取决于生长过程中乙硅烷与相关掺杂气体的竞争吸附与脱附过程，所获得的Ｎ型及Ｐ型载流子浓度范围分别为１．５×１０１６～４．０×１０１９ｃｍ－３及１．０×１０１７～２．０×１０１９ｃｍ－３，基于对Ｎ型Ｓｉ外延材料中迁移率与杂质浓度、温度的关系，我们用Ｋｌａａｓｓｅｎ模型对实验结果进行拟合，分析了不同散射机制，特别是少数载流子电离散射对迁移率的影响．此外，样品的二次离子谱及扩展电阻分析表明，Ｎ、Ｐ型杂质浓度纵向     

分子束外延(MBE)Ⅲ-Ⅴ族材料及其器件应用的进展

随着分子束外延(MBE)生长环境清洁度的改善和生长工艺技术的改进,MBE GaAs 的纯度、AlGaAs/GaAs 异质结界面质量和外延层的性能等都有明显提高。MBEⅢ-Ⅴ族三元、四元合金(如 InGaAs、InAlAs、InGaAlP、InGaAsP…等)的研究也取得了重要进展。目前MBE 不仅已能生长出性能完全可和 LPE、VPE 相比或甚至更优的Ⅲ-Ⅴ族材料的微波器件和激光器件、更为引人注目的是它在超晶格、量子阱和调制掺杂异质结二维电子气等方面的研究,制备出了越来越多的,用其它方法不能制备的,性能优异的新型器件。MBE 所取得的成就,充分表明它是发展下一代半导体微结构器件的关键技术。     

瞬态C-V法测量AlGaAs:Si中DX中心的电离能(英文)

The thermal ionization energy ET of DX centers in AlxGa1-xAs and its dependence with the value of x and the pressure are very important for estab- lishing the model of DX centers. The conventional DLTS and Hall methods used to DX center measurement have some ambiguities in theoretical analysis and experiments and the values of ET determined are different with those methods. The new constant temperature transient C-V measurement is based on the fact that at low temperature both electron capture and emission rates of DX centers are very slow. During the transient C-V measurement, change; of bias voltages and capacitance measurements are completed in a time duration much shorter than the electron capture and emission time constants, therefore the electrons occupied on the DX centers are considered to be frozen. The density of DX centers, the distribution profile of electrons on DX centers in the depletion region of a Schottky diode at a constant reverse bias, and the density of free electrons in conduction band in the bulk and their temperature dependence have been measured.     

分子束外延高性能P型GaAs单晶薄膜

用国产分子束外延设备生长出性能优良、表面平整光洁的GaAs。不掺杂的P型GaAs空穴浓度为 2-8×10~(14)cm~(-3),室温迁移率为360-400cm~2/V·s.使用国产材料,纯度为 2N5并经我们“提纯”的 Be作为 P型掺杂剂.掺 Be的 P型GaAs空穴浓度范围从1.0 × 10~(15)至6×10~(15)cm~(-3).其室温迁移率与空穴浓度的关系曲线与国外文献的经验曲线相符.当空穴浓度为1—2 ×10~(15)cm~(-3)时,室温迁移率达 400cm~2/V·s.低温(77K)迁移率为 3500—7000cm~2/V·s.在4.2K下对不同空穴浓度的P型GaAs样品进行了光荣光测量和分析.     

AlGaAs:Si中与DX中心有关的光生电子陷阱特性研究(英文)

A new electron trap state SD was found by DLTS measurement under light illumination in Si doped A.lxGa1-xAs. This new trap energy level ESD is shallower than the DX center energy in the gap and the concentration of SD is comparable to that of DX centers. The emission activation energy Ec=0.20±0.05eV and capture activation energy Ec= 0.17±0.05eV. The SD DLTS peak has never been detected previously because under dark and thermal equilibrium condition most of the electrons occupy the deeper DX states and most of SD states are empty. However, when the sample is illuminated by light, electrons are excited to the conduction band and then re-captured by SD since the deeper DX states have a slower electron capture rate, thus a new DLTS peak corresponding to SD appears. Constant temperature capacitance transient C-t and transient C-V measurements were also used to further confirm the existence of SD states.