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排序方式: 共有2202条查询结果,搜索用时 31 毫秒
1.
Tsuneaki Matsudaira Masashi Wada Naoki Kawashima Miyuki Takeuchi Daisaku Yokoe Takeharu Kato Masasuke Takata Satoshi Kitaoka 《Journal of the European Ceramic Society》2021,41(5):3150-3160
Mass transfer in polycrystalline Yb2SiO5 wafers with precise composition control was evaluated and analyzed by oxygen permeation experiments at high temperatures using an oxygen tracer. Oxygen permeation proceeded due to mutual grain boundary diffusion of oxide ions and Yb ions without synergistic effects such as acceleration or suppression. The oxygen shielding properties of Yb2SiO5 were compared with those of the other line compounds such as Yb2Si2O7 and Al2O3 based on the determined mass transfer parameters. It was found that the more preferentially an oxide ion diffuses in the grain boundary compared to the interior of the grain, the greater the effect of suppressing the movement of the oxide ion by applying an oxygen potential gradient becomes. 相似文献
2.
Nayve R. Fujii M. Fukugawa A. Takeuchi T. Murata M. Yamada Y. Koyanagi M. 《Journal of microelectromechanical systems》2004,13(5):814-821
This paper describes the fabrication and characterization of a thermal ink jet (TIJ) printhead suitable for high speed and high-quality printing. The printhead has been fabricated by dicing the bonded wafer, which consists of a bubble generating heater plate and a Si channel plate. The Si channel plate consists of an ink chamber and an ink inlet formed by KOH etching, and a nozzle formed by inductively couple plasma reactive ion etching (ICP RIE). The nozzle formed by RIE has squeezed structures, which contribute to high-energy efficiency of drop ejector and, therefore, successful ejection of small ink drop. The nozzle also has a dome-like structure called channel pit, which contributes to high jetting frequency and high-energy efficiency. These two wafers are directly bonded using electrostatic bonding of full-cured polyimide to Si. The adhesive-less bonding provided an ideal shaped small nozzle orifice. Use of the same material (Si substrate) in heater plate and channel plate enables the fabrication of high precision long printhead because no displacement and delamination occur, which are caused by the difference in thermal expansion coefficient between the plates. With these technologies, we have fabricated a 1" long printhead with 832 nozzles having 800 dots per inch (dpi) resolution and a 4 pl. ink drop volume. 相似文献
3.
The three-dimensional morphology of polyethylene single crystals grown from dilute solution has been examined by atomic force microscopy. Single crystals were deposited on a soft ground of aqueous solution of poly(vinyl alcohol) (PVA) to avoid the collapse of thin lamellar crystals with thickness of 10 nm. The observation of single crystals on dried PVA clarifies the morphology of a chair type crystal as well as well-known hollow pyramidal type. It has been confirmed that the screw dislocations in the chair type follow a selection rule of the handedness in a manner to relieve the distortion in the chair type. 相似文献
4.
A 4*4 directional coupler switch matrix is developed which uses, for the first time, the quantum confined Stark effect of InGaAlAs/InAlAs multiquantum well structures. The rearrangeable nonblocking 4*4 network with six 2*2 switches is shown to be perfectly functional with switching voltages between 5 and 6 V and crosstalk below -17 dB in all the operation states.<> 相似文献
5.
Water-soluble chitin was successfully crosslinked to varying extents with glutaraldehyde in homogeneous aqueous solutions to improve the properties as an adsorbent for metal cations, and the effects of crosslinking were discussed. Complete insolubilization was achieved with the fivefold excess aldehyde, but, in terms of adsorptivity of Cu2+, the chitin crosslinked at an aldehyde/amino group ratio of 1.0 was found to exhibit remarkable capacity and was much superior to others. The desorption of Cu2+ from the adsorption complex was also attained effectively at pH 2.0. These results indicated that the loose crosslinking was quite simple and efficient to produce high capacity adsorbents for practical use. Thermal behavior of the crosslinked chitin was examined by TMA and TGA; a softening phenomenon was observed at 145°C. 相似文献
6.
Tatsuo Inoue Nobutada Ohno Akihiko Suzuki Toshihide Igari 《Nuclear Engineering and Design》1989,114(3)
Uniaxial tests to identify plasticity-creep interaction in
steel at 600°C were carried out as the Benchmark Project by the Subcommittee on Inelastic Analysis and Life Prediction, JSMS. The purpose of this paper is to present recent experimental data and predictions of constitutive models obtained in the project. Ten types of constitutive models were utilized to compare analytical predictions to sixteen benchmark experiments which are grouped into four categories: (I) tensile and creep tests under monotonic loading, (II) mixed mode tests under plastic and creep loading, (III) ratcheting deformation tests under program loads, and (IV) cyclic deformation tests under the combination of different strain rates. The benchmark tests in Group IV are used to estimate the creep-fatigue life of
steel; the results will be published in a separate paper. 相似文献
7.
Xin Sun Qiang Lu Moroz V. Takeuchi H. Gebara G. Wetzel J. Shuji Ikeda Changhwan Shin Tsu-Jae King Liu 《Electron Device Letters, IEEE》2008,29(5):491-493
A tri-gate bulk MOSFET design utilizing a low-aspect-ratio channel is proposed to provide an evolutionary pathway for CMOS scaling to the end of the roadmap. 3-D device simulations indicate that this design offers the advantages of a multi-gate FET (reduced variability in performance and improved scalability) together with the advantages of a conventional planar MOSFET (low substrate cost and capability for dynamic threshold-voltage control). 相似文献
8.
Akira Watanabe Yoshimitsu Takeuchi Goji Saeki 《Journal of the American Ceramic Society》1985,68(11):308-C
The length of potassium titanate fibers produced by several conventional methods averages 50 μm, with a maximum of 100 μm. Extremely long fibers (most >1000 μm long) were obtained by calcination in N2 gas flowing at 5.2×10-4 m/s. 相似文献
9.
Iida M. Kuroda N. Otsuka H. Hirose M. Yamasaki Y. Ohta K. Shimakawa K. Nakabayashi T. Yamauchi H. Sano T. Gyohten T. Maruta M. Yamazaki A. Morishita F. Dosaka K. Takeuchi M. Arimoto K. 《Solid-State Circuits, IEEE Journal of》2005,40(11):2296-2304
A 16 Mb embedded DRAM macro in a fully CMOS logic compatible 90 nm process with a low noise core architecture and a high-accuracy post-fabrication tuning scheme has been developed. Based on the proposed techniques, 61% improvement of the sensing accuracy is realized. Even with the smallest 5 fF/cell capacitance, a 322 MHz random-cycle access while 32 ms data retention time which contributes to save the data retention power down to 60 /spl mu/W are achieved. 相似文献
10.
T. Takeuchi T. Sasaki M. Hayashi K. Hamamoto K. Makita K. Taguchi K. Komatsu 《Photonics Technology Letters, IEEE》1996,8(3):361-363
A transceiver PIC consisting of a DFB-LD, a receiver PD and a Y-shaped branch waveguides is realized by in-plane bandgap energy controlled selective MOVPE. Both active and passive core layers are formed in one step selective growth, and complicated fabrication procedure is no longer required. More than 1 mW fiber coupled power and 7 GHz receiver bandwidth are obtained. The modulation and detection operations at 500 Mb/s are successfully demonstrated. 相似文献