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1.
分析了千兆以太网体系结构,给出了符合IEEE 802.3z标准中1000BASE-X规范的发送器电路结构,并采用TSMC 0.25 μm CMOS 混合信号工艺设计了符合该规范的高速复接电路和锁相环时钟倍频电路.芯片核心电路面积分别为(0.3×0.26)mm2和(0.22×0.12)mm2.工作电压2.5 V时,芯片核心电路功耗分别为120 mW和100 mW.时钟倍频电路的10倍频输出时钟信号频率为1.25 GHz,其偏离中心频率1MHz处的单边带相位噪声仅为-109.7 dBc/Hz.在驱动50 Ω输出负载的条件下,1.25 Gbit/s的高速输出数据信号摆幅可达到410 mV. 相似文献
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The Bisphosphonate Clodronate Modifying Hydroxyapatite Bioceramics for Bone Scaffold 总被引:3,自引:0,他引:3
LUO En HU Jing WEI Shicheng HE Gang XIAO Lin ZHAO Qiang 《武汉理工大学学报(材料科学英文版)》2005,20(B12):98-101
To investigate the efficiency of clodronate modifying HA bioceramics,and to evaluate the effect of clodronate modifying HA bioceramics on the cells in vitro,clodronate modified the porous HA bioceramics for bone scaffold by chelation .The outermost layer of the specimens was analyzd by XPS and FI-IR ,The depth profile was investigated by the argon-ion sputtering method.The cell culture test was conducted using MC3T3-E1 osteoblastic cells,The cells were inoculated and cultured on the scaffolds.Morphological observation of the cells,MTT test and ALP activity test evaluated the cell attachment ,proliferation and activity on the scaffolds.The cell culture test in cell quantity and morphology indicated active proliferation of the cells on the scaffolds.The ALP activity of the cells cultured for 3d and 7d on clodronate-HA bioceramics was slightly higher than that on HA bioceramics ,but the difference was not signifcant,This result indicated that clodronate-HA bioeramics had favorable cytocompatibility to be used as bone scaffold with potential ability to improve asteogensis. 相似文献
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In order to develop highly efficient upconversion (UC) material, Er3+-doped oxyfluoride glass ceramics containing BaYF5 nano-crystals were fabricated for the first time. The randomly distributed BaYF5 nano-particles with the size of nearly 25 nm precipitated from the glass matrix at about 700 °C, then tended to aggregate slightly with the increase of heating temperature, resulting in the enhancement of Er3+ UC emission in the wavelength ranging from 500 nm to 700 nm. The UC process was found very sensitive to Er3+ content: with the increase of Er3+ content from 0.5% to 1.0%, the UC intensity behaved with drastic exaltation; while further increasing Er3+ content to 2.0% resulted in a notable fluorescence quenching. Significantly, the UC efficiency of present glass ceramic preponderates notably over that of the previously reported glass ceramic containing LaF3, implying its superior UC potentiality. 相似文献
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An analytical model of the time-dependent currents of a plasma allows the determination of the physical mechanisms and dependencies of charging damage in Plasma Immersion Ion Implantation (PIII). From the model, we determine that the plasma requires several ms to equilibrate after the application of an implantation voltage pulse. Although the individual pulses only change the surface potential by a fraction of a volt, the long equilibration time means that the pulse repetition rate perturbs the time-averaged surface potential. A physical relation describing the dependence of the time-averaged surface potential on plasma and voltage bias parameters predicts that a shorter pulse width, lower electron temperature, and rectangular pulse shape maximizes the allowable implantation rate and minimizes the charging damage. For a given pulse shape and plasma condition, a maximum pulse repetition rate exists. Beyond this threshold frequency, the oxide fails because the oxide field exceeds its breakdown value. Experimental results corroborate the simulation's predictions, showing the dependence of the pulsing repetition rate on charging damage 相似文献
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