Bulk and Surface Properties of Liquid Al-Li and Li-Zn Alloys

Physicochemical properties like density, surface tension, and viscosity of liquid binary Al-Li and Li-Zn alloys have been measured using draining crucible method. The experimentally measured surface-tension values have been compared to theoretical results based either on the Butler model or the compound formation model assuming the existence of the most favored A ₁ B ₂ and A ₂ B ₃ clusters. Several models for viscosity calculation have been also applied and discussed in confrontation with measured data. Finally, the clustering effects in the liquid Al-Li and Li-Zn alloys have been examined using two microscopic functions, i.e., the concentration fluctuation function in the long-wavelength limit and the Warren-Cowley short-range order parameter.     

Physicochemical Properties of Sb-Sn-Zn Alloys

In this work, liquid Sb-Sn-Zn alloys were studied to determine their density, viscosity, and surface tension using the discharge crucible method. The measurements were carried out for alloy compositions having X _Sn/X _Sb ratio of 1, 3, 4, and 9 and Zn content X _Zn of 0.05, 0.1, 0.2, and 0.7 in the temperature range from 550 K to 1050 K. The effect of the Zn concentration in the Sb-Sn-Zn alloys on their density, viscosity, and surface tension was observed. Over a wide temperature range, the viscosity and surface tension increased with increasing Zn content in the alloy, while the density decreased. The experimental results obtained for surface tension and viscosity were compared with the results of the Butler model for surface tension and with the Moelwyn-Hughes, Sichen–Boygen–Seetharaman, Seetharaman–Sichen, Kozlov–Romanov–Petrov, and Kaptay models for viscosity.     

Soldering of Mg Joints Using Zn-Al Solders

Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.     

Interfacial Phenomena in Al/Al,Al/Cu,and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions

The studies of soldered joints were carried out in systems: Al/solder/Al, Al/solder/Cu, Cu/solder/Cu, where the solder was (Al-Zn)_EUT, (Al-Zn)_EUT with 0.5, 1.0, and 1.5 at.% of Ag and (Al-Zn)_EUT with 0.5, 1.0, and 1.5 at.% of Cu addition. Brazing was performed at 500 °C for 3 min. The EDS analysis indicated that the composition of the layers starting from the Cu pad was CuZn, Cu5Zn8, and CuZn4, respectively. Wetting tests were performed at 500 °C for 3, 8, 15, and 30 min, respectively. Thickness of the layers and their kinetics of growth were measured based on the SEM micrographs. The formation of interlayers was not observed from the side of Al pads. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed.     

Thermal Expansion,Electrical Resistivity,and Spreading Area of Sn-Zn-In Alloys

Thermal expansion and electrical resistivity of alloys based on Sn-Zn eutectic with 0.5, 1.0, 1.5, and 4.0 wt.% additions of In were studied. Thermal expansion measurements were performed using thermomechanical analysis tester over 223-373 K temperature range. Electrical resistivity measurements were performed with four-probe method over 298-423 K temperature range. The electrical resistivity of alloys increases linearly with temperature and concentration of In; also coefficient of thermal expansion of the studied alloys increases with In concentration. Scanning electron microscopy revealed simple eutectic microstructure with In dissolved in Sn-rich matrix. The results obtained were compared with the available literature data. Spreading tests on Cu of Sn-8.8Zn alloys with 0.5, 1.0, and 1.5 at.% of In were performed. Wetting tests were performed at 250 °C, by sessile drop method, by means of flux, and wetting times were 3, 8, 15, 30, and 60 min. In general, no clear effect of wetting time on spreading was observed.     

Curcumin and Weight Loss: Does It Work?

Obesity is a global health problem needing urgent research. Synthetic anti-obesity drugs show side effects and variable effectiveness. Thus, there is a tendency to use natural compounds for the management of obesity. There is a considerable body of knowledge, supported by rigorous experimental data, that natural polyphenols, including curcumin, can be an effective and safer alternative for managing obesity. Curcumin is a is an important compound present in Curcuma longa L. rhizome. It is a lipophilic molecule that rapidly permeates cell membrane. Curcumin has been used as a pharmacological traditional medicinal agent in Ayurvedic medicine for ∼6000 years. This plant metabolite doubtless effectiveness has been reported through increasingly detailed in vitro, in vivo and clinical trials. Regarding its biological effects, multiple health-promoting, disease-preventing and even treatment attributes have been remarkably highlighted. This review documents the status of research on anti-obesity mechanisms and evaluates the effectiveness of curcumin for management of obesity. It summarizes different mechanisms of anti-obesity action, associated with the enzymes, energy expenditure, adipocyte differentiation, lipid metabolism, gut microbiota and anti-inflammatory potential of curcumin. However, there is still a need for systematic and targeted clinical studies before curcumin can be used as the mainstream therapy for managing obesity.     

Wetting and Interfacial Chemistry of SnZnCu Alloys with Cu and Al Substrates

Wetting of Cu and Al pads by Sn-Zn eutectic-based alloys with 0.5, 1, and 1.5 wt.% of Cu was studied at 250 °C, in the presence of ALU33® flux, with wetting times of 15, 30, 60, and 180 s, respectively. With increasing wetting time the wetting angle decreases only slightly and the angles on Cu pads are higher than those on Al pads. Selected, solidified solder-pad couples were cross-sectioned and subjected to SEM-EDS study of the interfacial microstructure. The results revealed that the microstructure of the SnZnCu/Cu interface is much different from SnZnCu/Al interface. In the first case continuous interlayers are observed while in the latter case there is no interlayer but the alloy dissolves the substrate along grain boundaries.     

2-azaallylic rearrangement in homogeneous systems

In this work we present mechanism of the base-catalyzed 2-azaallylic rearrangement in homogeneous media. Detailed 2-azaallylic rearrangement studies have shown that tautomerism of derivatives of benzylidenebenzhydrylamines and N-fluorenylidenebenzylamines is not adequately encomposed by the Hammet equation and the equilibrium constant in the case of studied derivatives depends on the electronic as well as steric factors of the azaallylic system substituents. The presence of steric interactions which influence the equilibrium state has been additionally confirmed by means of crystallographic and molecular mechanics data as well as NOE studies. This revised version was published online in August 2006 with corrections to the Cover Date.     

Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

This work shows the effect on the soldering process of the addition of Ag and Cu to Sn–Zn alloys. Soldering of Al/Cu and Al/Al joints was performed for a time of 3?min, at a temperature of 250°C, with the use of flux. Aging was carried out at 170°C for Al/Cu and Al/Al joints for 1 and 10 days. During the aging process, intermetallic layers grew at the interface of the Al/Cu joint at the Cu substrate. Intermetallic layers were not observed during wetting of Al/Al joints. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed. The experiment was designed to demonstrate the effect of Ag and Cu addition on the dissolution of Al substrate during the soldering and aging processes. In the solder alloys, small precipitates of AgZn₃ and Cu₅Zn₈ were observed.