Ultrafast Electron–Phonon Coupling at Metal-Dielectric Interface

Energy transfer from photo-excited electrons in a metal thin film to the dielectric substrate is important for understanding the ultrafast heat transfer process across the two materials. Substantial research has been conducted to investigate heat transfer in a metal-dielectric structure. In this work, a two-temperature model in metal was used to analyze the interface electron and dielectric substrate coupling. An improved temperature and wavelength-dependent Drude–Lorentz model was implemented to interpret the signals obtained in optical measurements. Ultrafast pump-and-probe measurements on Au-Si samples were carried out, where the probe photon energy was chosen to be close to the interband transition threshold of gold to minimize the influence of non-equilibrium electrons on the optical response and maximize the thermal modulation to the optical reflectance. Electron-substrate interface thermal conductance at different pump laser fluences was obtained, and was found to increase with the interface temperature.     

Attribute Allocation and Retrieval Scheme for Large-Scale Sensor Networks

Wireless sensor network is an emerging technology that enables remote monitoring of large geographical regions. In this paper, we address the problem of distributing attributes over such a large-scale sensor network so that the cost of data retrieval is minimized. The proposed scheme is a data-centric storage scheme where the attributes are distributed over the network depending on the correlations between them. The problem addressed here is similar to the Allocation Problem of distributed databases. In this paper, we have defined the Allocation Problem in the context of sensor networks and have proposed a scheme for finding a good distribution of attributes to the sensor network. We also propose an architecture for query processing given such a distribution of attributes. We analytically determine the conditions under which the proposed architecture is beneficial and present simulation results to demonstrate the same. To the best of our knowledge, this is the first attempt to determine an allocation of attributes over a sensor network based on the correlations between attributes.     

Low temperature crystallographic data on Kevlar 49 fibres

Using X-ray diffraction data, the behaviour of Kevlar 49 fibres at low temperatures, up to –100°C, has been analysed. During cooling, the basal plane of the monoclinic unit cell shrinks whereas the c- (unique, chain axis) length is not significantly affected. In contrast, in the return heating cycle to ambient temperature, the basal plane expands and contraction occurs along the chain direction. The unit cell registers a reduction in volume in both the cooling and heating cycles. Conspicuously, after a cycle of cooling and heating, the unit cell does not return to its initial volume.     

Analysis of the mechanism of die soldering in aluminum die casting

A mechanism of soldering of an aluminum alloy die casting to a steel die is proposed. A soldering critical temperature is postulated, at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. The liquid joins the die with the casting upon solidification. The critical temperature is determined by the elements in both the casting alloy and the die material and is equal to the solidus temperature of the resulting alloy. The critical temperature is used to predict the onset of die soldering, and the local liquid fraction is related to the soldering tendency. Experiments have been carried out to validate the concept and to determine the critical temperature for die soldering in an iron-aluminum system. Thermodynamic calculations are used to determine the critical temperature and soldering tendency for the cases of pure aluminum and a 380 alloy in a steel mold. Factors affecting the soldering tendency are discussed, and methods for reducing die soldering are suggested.     

Reducing cycle times in manufacturing and supply chains by input and service rate smoothing

A key performance parameter of a manufacturing network or supply chain is its cycle time; the time that a typical item spends in the network. A previous simulation study on a semiconductor assembly and test facility showed that cycle times could be reduced by having smooth input and service rates. This suggested that there is a “cycle time principle” that, for a system with a specified throughput or input rate, the shortest cycle times are obtained when the input and service rates do not vary over time. We prove that this principle is true for the M/G/1 and M/M/s queueing systems and Jackson networks. The analysis involves establishing several results on the concavity of waiting time probabilities and the convexity of expected waiting times and queue lengths, as functions of input and service rates. These results also have natural uses in other optimization problems.     

A Low-Supply-Voltage CMOS Sub-Bandgap Reference

A low-power (21 $muhbox{W}$ ) bandgap reference source that is operable from a nominal supply voltage of 1.4 V is described. The circuit provides an output voltage equal to the bandgap voltage having a low output resistance and allows resistive loading. It does not use resistors or operational amplifiers. Thus, the design is suitable for fabrication in any digital CMOS technology. The circuit uses a current conveyor and current mirrors to convert the proportional to absolute temperature voltage into a current using a MOSFET. The current is converted back to a voltage by using the functional inverse of the FET $v-i$ characteristics. This makes the voltage gain linear and temperature independent. The absence of back-gate bias is the reason for achieving the low supply voltage of operation. Simulation results using the transistor models for the 0.18-$mu$m TSMC process show that the voltage-variation over the temperature range 0 to 100 $^{circ} {hbox {C}}$ is $≪$1 mV.      

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.     

A comparative thermodynamic study of sorption systems: second law analysis

As a consequence of the phasing out of CFCs, sorption systems appear to be potential candidates to replace vapour compression systems. Amongst sorption systems there exists a choice between several systems, such as liquid absorption, solid adsorption and chemical reaction heat pumps. Nevertheless, few comparative studies between these systems have been undertaken so far. It is the aim of this paper to present such a study based on combined first and second law thermodynamical analysis of the different cycles. Simple entropy generation processes explain why the basic cycles for these systems yield performances much lower than the Carnot efficiency. The possibility of operating regenerative cycles with internal heat recovery and higher efficiencies has also been considered for typical common base conditions. Different entropy generation considerations have been visualised, such as thermal coupling (external/internal), non-uniform temperature component entropy production and other irreversible processes for the COP degradation in these systems. It is found that thermal coupling irreversibilities in solid sorption systems and other internal irreversibilities in liquid sorption systems with solution heat exchanger are dominant in the actual COP degradation with respect to the reversible Carnot COP.     

Disaster recovery planning in an automated manufacturingenvironment

Disasters may strike at any moment in any location. When they do, no distinction is made about the type of firm that is being affected, whether it is a bank or a manufacturing plant. Most firms do not plan for possible disasters, and those that do have typically focused on computer and data contingency planning. In this paper, the focus is shifted to incorporate disaster recovery planning for manufacturing enterprises, especially those that are automated. Automated manufacturing enterprises have characteristics that put them at an increased risk to disasters. The methodological framework proposed in this paper will aid manufacturing organizations and their managers in reducing the risks associated with unanticipated disasters. The framework is termed the “Manufacturing Operations Recovery and Resumption” model. Recommended activities and tools for effective management of this methodology are identified